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公开(公告)号：US08513640B2
公开(公告)日：2013-08-20
申请号：US12094403
申请日：2006-11-14
CPC分类号： H01L27/2463 , H01L27/2436 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1625 , H01L45/1675
摘要： On the same semiconductor substrate 1, a memory cell array in which a plurality of memory elements R having a chalcogenide-material storage layer 22 storing a high-resistance state with a high electric resistance value and a low-resistance state with a low electric resistance value by a change of an atom arrangement are disposed in a matrix is formed in a memory cell region mmry, and a semiconductor integrated circuit is formed in a logic circuit region lgc. This chalcogenide-material storage layer 22 is made of a chalcogenide material containing at least either one of Ga or In of 10.5 atom % or larger to 40 atom % or smaller, Ge of 5 atom % or larger to 35 atom % or smaller, Sb of 5 atom % or larger to 25 atom % or smaller, and Te of 40 atom % or larger to 65 atom % or smaller.
摘要翻译： 在相同的半导体衬底1上，存储单元阵列，其中具有存储具有高电阻值的高电阻状态的硫族化物材料存储层22的多个存储元件R和具有低电阻的低电阻状态 在存储单元区域mmry中形成以矩阵形式设置的原子排列变化的值，在逻辑电路区域lgc中形成半导体集成电路。 该硫属化物材料储存层22由含有10.5原子％以上至40原子％以下的Ga或In中的至少任一种的硫属元素化物构成，5原子％以上且35原子％以下的Ge，Sb 为5原子％以上且25原子％以下，Te为40原子％以上且65原子％以下。
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公开(公告)号：US08228724B2
公开(公告)日：2012-07-24
申请号：US13345231
申请日：2012-01-06
IPC分类号： G11C11/00
CPC分类号： H01L47/00 , G11C13/0004 , H01L27/2436 , H01L27/2463 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L2924/0002 , H01L2924/00
摘要： For example, one memory cell is configured using two memory cell transistors and one phase change element by disposing a plurality of diffusion layers in parallel to a bit-line, disposing gates between the diffusion layers so as to cross the bit-line, disposing bit-line contacts and source contacts alternately to the plurality of diffusion layers arranged in a bit-line direction for each diffusion layer, and providing a phase change element on the source contact. Also, the phase change element can be provided on the bit-line contact instead of the source contact. By this means, for example, increase in drivability of the memory cell transistors and reduction in area can be realized.
摘要翻译： 例如，一个存储单元被配置为使用两个存储单元晶体管和一个相变元件，通过将多个扩散层与位线平行地布置，在扩散层之间设置栅极以跨越位线，布置位 线接触和源触点交替地布置到针对每个扩散层的位线方向上的多个扩散层，以及在源极触点上提供相变元件。 此外，相位元件可以设置在位线触点上而不是源极触点。 通过这种方式，例如，可以实现存储单元晶体管的驱动性的提高和面积的减小。
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公开(公告)号：US07864568B2
公开(公告)日：2011-01-04
申请号：US12516690
申请日：2006-12-07
IPC分类号： G11C11/00
CPC分类号： H01L45/144 , G11C13/0004 , G11C13/0069 , G11C2213/75 , H01L27/2436 , H01L27/2463 , H01L27/2472 , H01L45/06 , H01L45/1233
摘要： In a semiconductor storage device such as a phase change memory, a technique which can realize high integration is provided. The semiconductor storage device includes a phase change thin film 101 having two stable phases of a crystal state with low electric resistance and an amorphous state with high electric resistance, upper plug electrodes 102 and 103 provided on one side of the phase change thin film 101, a lower electrode 104 provided on the other side of the phase change thin film 101, a selecting transistor 114 whose drain/source terminals are connected to the upper plug electrode 102 and the lower electrode 104, and a selecting transistor 115 whose drain/source terminals are connected to the upper plug electrode 103 and the lower electrode 104, and a first memory cell is configured with the selecting transistor 114 and a phase change region 111 in the phase change thin film 101 sandwiched between the upper plug electrode 102 and the lower electrode 104, and a second memory cell is configured with the selecting transistor 115 and a phase change region 112 in the phase change thin film 101 sandwiched between the upper plug electrode 103 and the lower electrode 104.
