公开(公告)号：US09415469B2

公开(公告)日：2016-08-16

申请号：US14340850

申请日：2014-07-25

申请人： SAN-EI KAGAKU CO., LTD.

发明人： Yasuhiro Takase ,  Kazuki Hanada ,  Kazunori Kitamura

IPC分类号： B23K35/36 ,  H05K1/09 ,  B23K35/02 ,  B23K1/20 ,  B23K1/00 ,  B23K3/06 ,  B23K3/08 ,  H05K3/34

CPC分类号： B23K35/3613 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/0638 ,  B23K3/08 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3612 ,  B23K2101/42 ,  H01L2224/11 ,  H05K3/3484 ,  H05K2203/0139 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/0445 ,  H05K2203/0588 ,  H05K2203/0769 ,  H05K2203/0773 ,  H05K2203/111

摘要： The present invention provides a solder bump formation resin composition which ensures resist (e.g., dry film) removability and which exhibits excellent solder bonding performance, even when the working substrate is placed at high temperature during reflowing, baking, or a similar process. The solder bump formation resin composition contains (A) at least one species selected from among an alkali-dissoluble thermoplastic resin having an acid value (mgKOH/g) of 110 or higher, an unsaturated fatty acid polymer having an acid value of 80 or higher, and an unsaturated fatty acid-aliphatic unsaturated compound copolymer having an acid value of 50 or higher; (B) a solvent; and (C) a solder powder, and contains no activating agent.

摘要翻译： 本发明提供了一种焊料凸点形成树脂组合物，其即使在回流，烘烤或类似工艺中将工作基板放置在高温下时也能够确保抗蚀剂（例如干膜）的去除性，并且具有优异的焊接性能。 焊锡凸块形成用树脂组合物含有（A）选自酸值（mgKOH / g）为110以上的碱溶性热塑性树脂中的至少一种，酸值为80以上的不饱和脂肪酸聚合物 ，和酸值为50以上的不饱和脂肪酸 - 脂肪族不饱和化合物共聚物; （B）溶剂; 和（C）焊料粉末，不含活化剂。

公开(公告)号：US09409248B2

公开(公告)日：2016-08-09

申请号：US14548638

申请日：2014-11-20

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Yuuji Ootake ,  Mitsuru Kouchi ,  Seiya Kuroda

IPC分类号： B41F15/08 ,  B41F15/26 ,  B41M1/12 ,  B23K3/06 ,  B23K1/20 ,  B23K37/04

CPC分类号： B23K3/0638 ,  B23K1/0016 ,  B23K1/20 ,  B23K37/04 ,  B41F15/08 ,  B41F15/26 ,  B41M1/12

摘要： A screen printer includes a mask, a substrate holding unit that clamps and holds a substrate below the mask by clamping members, a substrate holding unit moving mechanism that moves the substrate holding unit to contact the substrate with a lower surface of the mask, a paste filling unit that fills pattern holes of the mask with a paste, mask suction portions provided in the clamping members which suck the mask contacted with the substrate. The mask suction portions keep sucking the mask when the substrate holding unit moving mechanism moves the substrate in a direction away from the mask to perform plate releasing, and release the suction of the mask in a state in which the mask sucked to the mask suction portions maintains a posture parallel to the substrate after the movement of the substrate is started.

摘要翻译： 丝网印刷机包括掩模，通过夹持部件夹持并保持在掩模下方的基板的基板保持部;基板保持部移动机构，其使基板保持部与该基板的下表面接触， 填充单元，其用糊状物填充掩模的图案孔，设置在夹持构件中的吸附与基板接触的掩模的掩模吸引部。 当基板保持单元移动机构沿着远离掩模的方向移动基板以进行板释放时，掩模吸引部分保持吸入掩模，并且在掩模被吸到掩模吸引部分的状态下释放掩模的吸力 在开始移动基板之后保持与基板平行的姿势。

公开(公告)号：US09409018B2

公开(公告)日：2016-08-09

申请号：US14468435

申请日：2014-08-26

申请人： OTICON MEDICAL A/S

发明人： Guillaume Tourrel ,  Henrik Bendsen

IPC分类号： A61N1/36 ,  B23K1/00 ,  B23K1/20 ,  B23K31/02 ,  B23K1/19 ,  A61N1/375 ,  B23K26/32

CPC分类号： A61N1/36032 ,  A61N1/36038 ,  A61N1/37223 ,  A61N1/3752 ,  A61N1/3754 ,  A61N1/3758 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/19 ,  B23K1/20 ,  B23K26/32 ,  B23K31/02 ,  B23K2101/36 ,  B23K2103/14 ,  Y10T29/49002

摘要： A cochlear implant includes a sealed housing containing electronics for at least stimulation or collection of data and at least one antenna for communicating with an external device and a magnet configured to hold the external device in proximity to the sealed housing. The sealed housing includes an upper cover being closest to the skin when the device is implanted, and a lower cover that is hermetically connected to the upper cover. The lower cover includes an elevated region, a recessed region, and at least one feedthrough element formed in the recessed region of the lower cover. The recessed region provides space for a lead to connect to the feedthrough element and protects it from shock and other environmental risks.

摘要翻译： 耳蜗植入物包括密封壳体，其包含用于至少刺激或收集数据的电子装置，以及用于与外部装置通信的至少一个天线和被配置为将外部装置保持在密封壳体附近的磁体。 密封的壳体包括当植入装置时最靠近皮肤的上盖和气密地连接到上盖的下盖。 下盖包括形成在下盖的凹陷区域中的升高区域，凹陷区域和至少一个穿通元件。 凹陷区域为引线提供了连接到馈通元件的空间，并保护其免受冲击和其他环境风险的影响。

公开(公告)号：US09379085B2

公开(公告)日：2016-06-28

申请号：US13018993

申请日：2011-02-01

申请人： Ryuji Tsubaki ,  Yasufumi Matsuoka

发明人： Ryuji Tsubaki ,  Yasufumi Matsuoka

IPC分类号： H01L23/48 ,  H01L21/60 ,  B23K37/04 ,  B23K1/20 ,  B23K3/08 ,  H01L23/00 ,  B23K20/00 ,  H01L23/31

CPC分类号： H01L24/85 ,  B23K20/005 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A wire bonding structure is provided which includes a wire having a first bonding portion and a second bonding portion. The first bonding portion is bonded to an electrode pad of a semiconductor element, whereas the second bonding portion is bonded to a pad portion of a lead. The first bonding portion includes a front bond portion, a rear bond portion, and an intermediate portion sandwiched between these two bond portions. The front bond portion and the rear bond portion are bonded to the electrode pad more strongly than the intermediate portion is. In the longitudinal direction of the wire, the second bonding portion is smaller than the first bonding portion in bonding length.

摘要翻译： 提供一种引线键合结构，其包括具有第一接合部分和第二接合部分的线。 第一接合部分接合到半导体元件的电极焊盘，而第二接合部分接合到引线的焊盘部分。 第一接合部分包括前接合部分，后接合部分和夹在这两个接合部分之间的中间部分。 前接合部分和后接合部分比中间部分更牢固地接合到电极焊盘。 在导线的长度方向上，第二接合部的接合长度小于第一接合部。

公开(公告)号：US20160172713A1

公开(公告)日：2016-06-16

申请号：US14572216

申请日：2014-12-16

申请人： GENERAL ELECTRIC COMPANY

发明人： Sundeep Kumar ,  Eklavya Calla ,  Mohamed Rahmane

IPC分类号： H01M10/38 ,  H01M10/39 ,  B23K35/24 ,  B23K1/00 ,  B23K1/20

CPC分类号： H01M10/38 ,  B23K1/0016 ,  B23K1/19 ,  B23K1/20 ,  B23K35/24 ,  B23K2101/36 ,  B23K2103/02 ,  B23K2103/04 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/18 ,  B23K2103/26 ,  B23K2103/52 ,  H01M2/08 ,  H01M10/399 ,  H01M2300/0054

摘要： A method for joining a ceramic component to a metallic component is described. At least one initial layer of an active metal is applied to one of the joining surfaces, by a cold spray technique. At least one second layer of a nickel-based braze composition is then applied over the initial layer by cold-spraying. The braze composition and components are then heated, so as to form an active braze joint between them. A method of sealing an open region of a sodium metal halide-based battery is also disclosed, using the brazing technique described herein to form braze joints that seal various components in the battery cells, such as metallic rings and ceramic collar structures.

摘要翻译： 描述了将陶瓷组分接合到金属组分的方法。 通过冷喷涂技术将至少一个活性金属的初始层施加到一个接合表面。 然后通过冷喷涂将至少一层第二层镍基钎焊组合物施加在初始层上。 然后将钎焊组合物和组分加热，以便在它们之间形成活性钎焊接头。 还公开了一种密封钠金属卤化物基电池的开放区域的方法，使用本文所述的钎焊技术形成密封电池单元（例如金属环和陶瓷套环结构）中的各种部件的钎焊接头。

公开(公告)号：US09364914B2

公开(公告)日：2016-06-14

申请号：US14471327

申请日：2014-08-28

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Seokhyun Lee ,  Jaegwon Jang ,  Chul-Yong Jang

IPC分类号： H01L23/02 ,  B23K3/06 ,  B23K1/00 ,  B23K1/20 ,  H01L23/498 ,  H01L25/10 ,  H01L25/00 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

CPC分类号： B23K3/0623 ,  B23K1/0016 ,  B23K1/203 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/45099

摘要： Provided are apparatuses configured to attach a solder ball, methods of attaching a solder ball, and methods of fabricating a semiconductor package including the same. An apparatus configured to attach a solder ball includes a chuck configured to receive a package substrate on which solder balls are provided; a shielding mask configured to shield the package substrate and including holes configured to expose the solder balls; and a heater configured to melt the solder balls exposed through the holes.

摘要翻译： 提供了构造成附接焊球的装置，附接焊球的方法，以及制造包括该焊球的半导体封装的方法。 构造成附接焊球的装置包括：卡盘，其配置成接收其上设置有焊球的封装基板; 屏蔽掩模，被配置为屏蔽所述封装基板并且包括被配置为暴露所述焊球的孔; 以及被配置为熔化通过孔暴露的焊球的加热器。

公开(公告)号：US09364913B2

公开(公告)日：2016-06-14

申请号：US14264432

申请日：2014-04-29

申请人： DENSO CORPORATION ,  Chiba Institute of Technology ,  Canon Machinery Inc. ,  UACJ Corporation

发明人： Shin Takewaka ,  Shogo Yamada ,  Shumpei Ozawa ,  Tohru Nagasawa ,  Haruhiko Matsushita ,  Yasunaga Itoh ,  Tomoki Yamayoshi

IPC分类号： B23K31/02 ,  B23K1/00 ,  B23K1/20 ,  B23K1/008 ,  B23K1/012 ,  B23K1/19 ,  B23K35/00 ,  B23K35/28 ,  B23K35/38 ,  B23K35/02 ,  C22C21/02 ,  F28F3/02 ,  F28F21/08 ,  F28D1/03

CPC分类号： B23K1/0012 ,  B23K1/008 ,  B23K1/012 ,  B23K1/19 ,  B23K1/20 ,  B23K35/00 ,  B23K35/004 ,  B23K35/0222 ,  B23K35/28 ,  B23K35/286 ,  B23K35/38 ,  B23K2101/14 ,  B23K2103/10 ,  B32B15/016 ,  C22C21/00 ,  C22C21/02 ,  F28D1/0308 ,  F28F3/025 ,  F28F3/12 ,  F28F21/089 ,  F28F2275/04 ,  Y10T428/12764

摘要： In a method for brazing a sheet material without use of flux, an inert gas is firstly introduced into an oxygen pump to reduce an oxygen partial pressure in the inert gas to 1×10−10 Pa or less, and the sheet material is heated in a brazing furnace in an atmosphere of the inert gas discharged from the oxygen pump. A core alloy of the sheet material or a brazing filler alloy cladded to a surface of the core alloy contains Mg. Both the core alloy and the brazing filler alloy may contain Mg. Accordingly, brazability of the sheet material is sufficiently improved.

摘要翻译： 在不使用焊剂的情况下对片材进行钎焊的方法中，首先将惰性气体引入氧气泵中，将惰性气体中的氧分压降低至1×10 -10 Pa以下，并将片材加热 在氧气泵排出的惰性气体气氛中的钎焊炉。 包覆在芯合金的表面的片材或钎焊料合金的芯合金含有Mg。 核心合金和钎焊合金都可以含有Mg。 因此，片材的钎焊性充分提高。

公开(公告)号：US20160151850A1

公开(公告)日：2016-06-02

申请号：US15017398

申请日：2016-02-05

申请人： Intel Corporation

发明人： Deepak V. Kulkarni ,  Carl L. Deppisch ,  Leonel R. Arana ,  Gregory S. Constable ,  Sriram Srinivasan

IPC分类号： B23K1/00 ,  B23K1/20 ,  H01L23/367

CPC分类号： B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K3/085 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16251 ,  Y10T428/12222

摘要： Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.

摘要翻译： 形成封装结构的方法和相关结构包括在IHS的阻焊剂开口位置上形成低熔点焊料材料，从而在非SRO保护区域内形成密封剂; 将IHS连接到密封剂上，并固化密封剂，其中在IHS和低熔点焊料材料之间形成焊接接头。

公开(公告)号：US09355986B2

公开(公告)日：2016-05-31

申请号：US14378226

申请日：2013-02-14

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Shuji Nishimoto ,  Kimihito Nishikawa ,  Yoshiyuki Nagatomo

IPC分类号： H01L23/48 ,  H01L23/00 ,  B23K1/00 ,  B23K35/30 ,  B23K35/36 ,  B23K35/02 ,  B23K1/19 ,  B23K1/20 ,  H01L23/367 ,  H01L23/373

CPC分类号： H01L24/33 ,  B23K1/0016 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/0272 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3602 ,  B23K35/3607 ,  H01L23/367 ,  H01L23/3735 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/03505 ,  H01L2224/04026 ,  H01L2224/27505 ,  H01L2224/29005 ,  H01L2224/29083 ,  H01L2224/29111 ,  H01L2224/29239 ,  H01L2224/29286 ,  H01L2224/29299 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83539 ,  H01L2224/83686 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/05432 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/207 ,  H01L2924/05341 ,  H01L2924/05442 ,  H01L2924/053 ,  H01L2924/206

摘要： There are provided a solder joint structure, a power module using the joint structure, a power module substrate with a heat sink and a method of manufacturing the same, as well as a solder base layer forming paste which is disposed and fired on a metal member to thereby react with an oxide film generated on the surface of the metal member and form the solder base layer on the metal member, capable of suppressing the occurrence of waviness and wrinkles on the surface of the metal member even at the time of loading the power cycle and heat cycle and improving the joint reliability with a joint member.

摘要翻译： 提供了焊接结构，使用接合结构的功率模块，具有散热器的功率模块基板及其制造方法，以及焊接基底层形成用糊料，其设置在金属部件上 从而与在金属构件的表面上产生的氧化膜反应并在金属构件上形成焊料基底层，即使在加载电力时也能够抑制金属构件的表面上的波纹和褶皱的发生 循环和热循环，并通过联合成员提高联合可靠性。

公开(公告)号：US09283634B2

公开(公告)日：2016-03-15

申请号：US14247420

申请日：2014-04-08

申请人： HONDA MOTOR CO., LTD.

发明人： Taisei Wakisaka ,  Masahito Mutou ,  Tokuji Okumura ,  Takanori Suzuki ,  Shinya Oyama

IPC分类号： B23K1/20 ,  B23K1/19 ,  B23K9/167

CPC分类号： B23K1/20 ,  B23K1/19 ,  B23K1/206 ,  B23K9/167

摘要： Provided is an arc welding method and arc welding apparatus for arc welding by a brazing filler metal two base materials subjected to a plating process. An arc welding method for arc welding two base materials, at least one of which has a plating layer thereon, by a brazing filler material, performs alternately a plating layer removal process of removing a plating layer by performing arc discharge at a first current value while moving a welding torch along a welding line in a state of stopping feed of the brazing filler metal, and a brazing filler metal welding process of welding the brazing filler metal to a position where the plating layer is removed, by performing arc discharge at a second current value smaller than the first current value while feeding the brazing filler metal in a state of stopping a movement of the welding torch.

摘要翻译： 本发明提供一种电弧焊接方法和电弧焊接装置，其通过钎焊二次电镀基材进行电弧焊接。 一种电弧焊接方法，其通过钎料将至少其中一个具有镀层的两种基材进行电弧焊接，通过以第一电流值进行电弧放电而交替地去除镀层，同时 在钎焊焊料停止供给的状态下沿着焊接线移动焊炬;以及钎焊焊料焊接工序，其通过在第二次进行电弧放电来将钎料焊接到除去镀层的位置 同时在停止焊炬的移动的状态下供给钎料的同时，小于第一电流值的电流值。