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11.
公开(公告)号:US11681616B2
公开(公告)日:2023-06-20
申请号:US17137942
申请日:2020-12-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chi Weon Yoon , Dong Hyuk Chae , Sang-Wan Nam , Jung-Yun Yun
CPC classification number: G06F12/0646 , G06F3/0619 , G06F3/0653 , G06F3/0679 , G11C5/025 , G11C8/10 , G11C11/5628 , G11C11/5642 , G11C16/0483 , G11C16/08 , G11C16/24 , G06F2212/2022 , G11C2211/5648
Abstract: At least one address scheduling method includes selecting a first bit line, selecting a first string connected to the first bit line, performing address scheduling on N pages of each of multi-level cells in the first string sequentially from a bottom word line to a top word line, and after completing the address scheduling on all word lines in the first string, performing address scheduling on second to k-th strings sequentially in the same manner as performed with respect to the first string, where “k” is 2 or a natural number greater than 2.
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公开(公告)号:US20230153000A1
公开(公告)日:2023-05-18
申请号:US18052285
申请日:2022-11-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: JAE-HOON CHOI , Sang-Wan Nam , Sangyong Yoon , Kookhyun Cho
IPC: G06F3/06
CPC classification number: G06F3/064 , G06F3/0604 , G06F3/0619 , G06F3/0679
Abstract: A memory package includes a printed circuit board, a first memory device that is stacked on the printed circuit board, and a second memory device stacked on the first memory device. The first memory device includes a first one-time programmable (OTP) block, the second memory device includes a second OTP block different from the first OTP block, and a horizontal distance from one side of the first memory device to the first OTP block is different from a horizontal distance from one side of the second memory device to the second OTP block.
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13.
公开(公告)号:US11594283B2
公开(公告)日:2023-02-28
申请号:US17523385
申请日:2021-11-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Won-Taeck Jung , Sang-Wan Nam , Jinwoo Park , Jaeyong Jeong
IPC: G11C16/16 , G11C16/20 , G11C16/08 , G11C16/34 , G11C16/04 , G11C16/10 , H01L27/11582 , H01L27/11524 , H01L27/1157 , H01L27/11556
Abstract: A three-dimensional (3D) nonvolatile memory device includes a cell string. The cell string includes a pillar structure comprising a ground selection transistor, a plurality of memory cells, and a string selection transistor stacked vertically over a substrate. The memory cells comprise a first cell group and a second cell group stacked on the first cell group, and a horizontal width of at least a portion of the pillar structure decreases in a depth direction towards the substrate. A method of programming the memory device includes initializing a channel of a memory cell of the first cell group of the cell string through the ground selection transistor of the pillar structure, and then applying a program voltage to the memory cell of the pillar structure of the cell string.
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公开(公告)号:US11495541B2
公开(公告)日:2022-11-08
申请号:US16592886
申请日:2019-10-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bongsoon Lim , Sang-Wan Nam , Sang-Won Park , Sang-Won Shim , Hongsoo Jeon , Yonghyuk Choi
IPC: H01L23/535 , H01L27/11573 , H01L27/11582
Abstract: A three-dimensional semiconductor memory device may include a first stack structure block including first stack structures arranged in a first direction on a substrate, a second stack structure block including second stack structures arranged in the first direction on the substrate, a separation structure disposed on the substrate between the first and second stack structure blocks and including first mold layers and second mold layers, and a contact plug penetrating the separation structure. A bottom surface of the contact plug may contact the substrate.
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公开(公告)号:US11322205B2
公开(公告)日:2022-05-03
申请号:US16823275
申请日:2020-03-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-Won Park , Sang-Wan Nam , Ji Yeon Shin , Won Bo Shim , Jung-Yun Yun , Ji Ho Cho , Sang Gi Hong
IPC: G11C16/10 , G11C16/04 , G11C16/24 , G11C16/08 , H01L27/11582 , H01L27/11556
Abstract: A method for programming a non-volatile memory device is provided. The method comprises applying a program word line voltage with a voltage level changed stepwise to a selected word line connected to a plurality of memory cells, and applying a program bit line voltage to a first bit line of a plurality of bit lines connected to a plurality of first memory cells, while the program word line voltage is applied to the selected word line. The program bit line voltage transitions from a first voltage level to one of a program inhibit voltage level, a program voltage level, and a second voltage level. The first and second voltage levels are between the program inhibit voltage level and program voltage level.
