公开(公告)号：US20170077073A1

公开(公告)日：2017-03-16

申请号：US15203418

申请日：2016-07-06

Applicant: MediaTek Inc.

Inventor： Tzu-Hung LIN ,  Chi-Chin LIEN ,  Nai-Wei LIU ,  I-Hsuan PENG ,  Ching-Wen HSIAO ,  Wei-Che HUANG

IPC: H01L25/10

CPC classification number: H01L25/105 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/5389 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first semiconductor package that includes a first semiconductor die having a first surface and a second surface opposite thereto. A first package substrate is disposed on the first surface of the first semiconductor die. A first molding compound surrounds the first semiconductor die and the first package substrate. A first redistribution layer (RDL) structure is disposed on the first molding compound, in which the first package substrate is interposed and electrically coupled between the first semiconductor die and the first RDL structure.

Abstract translation: 提供半导体封装结构。 半导体封装结构包括第一半导体封装，其包括具有第一表面和与其相对的第二表面的第一半导体管芯。 第一封装基板设置在第一半导体管芯的第一表面上。 第一模塑料包围第一半导体管芯和第一封装衬底。 第一再分布层（RDL）结构设置在第一模塑料上，其中插入第一封装衬底并电耦合在第一半导体管芯和第一RDL结构之间。