摘要翻译： 在诸如相变存储器的半导体存储装置中，提供了可以实现高集成度的技术。 半导体存储装置包括：具有低电阻的晶体状态的两个稳定相和具有高电阻的非晶态的相变薄膜101，设置在相变薄膜101一侧的上部插塞电极102和103， 设置在相变薄膜101的另一侧的下部电极104，漏极/源极端子连接到上部插塞电极102和下部电极104的选择晶体管114，以及选择晶体管115，其漏极/源极端子 连接到上插头电极103和下电极104，并且第一存储单元配置有夹在上插头电极102和下电极之间的相变薄膜101中的选择晶体管114和相变区域111 104，并且第二存储单元配置有夹在b中的相变薄膜101中的选择晶体管115和相变区域112 在上塞电极103和下电极104之间。
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公开(公告)号：US20100182828A1
公开(公告)日：2010-07-22
申请号：US12688886
申请日：2010-01-17
申请人： Akio SHIMA , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
发明人： Akio SHIMA , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
CPC分类号： H01L27/2481 , G11C13/0004 , G11C13/003 , G11C2213/71 , G11C2213/75 , G11C2213/79 , H01L27/2454 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1625 , H01L45/1683
摘要： There is provided a semiconductor storage device which is capable of further reducing a size of a memory cell, and increasing a storage capacity. Plural memory cells each including a transistor formed on a semiconductor substrate, and a variable resistive device having a resistance value changed by voltage supply and connected between source and drain terminals of the transistor are arranged longitudinally and in an array to configure a three-dimensional memory cell array. A memory cell structure has a double channel structure in which an inside of a switching transistor is filled with a variable resistance element, particularly, a phase change material. The switching transistor is turned off by application of a voltage to increase a channel resistance so that a current flows in the internal phase change material to operate the memory.
摘要翻译： 提供了能够进一步减小存储单元的尺寸并增加存储容量的半导体存储装置。 每个包括形成在半导体衬底上的晶体管的多个存储单元以及具有由电压供应改变并连接在晶体管的源极和漏极端子之间的电阻值的可变电阻器件被纵向排列成阵列以构成三维存储器 单元格阵列。 存储单元结构具有双通道结构，其中开关晶体管的内部填充有可变电阻元件，特别是相变材料。 通过施加电压来切换开关晶体管，以增加沟道电阻，使得电流在内部相变材料中流动以操作存储器。
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公开(公告)号：US20100096613A1
公开(公告)日：2010-04-22
申请号：US12522744
申请日：2007-01-11
申请人： Takahiro Morikawa , Motoyasu Terao , Norikatsu Takaura , Kenzo Kurotsuchi , Nozomu Matsuzaki , Yoshihisa Fujisaki , Masaharu Kinoshita , Yuichi Matsui
发明人： Takahiro Morikawa , Motoyasu Terao , Norikatsu Takaura , Kenzo Kurotsuchi , Nozomu Matsuzaki , Yoshihisa Fujisaki , Masaharu Kinoshita , Yuichi Matsui
CPC分类号： H01L45/144 , H01L27/2436 , H01L45/06 , H01L45/1233 , H01L45/1675
摘要： A phase change memory is formed of a plug buried within a through-hole in an insulating film formed on a semiconductor substrate, an interface layer formed on the insulating film in which the plug is buried, a recording layer formed of a chalcogenide layer formed on the interface layer, and an upper contact electrode formed on the recording layer. The recording layer storing information according to resistance value change is made of chalcogenide material containing indium in an amount range from 20 atomic % to 38 atomic %, germanium in a range from 9 atomic % to 28 atomic %, antimony in a range from 3 atomic % to 18 atomic %, and tellurium in a range from 42 atomic % to 63 atomic %, where the content of germanium larger than or equal to the content of antimony.
