公开(公告)号：US20160343695A1

公开(公告)日：2016-11-24

申请号：US15071573

申请日：2016-03-16

Applicant: MediaTek Inc.

Inventor： Tzu-Hung LIN ,  Ching-Wen HSIAO ,  I-Hsuan PENG

IPC: H01L25/16 ,  H01L23/532 ,  H01L23/31 ,  H01L23/522 ,  H01L21/78 ,  H01L25/00 ,  H01L21/768 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/528

CPC classification number: H01L25/16 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76879 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/53228 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/80 ,  H01L24/89 ,  H01L24/92 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02317 ,  H01L2224/02319 ,  H01L2224/02331 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/02379 ,  H01L2224/03002 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/08147 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/73259 ,  H01L2224/80003 ,  H01L2224/80006 ,  H01L2224/802 ,  H01L2224/8083 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/9202 ,  H01L2224/96 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1436 ,  H01L2924/18162 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/37001 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2224/80001

Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first semiconductor die. A first redistribution layer (RDL) structure is coupled to the first semiconductor die and includes a first conductive trace. The semiconductor package assembly also includes a second semiconductor package bonded to the first semiconductor package. The second semiconductor package includes a second semiconductor die. An active surface of the second semiconductor die faces an active surface of the first semiconductor die. A second RDL structure is coupled to the second semiconductor die and includes a second conductive trace. The first conductive trace is in direct contact with the second conductive trace.

Abstract translation: 提供半导体封装组件。 半导体封装组件包括第一半导体封装。 第一半导体封装包括第一半导体管芯。 第一再分配层（RDL）结构耦合到第一半导体管芯并且包括第一导电迹线。 半导体封装组件还包括结合到第一半导体封装的第二半导体封装。 第二半导体封装包括第二半导体管芯。 第二半导体管芯的有源表面面向第一半导体管芯的有效表面。 第二RDL结构耦合到第二半导体管芯并且包括第二导电迹线。 第一导电迹线与第二导电迹线直接接触。

公开(公告)号：US20170098628A1

公开(公告)日：2017-04-06

申请号：US15212125

申请日：2016-07-15

Applicant: MediaTek Inc.

Inventor： Nai-Wei LIU ,  Tzu-Hung LIN ,  I-Hsuan PENG ,  Ching-Wen HSIAO ,  Wei-Che HUANG

IPC: H01L25/065 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/49805 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/94 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/03011 ,  H01L2224/03502 ,  H01L2224/036 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/06136 ,  H01L2224/06146 ,  H01L2224/06156 ,  H01L2224/06166 ,  H01L2224/10126 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2224/17136 ,  H01L2224/17146 ,  H01L2224/17156 ,  H01L2224/17166 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/214 ,  H01L2924/00

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor body and a conductive structure disposed below the semiconductor body. The semiconductor package structure also includes an insulating layer surrounding the conductive structure. The semiconductor package structure further includes a redistribution layer structure coupled to the conductive structure. In addition, the semiconductor package structure includes a molding compound surrounding the semiconductor body. A portion of the molding compound extends between the redistribution layer structure and the semiconductor body.

公开(公告)号：US20170077073A1

公开(公告)日：2017-03-16

申请号：US15203418

申请日：2016-07-06

Applicant: MediaTek Inc.

Inventor： Tzu-Hung LIN ,  Chi-Chin LIEN ,  Nai-Wei LIU ,  I-Hsuan PENG ,  Ching-Wen HSIAO ,  Wei-Che HUANG

IPC: H01L25/10

CPC classification number: H01L25/105 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/5389 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first semiconductor package that includes a first semiconductor die having a first surface and a second surface opposite thereto. A first package substrate is disposed on the first surface of the first semiconductor die. A first molding compound surrounds the first semiconductor die and the first package substrate. A first redistribution layer (RDL) structure is disposed on the first molding compound, in which the first package substrate is interposed and electrically coupled between the first semiconductor die and the first RDL structure.

Abstract translation: 提供半导体封装结构。 半导体封装结构包括第一半导体封装，其包括具有第一表面和与其相对的第二表面的第一半导体管芯。 第一封装基板设置在第一半导体管芯的第一表面上。 第一模塑料包围第一半导体管芯和第一封装衬底。 第一再分布层（RDL）结构设置在第一模塑料上，其中插入第一封装衬底并电耦合在第一半导体管芯和第一RDL结构之间。

公开(公告)号：US20160343685A1

公开(公告)日：2016-11-24

申请号：US15071559

申请日：2016-03-16

Applicant: MediaTek Inc.

