Abstract:
A memory device comprises a plurality of memory cells, each of which comprising a first electrode, a second electrode and an active material arranged between the first electrode and the second electrode, wherein the memory cells are grouped into memory cell groups, each memory cell group defining a memory cell group area and being configured such that corresponding first electrodes are individually addressable, and corresponding second electrodes are commonly addressable via a common select device provided within the memory cell group area of the memory cell group.
Abstract:
A memory cell of a memory device is fabricated by forming a first electrode on a substrate, positioning a photo mask at a first position relative to the substrate, and forming a first material layer on the first electrode based on a pattern on the photo mask. The photo mask is positioned at a second position relative to the substrate, and a second material layer is formed above the first material layer based on the pattern on the photo mask, the second material layer being offset from the first material layer so that a first sub-cell of the memory cell includes the first material layer and not the second material layer, and a second sub-cell of the memory cell includes both the first and second material layers. A second electrode is formed above the first and second material layers.
Abstract:
A nonvolatile semiconductor memory device comprising: a memory cell array including memory cells each provided at individual intersection between a first wiring and a second wiring, the memory cell comprising a variable resistive element, and predetermined numbers of the memory cells shearing the same first wiring to configure a page; a first control circuit configured to select a page subjected to data-writing, and to supply a constant voltage to the first wiring belonging to the selected page; a writing-voltage generating circuit configured to generate plural kinds of writing voltages for programming a resistance of the variable resistive element to one of three or more values based on a write-in data specifying three or more values; and a second control circuit configured to select the page subjected to data-writing, and to supply the writing voltages to predetermined numbers of the respective second wirings belonging to the selected page.
Abstract:
An information recording/reproducing device includes a first electrode layer, a second electrode layer, a recording layer as a variable resistance between the first and second electrode layer, and a circuit which supplies a voltage to the recording layer to change a resistance of the recording layer. Each of the first and second electrode layers is comprised of IV or III-V semiconductor doped with p-type carrier or n-type carrier.
Abstract:
A method of operating a nonvolatile memory cell includes providing the nonvolatile memory cell comprising a diode which is fabricated in a first resistivity, unprogrammed state, and applying a forward bias to the diode having a magnitude greater than a minimum voltage required for programming the diode to switch the diode to a second resistivity, programmed state. The second resistivity state is lower than the first resistivity state.
Abstract:
A technique capable of improving speed of a set operation, which controls writing rate in a semiconductor device including a memory cell using a phase-change material. The technique uses means for setting a set-pulse voltage to be applied to the phase-change material to have two steps: the first-step voltage sets a temperature of the phase-change memory to a temperature at which the fastest nucleation is obtained; and the second pulse sets the temperature to a temperature at which the fastest crystal growth is obtained, thereby obtaining solid-phase growth of the phase-change material without melting. Moreover, the technique uses means for controlling the two-step voltage applied to the phase-change memory by a two-step voltage applied to a word line capable of reducing the drain current variation.
Abstract:
A phase change memory device includes a phase change resistor configured to sense a change in crystallization state due to current flow in order to store data that corresponds to the crystallization state. The phase change memory device is driven by reading cell data of a selected unit cell using a reference current. The cell data is compared to write data and then it is determined whether the write data is set data or reset data if the cell data is different from the write data. The set or reset state is written to the cell and verified during a write and verification operation under various conditions to stably write the data.
Abstract:
A resistance change memory device including: a semiconductor substrate; at least one cell array formed above the semiconductor substrate, each memory cell having a stack structure of a variable resistance element and an access element, the access element having such an off-state resistance value in a certain voltage range that is ten times or more as high as that in a select state; and a read/write circuit formed on the semiconductor substrate as underlying the cell array for data reading and writing, wherein the variable resistance element comprises a recording layer composed of a composite compound containing at least two types of cation elements, at least one type of the cation element being a transition element having “d” orbit, in which electrons are incompletely filled, the shortest distance between adjacent cation elements being 0.32 nm or less.
Abstract:
Various embodiments of the present invention are directed to crossbar-memory systems to methods for writing information to and reading information stored in such systems. In one embodiment of the present invention, a crossbar-memory system comprises a first layer of microscale signal lines, a second layer of microscale signal lines, a first layer of nanowires configured so that each first layer nanowire overlaps each first layer microscale signal line, and a second layer of nanowires configured so that each second layer nanowire overlaps each second layer microscale signal line and overlaps each first layer nanowire. The crossbar-memory system includes nonlinear-tunneling resistors configured to selectively connect first layer nanowires to first layer microscale signal lines and to selectively connect second layer nanowires to second layer microscale signal lines. The crossbar-memory system also includes nonlinear tunneling-hysteretic resistors configured to connect each first layer nanowire to each second layer nanowire at each crossbar intersection.
Abstract:
A phase change memory device and operation is described where the phase change memory device includes a phase change resistance cell storing data corresponding to a sensed crystallization state. The phase change memory device operates by reading data of a selected phase change resistance cell when in a write mode. The data to be written is compared to the read data. If the read data is different from the data to be written, it is determined whether the data to be written is a first data. An operation writing and verifying the first data in the cell under a first operating condition when the is data to be written is the first data is then performed. After performing verification, if the read data is different from the first data, the first data is written and verified in the selected phase change resistance cell under a second operating condition.