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公开(公告)号:US20210012840A1
公开(公告)日:2021-01-14
申请号:US17036387
申请日:2020-09-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Won-Bo Shim , Sang-Wan Nam , Ji-Ho Cho
Abstract: A nonvolatile memory device includes a memory cell region, a peripheral circuit region, a memory block in the memory cell region, a row decoder in the peripheral circuit region, and a control circuit in the peripheral circuit region. The memory cell region includes a first metal pad. The peripheral circuit region includes a second metal pad and is vertically connected to the memory cell region by the first metal pad and the second metal pad. The memory block includes memory cells stacked in a direction intersecting a substrate, and is divided into a plurality of sub-blocks configured to be erased independently. The row decoder selects the memory block by units of a sub-block. The control circuit receives a data erase command for a selected sub-block among the plurality of sub-blocks, performs a data read operation on at least one victim sub-block among the plurality of sub-blocks in response to the data erase command, selectively performs a soft program operation on the at least one victim sub-block based on a result of the data read operation, and performs a data erase operation on the selected sub-block after the data read operation is performed and the soft program operation is selectively performed.
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17.
公开(公告)号:US10804293B2
公开(公告)日:2020-10-13
申请号:US16440299
申请日:2019-06-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sang-Won Park , Sang-Wan Nam , Bong-Soon Lim
IPC: H01L27/11582 , G11C16/04 , G11C16/14 , G11C16/10 , G11C16/26 , H01L27/11573 , G06F3/06 , H01L27/1157 , H01L27/11565
Abstract: A nonvolatile memory device includes a semiconductor substrate including a page buffer region, a memory cell array, bitlines, first vertical conduction paths, and second vertical conduction paths. The memory cell array is formed in a memory cell region above the semiconductor substrate and includes memory cells. The bitlines extend in a column direction above the memory cell array. Each of bitlines is cut into each of first bitline segments and each of second bitline segments. The first vertical conduction paths extend in a vertical direction and penetrate a column-directional central region of the memory cell region. The first vertical conduction paths connect the first bitline segments and the page buffer region. The second vertical conduction paths extend in the vertical direction and penetrate the column-directional central region. The second vertical conduction paths connect the second bitline segments and the page buffer region.
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18.
公开(公告)号:US10803947B2
公开(公告)日:2020-10-13
申请号:US16801214
申请日:2020-02-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sang-Wan Nam , Won-Taeck Jung
Abstract: A nonvolatile memory device performs a read operation comprising first and second intervals. In the first interval the device applies a turn-on voltage to string selection lines and ground selection lines connected to the string selection transistors and the ground selection transistors, respectively. In the second interval, the device applies a turn-off voltage to unselected string selection lines and unselected ground selection lines while continuing to apply the turn-on voltage to a selected string selection line and a selected ground selection line. In both the first and second intervals, the device applies a first read voltage to a selected wordline connected to memory cells to be read by the read operation and applying a second read voltage to unselected wordlines among connected to memory cells not to be read by the read operation.
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公开(公告)号:US10777233B1
公开(公告)日:2020-09-15
申请号:US16590326
申请日:2019-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-Wan Nam , Euihyun Cheon , Byungjun Min
Abstract: A nonvolatile memory device includes a first memory block including a plurality of cell transistors interconnected with a plurality of ground selection lines, a plurality of word lines, and a plurality of string selection lines, which are stacked in a direction perpendicular to a substrate, a block selecting circuit that is connected with the plurality of ground selection lines, the plurality of word lines, and the plurality of string selection lines, and provides corresponding driving voltages to the plurality of ground selection lines, the plurality of word lines, and the plurality of string selection lines in response to a block selection signal, respectively, and a block unselecting circuit that is connected only with specific string selection lines of the plurality of string selection lines, and provides an off-voltage only to the specific string selection lines in response to a block un-selection signal.
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20.
公开(公告)号:US20200243144A1
公开(公告)日:2020-07-30
申请号:US16845387
申请日:2020-04-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Won-Bo Shim , Sang-Wan Nam , Ji-Ho Cho
Abstract: A method of operating a memory device includes performing a data read operation on at least one victim sub-block within a memory block containing a plurality of sub-blocks therein, in response to an erase command directed to a selected sub-block within the plurality of sub-blocks. Next, a soft program operation is performed on the at least one victim sub-block. This soft programming operation is then followed by an operation to erase the selected sub-block within the plurality of sub-blocks. This operation to erase the selected sub-block may include providing an erase voltage to a bulk region of a substrate on which the memory block extends, and the at least one victim sub-block may be disposed between the selected sub-block and the substrate.
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