Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
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Application No.: US15212125Application Date: 2016-07-15
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Publication No.: US20170098628A1Publication Date: 2017-04-06
- Inventor: Nai-Wei LIU , Tzu-Hung LIN , I-Hsuan PENG , Ching-Wen HSIAO , Wei-Che HUANG
- Applicant: MediaTek Inc.
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/498 ; H01L21/56 ; H01L23/00 ; H01L23/31
Abstract:
A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor body and a conductive structure disposed below the semiconductor body. The semiconductor package structure also includes an insulating layer surrounding the conductive structure. The semiconductor package structure further includes a redistribution layer structure coupled to the conductive structure. In addition, the semiconductor package structure includes a molding compound surrounding the semiconductor body. A portion of the molding compound extends between the redistribution layer structure and the semiconductor body.
Information query
IPC分类:
