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29 条记录 (耗时 0.03 秒)

    Methods and structures for electronic probing arrays
    15.
    发明申请
    Methods and structures for electronic probing arrays 审中-公开
    电子探测阵列的方法和结构

    公开(公告)号：US20050168231A1

    公开(公告)日：2005-08-04

    申请号：US11019600

    申请日：2004-12-22

    申请人： Young-Gon Kim

    发明人： Young-Gon Kim

    IPC分类号： G01R31/28 ,  G01R31/02

    CPC分类号： G01R31/2887

    摘要： A probe for testing semiconductor chips includes a plurality of probe contacts providing z-direction compliancy. The probe contacts include a blind opening surrounded by a lateral sidewall for receiving an aligned chip contact. The chip contacts are manipulated with a downward vertical force and along a horizontal path for engagement with various portions of the probe contact within the blind opening. The alignment may be actively monitored for determining minimum contact resistance during the probing process.

    摘要翻译： 用于测试半导体芯片的探针包括提供z方向兼容性的多个探针触点。 探针触点包括由侧壁围绕的盲孔，用于接收对准的芯片触点。 芯片触点以向下的垂直力并且沿着水平路径被操纵，用于与盲孔内的探针接触件的各个部分接合。 可以主动地监视对准以在探测过程中确定最小接触电阻。

    Nozzle structure of repair apparatus for semiconductor package
    17.
    发明授权
    Nozzle structure of repair apparatus for semiconductor package 有权
    半导体封装修复装置的喷嘴结构

    公开(公告)号：US6105847A

    公开(公告)日：2000-08-22

    申请号：US151702

    申请日：1998-09-11

    申请人： Young-Gon Kim

    发明人： Young-Gon Kim

    IPC分类号： H05K13/00 ,  B23K1/012 ,  H05K13/04 ,  B23K1/00 ,  B23K5/00

    CPC分类号： B23K1/012 ,  H05K13/0486

    摘要： A nozzle structure of a repair apparatus for a semiconductor package includes a funnel holder connected to a repair apparatus, a cylinder extended downwardly from the funnel holder, a vacuum tube provided along an axis of the cylinder, a vacuum absorption body housing the vacuum tube therein, and a pair of exhaust guide wall clips. A lower portion of the cylinder is compressed from four sides thereof so as to form a rectangular ending thereof which has first through fourth side walls. The vacuum absorption body is positioned between the first and third side walls. Each of the exhaust side walls is fixed to corresponding side edge lines of the first and third side walls, wherein the first and third side walls are identical in height and facing each other, the second and fourth side walls are identical in height and facing each other, and the first and third side walls are shorter than the second and fourth side walls in height.

    摘要翻译： 用于半导体封装的修复装置的喷嘴结构包括连接到修复装置的漏斗保持器，从漏斗保持器向下延伸的气缸，沿着气缸的轴线设置的真空管，在其中容纳真空管的真空吸收体 ，以及一对排气导向壁夹。 圆筒的下部从其四面压缩，形成具有第一至第四侧壁的矩形结束部。 真空吸收体位于第一和第三侧壁之间。 每个废气侧壁被固定到第一和第三侧壁的相应的侧边缘线，其中第一和第三侧壁的高度相同并且彼此面对，第二和第四侧壁的高度相同并且面向每个 第一和第三侧壁的高度比第二和第四侧壁短。

    Stacked microelectronic assemblies having basal compliant layers
    20.
    发明申请
    Stacked microelectronic assemblies having basal compliant layers 审中-公开
    堆叠的微电子组件具有基底柔性层

    公开(公告)号：US20060286717A1

    公开(公告)日：2006-12-21

    申请号：US11123989

    申请日：2005-05-06

    申请人： Vernon Solberg ,  Pieter Bellaar ,  Young-Gon Kim ,  Belgacem Haba

    发明人： Vernon Solberg ,  Pieter Bellaar ,  Young-Gon Kim ,  Belgacem Haba

    IPC分类号： H01L21/00

    CPC分类号： H01L25/0657 ,  H01L23/5387 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/107

    摘要： A method of making a stacked microelectronic assembly includes providing a flexible substrate having first and second ends, the flexible substrate having a plurality of attachment sites located between the first and second ends thereof including a first one of the attachment sites located adjacent the first end of the flexible substrate, the flexible substrate including conductive terminals accessible at a surface of the flexible substrate and wiring connected to the terminals, providing a compliant layer over the first attachment site, assembling a plurality of microelectronic elements over the attachment sites, wherein a first one of the microelectronic elements engages the compliant layer and is movable relative to the flexible substrate, electrically interconnecting the microelectronic elements and the wiring, folding the flexible substrate and stacking at least some of the microelectronic elements in generally vertical alignment with one another so that the first one of the microelectronic elements engaging the compliant layer is disposed at a bottom of the stacked assembly, and maintaining the stacked microelectronic elements in the substantially vertical alignment, wherein the conductive terminals are exposed at the bottom end of the stacked assembly.

    摘要翻译： 制造堆叠的微电子组件的方法包括提供具有第一和第二端的柔性衬底，所述柔性衬底具有位于其第一和第二端之间的多个附接位置，所述附接位置包括邻近第一端和第二端的第一附接位置 柔性基板，柔性基板包括在柔性基板的表面可接触的导电端子和连接到端子的布线，在第一附接位置上提供柔性层，在附接位置上组装多个微电子元件，其中第一个 的微电子元件接合顺应层并且可相对于柔性基板移动，将微电子元件和布线电互连，折叠柔性基板并将至少一些微电子元件堆叠成彼此大致垂直对准，使得第一 其中一个microe 接合柔性层的电极元件设置在堆叠组件的底部，并且将堆叠的微电子元件保持在基本上垂直的对准中，其中导电端子在堆叠组件的底端处露出。