Inventor： Tzu-Hung LIN ,  Ching-Wen HSIAO ,  I-Hsuan PENG

IPC: H01L25/065 ,  H01L23/528 ,  H01L23/31 ,  H01L21/78 ,  H01L25/00 ,  H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L23/522 ,  H01L25/16

CPC classification number: H01L25/0652 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49811 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/96 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/221 ,  H01L2224/32145 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/8385 ,  H01L2224/9202 ,  H01L2224/96 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/37001 ,  H01L2924/014 ,  H01L2224/19

Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first semiconductor die. A first redistribution layer (RDL) structure is coupled to the first semiconductor die. The semiconductor package assembly also includes a second semiconductor package bonded to the first semiconductor package. The second semiconductor package includes a second semiconductor die. An active surface of the second semiconductor die faces an active surface of the first semiconductor die. A second RDL structure is coupled to the second semiconductor die. The first RDL structure is positioned between the first semiconductor die and the second RDL structure.

Abstract translation: 提供半导体封装组件。 半导体封装组件包括第一半导体封装。 第一半导体封装包括第一半导体管芯。 第一再分配层（RDL）结构耦合到第一半导体管芯。 半导体封装组件还包括结合到第一半导体封装的第二半导体封装。 第二半导体封装包括第二半导体管芯。 第二半导体管芯的有源表面面向第一半导体管芯的有效表面。 第二RDL结构耦合到第二半导体管芯。 第一RDL结构位于第一半导体管芯和第二RDL结构之间。

公开(公告)号：US20160329299A1

公开(公告)日：2016-11-10

申请号：US15130994

申请日：2016-04-17

Applicant: MediaTek Inc.

Inventor： Tzu-Hung LIN ,  I-Hsuan PENG ,  Nai-Wei LIU ,  Ching-Wen HSIAO ,  Wei-Che HUANG

IPC: H01L25/065 ,  H01L23/522 ,  H01L23/66 ,  H01L23/31

CPC classification number: H01L25/0652 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/5226 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/02331 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1421 ,  H01L2924/1435 ,  H01L2924/1438 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025

Abstract: A semiconductor package structure including a first semiconductor package is provided. The first semiconductor package includes a first semiconductor package including a first redistribution layer (RDL) structure having a first surface and a second surface opposite thereto. A first semiconductor die and a first molding compound that surrounds the first semiconductor die are disposed on the first surface of the first RDL structure. An IMD structure having a conductive layer with an antenna pattern or a conductive shielding layer is disposed on the first molding compound and the first semiconductor die.

Abstract translation: 提供了包括第一半导体封装的半导体封装结构。 第一半导体封装包括第一半导体封装，其包括具有第一表面和与其相反的第二表面的第一再分配层（RDL）结构。 围绕第一半导体管芯的第一半导体管芯和第一模塑料被设置在第一RDL结构的第一表面上。 具有天线图案或导电屏蔽层的导电层的IMD结构设置在第一模塑料和第一半导体芯片上。

公开(公告)号：US20160293581A1

公开(公告)日：2016-10-06

申请号：US15047980

申请日：2016-02-19

Applicant: MediaTek Inc.

Inventor： Tzu-Hung LIN ,  I-Hsuan PENG ,  Ching-Wen HSIAO

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H05K1/185 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package including a first semiconductor die. A first redistribution layer (RDL) structure is coupled to the first semiconductor die. The first redistribution layer (RDL) structure includes a first conductive trace disposed at a first layer-level. A second conductive trace is disposed at a second layer-level. A first inter-metal dielectric (IMD) layer and a second inter-metal dielectric (IMD) layer, which is beside the first inter-metal dielectric (IMD) layer, are disposed between the first conductive trace and the second conductive trace.

Abstract translation: 本发明提供一种半导体封装组件。 半导体封装组件包括包括第一半导体管芯的第一半导体封装。 第一再分配层（RDL）结构耦合到第一半导体管芯。 第一再分配层（RDL）结构包括设置在第一层级的第一导电迹线。 第二导电迹线设置在第二层级。 位于第一导电迹线和第二导电迹线之间的第一金属间电介质（IMD）层之外的第一金属间介电层（IMD）层和第二金属间介电层（IMD）层。

公开(公告)号：US20160079205A1

公开(公告)日：2016-03-17

申请号：US14932147

申请日：2015-11-04

Applicant: MediaTek Inc.

Inventor： Tzu-Hung LIN ,  I-Hsuan PENG ,  Ching-Wen HSIAO

IPC: H01L25/065 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L23/12

Abstract: The invention provides a semiconductor package, a semiconductor package assembly and a method for fabricating a semiconductor package. The semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first semiconductor die having first pads thereon. A first redistribution layer (RDL) structure is coupled to the first semiconductor die. Conductive pillar structures are disposed on a surface of the first RDL structure away from the first semiconductor die, wherein the conductive pillar structures are coupled to the first RDL structure.

Abstract translation: 本发明提供半导体封装，半导体封装组件和用于制造半导体封装的方法。 半导体封装组件包括第一半导体封装。 第一半导体封装包括其上具有第一焊盘的第一半导体管芯。 第一再分配层（RDL）结构耦合到第一半导体管芯。 导电柱结构设置在远离第一半导体管芯的第一RDL结构的表面上，其中导电柱结构耦合到第一RDL结构。