公开(公告)号：US06953938B2

公开(公告)日：2005-10-11

申请号：US10670328

申请日：2003-09-26

Applicant: Yuichi Iwasaki ,  Masato Muraki ,  Kenji Tamamori ,  Kouji Asano ,  Masayoshi Esashi ,  Yoshinori Nakayama ,  Shinichi Hashimoto ,  Yoshiaki Moro

Inventor： Yuichi Iwasaki ,  Masato Muraki ,  Kenji Tamamori ,  Kouji Asano ,  Masayoshi Esashi ,  Yoshinori Nakayama ,  Shinichi Hashimoto ,  Yoshiaki Moro

IPC: H01J37/147 ,  H01J37/304

CPC classification number: H01J37/045 ,  B82Y10/00 ,  B82Y40/00 ,  H01J37/1477 ,  H01J37/3174 ,  H01J2237/0437 ,  H01J2237/31774

Abstract: A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member, which are formed by plating. The second conductive member is formed on the surface of the first conductive member and is made of a material that is more difficult to oxidize than the first conductive member. The first conductive member is made of a material having smaller residual stress than the second conductive member.

Abstract translation: 使带电粒子束偏转的偏转器包括具有带电粒子束应通过的开口的基板和布置在开口中以偏转带电粒子束并具有第一导电构件和第二导电构件的偏转电极， 它们通过电镀形成。 第二导电构件形成在第一导电构件的表面上，并且由比第一导电构件更难氧化的材料制成。 第一导电部件由残留应力小于第二导电部件的材料制成。

公开(公告)号：US20140133812A1

公开(公告)日：2014-05-15

申请号：US14126055

申请日：2012-06-14

Applicant: Tsuyoshi Kimura ,  Yoshihiro Tsukamoto ,  Kouji Asano ,  Akira Yoshioka ,  Rie Akihara

Inventor： Tsuyoshi Kimura ,  Yoshihiro Tsukamoto ,  Kouji Asano ,  Akira Yoshioka ,  Rie Akihara

IPC: G02B6/02

CPC classification number: G02B6/02033 ,  G02B6/02395 ,  G02B6/4403 ,  G02B6/443

Abstract: A composition for jacketing an optical fiber including a modified PPE resin containing a polyphenylene ether resin and a thermoplastic resin compatible with the polyphenylene ether resin, and a non halogen-based flame retardant, in which a nitrogen compound is included as the non halogen-based flame retardant and the content of nitrogen element in the composition is in the range of 100000 to 300000 ppm as measured by an elementary analysis.

Abstract translation: 一种包含含有聚苯醚树脂的改性PPE树脂和与聚苯醚树脂相容的热塑性树脂的光纤的组合物和非卤素类阻燃剂，其中包含氮化合物作为非卤素类 阻燃剂，通过元素分析测定，组合物中氮元素的含量在100000〜300000ppm的范围内。

公开(公告)号：US07832098B2

公开(公告)日：2010-11-16

申请号：US12098582

申请日：2008-04-07

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H01K3/10

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US07276707B2

公开(公告)日：2007-10-02

申请号：US11196262

申请日：2005-08-04

Applicant: Yuichi Iwasaki ,  Masato Muraki ,  Kenji Tamamori ,  Kouji Asano ,  Masayoshi Esashi ,  Yoshinori Nakayama ,  Shinichi Hashimoto ,  Yoshiaki Moro

Inventor： Yuichi Iwasaki ,  Masato Muraki ,  Kenji Tamamori ,  Kouji Asano ,  Masayoshi Esashi ,  Yoshinori Nakayama ,  Shinichi Hashimoto ,  Yoshiaki Moro

IPC: H01J37/30

CPC classification number: H01J37/045 ,  B82Y10/00 ,  B82Y40/00 ,  H01J37/1477 ,  H01J37/3174 ,  H01J2237/0437 ,  H01J2237/31774

Abstract: A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member which are formed by plating. The second conductive member is formed on a surface of the first conductive member and is essentially made of a material that is more difficult to oxidize than the first conductive member.

Abstract translation: 偏转带电粒子束的偏转器包括具有带电粒子束应穿过的开口的基板和设置在开口中以偏转带电粒子束的偏转电极，并具有第一导电部件和第二导电部件， 通过电镀形成。 第二导电构件形成在第一导电构件的表面上，并且基本上由比第一导电构件更难氧化的材料制成。

公开(公告)号：US07222776B2

公开(公告)日：2007-05-29

申请号：US10927413

申请日：2004-08-26

Applicant: Naoto Ishida ,  Kouji Asano

Inventor： Naoto Ishida ,  Kouji Asano

IPC: B23K31/02 ,  B23K35/12 ,  H01L23/52

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion 12 having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

Abstract translation: 印刷电路板具有电路基板6，电路基板6具有导体电路5和通孔60，并且还具有插入到通孔中的接合销1。 接合销通过使用在加热温度下未熔化的材料来制造，该材料将接合销接合到相对方垫81.接合销由具有比通孔的开口直径更大的直径的接合头部11构成。 接合销形成用于接合和连接到对方垫的接合部分。 连接销具有直径比通孔小的腿部12。 腿部插入到通孔中，并且通过诸如焊接材料20等的导电材料接合到通孔。代替接合销，可以将大致具有球形的接合球接合到通孔 孔由导电材料制成。

公开(公告)号：US20050035300A1

公开(公告)日：2005-02-17

申请号：US10670328

申请日：2003-09-26

Applicant: Yuichi Iwasaki ,  Masato Muraki ,  Kenji Tamamori ,  Kouji Asano ,  Masayoshi Esashi ,  Yoshinori Nakayama ,  Shinichi Hashimoto ,  Yoshiaki Moro

Inventor： Yuichi Iwasaki ,  Masato Muraki ,  Kenji Tamamori ,  Kouji Asano ,  Masayoshi Esashi ,  Yoshinori Nakayama ,  Shinichi Hashimoto ,  Yoshiaki Moro

IPC: H01J37/147

CPC classification number: H01J37/045 ,  B82Y10/00 ,  B82Y40/00 ,  H01J37/1477 ,  H01J37/3174 ,  H01J2237/0437 ,  H01J2237/31774

Abstract: A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member, which are formed by plating. The second conductive member is formed on the surface of the first conductive member and is made of a material that is more difficult to oxidize than the first conductive member. The first conductive member is made of a material having smaller residual stress than the second conductive member.

公开(公告)号：US20050023034A1

公开(公告)日：2005-02-03

申请号：US10927413

申请日：2004-08-26

Applicant: Naoto Ishida ,  Kouji Asano

Inventor： Naoto Ishida ,  Kouji Asano

IPC: H05K1/11 ,  H01L23/12 ,  H01L23/498 ,  H01R12/00 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46 ,  H01R12/04

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion 12 having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

Abstract translation: 印刷电路板具有电路基板6，电路基板6具有导体电路5和通孔60，并且还具有插入到通孔中的接合销1。 接合销通过使用在加热温度下未熔化的材料来制造，该材料将接合销接合到相对方垫81.接合销由具有比通孔的开口直径更大的直径的接合头部11构成。 接合销形成用于接合和连接到对方垫的接合部分。 连接销具有直径比通孔小的腿部12。 腿部插入到通孔中，并且通过诸如焊接材料20等的导电材料接合到通孔。代替接合销，可以将大致具有球形的接合球接合到通孔 孔由导电材料制成。

公开(公告)号：US06818911B2

公开(公告)日：2004-11-16

申请号：US10406274

申请日：2003-04-04

Applicant: Kenji Tamamori ,  Masato Muraki ,  Yuichi Iwasaki ,  Yoshinori Nakayama ,  Kouji Asano ,  Yoshiaki Moro ,  Masayoshi Esashi

Inventor： Kenji Tamamori ,  Masato Muraki ,  Yuichi Iwasaki ,  Yoshinori Nakayama ,  Kouji Asano ,  Yoshiaki Moro ,  Masayoshi Esashi

IPC: G21G500

CPC classification number: B82Y10/00 ,  B82Y40/00 ,  H01J37/045 ,  H01J37/3177 ,  H01J2237/0435

Abstract: This invention provides a reliable blanking aperture array. An insulating layer and conductive layer are sequentially formed on the lower surface of a substrate. Then, a plurality of pairs of opposing trenches are formed in the substrate, and an insulating layer is formed on each of the side surfaces of the trenches by thermal oxidation. The conductive layer is exposed by etching the bottom of each trench. A conductive member is selectively grown in each trench using the conductive layer as a plating electrode to form a blanking electrode. An opening is formed between the opposing blanking electrodes.

Abstract translation: 本发明提供了可靠的消隐孔径阵列。 绝缘层和导电层依次形成在基板的下表面上。 然后，在衬底中形成多对相对的沟槽，并且通过热氧化在沟槽的每个侧表面上形成绝缘层。 通过蚀刻每个沟槽的底部来暴露导电层。 使用导电层作为电镀电极，在每个沟槽中选择性地生长导电构件以形成消隐电极。 在相对的消隐电极之间形成开口。

公开(公告)号：US06784374B2

公开(公告)日：2004-08-31

申请号：US10195865

申请日：2002-07-15

Applicant: Naoto Ishida ,  Kouji Asano

Inventor： Naoto Ishida ,  Kouji Asano

IPC: H05K116

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion 12 having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

Abstract translation: 印刷电路板具有电路基板6，电路基板6具有导体电路5和通孔60，并且还具有插入到通孔中的接合销1。 通过使用在加热温度下未熔合的材料制造接合销，该材料将接合销接合到对方垫81.接合销由具有比通孔的开口直径更大的直径的接合头部11构成。 接合销形成用于接合和连接到对方垫的接合部分。 连接销具有直径比通孔小的腿部12。 腿部插入到通孔中，并且通过诸如焊接材料20等的导电材料接合到通孔。代替接合销，可以将大致具有球形的接合球接合到通孔 孔由导电材料制成。