摘要翻译： 相变存储器由形成在半导体衬底上的绝缘膜中的埋入通孔内的插塞形成，形成在绝缘膜上的界面层，其中埋入插塞，由硫化物层形成的记录层形成在 界面层和形成在记录层上的上接触电极。 根据电阻值变化存储信息的记录层由含有20原子％至38原子％的量的铟的含量为9原子％至28原子％的锗的硫属化物材料制成，3原子级的锑 ％〜18原子％，碲为42原子％〜63原子％，锗的含量大于或等于锑的含量。
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公开(公告)号：US20100072451A1
公开(公告)日：2010-03-25
申请号：US12373185
申请日：2006-07-21
申请人： Motoyasu Terao , Satoru Hanzawa , Takahiro Morikawa , Kenzo Kurotsuchi , Riichiro Takemura , Norikatsu Takaura , Nozomu Matsuzaki
发明人： Motoyasu Terao , Satoru Hanzawa , Takahiro Morikawa , Kenzo Kurotsuchi , Riichiro Takemura , Norikatsu Takaura , Nozomu Matsuzaki
CPC分类号： G11C13/0004 , G11C2213/79 , H01L27/2436 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1625 , H01L45/1675
摘要： A recording layer 52 made of a chalcogenide material which stores a high-resistance state of a high electrical resistance value and a low-resistance state of a low electrical resistance value is used as a memory element RM in a memory cell region, and it is formed so that a concentration of Ga or In of a first layer 52a positioned on a lower electrode TP side of the recording layer 52 is higher than the corresponding concentration of a second layer 52b positioned on an upper electrode 53 side. For example, the recording layer is formed so that a content of Ga or In of the second layer is 5 atomic % or more smaller than that of the first layer. Also, a circuit which can reverse the voltage polarity between the upper electrode and the lower electrode in a set operation and a reset operation is provided.
摘要翻译： 作为存储单元区域中的存储元件RM，使用由存储高电阻值的高电阻状态和低电阻值的低电阻状态的硫族化物材料制成的记录层52， 使得位于记录层52的下电极TP侧的第一层52a中的Ga或In的浓度高于位于上电极53侧的第二层52b的相应浓度。 例如，记录层形成为使得第二层中的Ga或In的含量比第一层的含量低5原子％以上。 此外，提供了在设定操作和复位操作中可以反转上电极和下电极之间的电压极性的电路。
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公开(公告)号：US20090108247A1
公开(公告)日：2009-04-30
申请号：US10587079
申请日：2004-12-20
IPC分类号： H01L47/00
CPC分类号： G11C13/0004 , G11C13/04 , G11C13/047 , G11C2213/56 , G11C2213/71 , H01L27/2436 , H01L27/2463 , H01L45/06 , H01L45/1233 , H01L45/126 , H01L45/144 , H01L45/1625
摘要： A phase-change memory device including a memory cell having a memory element and a select transistor is improved in heat resistance so that it may be operable at 145° C. or higher.The memory layer is used which has a content of Zn or Cd of 20 at % or more and 50 at % or less, a content of Ge or Sb of 5 at % or more and 25 at % or less, and a content of Te of 40 at % or more and 65 at % or less in Zn-Ge-Te.
摘要翻译： 包括具有存储元件和选择晶体管的存储单元的相变存储器件的耐热性得到改善，使得其在145℃以上可操作。 使用具有20原子％以上且50原子％以下的Zn或Cd含量的记忆层，Ge或Sb的含量为5原子％以上且25原子％以下，Te含量 在Zn-Ge-Te中为40at％以上且65at％以下。
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公开(公告)号：US20060266992A1
公开(公告)日：2006-11-30
申请号：US11435934
申请日：2006-05-18
IPC分类号： H01L47/00
CPC分类号： H01L27/2436 , H01L45/06 , H01L45/1233 , H01L45/1293 , H01L45/144 , H01L45/1675
摘要： Since a chalcogenide material has low adhesion to a silicon oxide film, there is a problem in that it tends to separate from the film during the manufacturing step of a phase change memory. In addition, since the chalcogenide material has to be heated to its melting point or higher during resetting (amorphization) of the phase change memory, there is a problem of requiring extremely large rewriting current. An interfacial layer comprising an extremely thin insulator or semiconductor having the function as both an adhesive layer and a high resistance layer (thermal resistance layer) is inserted between chalcogenide material layer/interlayer insulative film and between chalcogenide material layer/plug.
摘要翻译： 由于硫族化物材料对氧化硅膜的粘附性低，所以存在在相变存储器的制造工序中与膜分离的问题。 此外，由于在相变存储器的复位（非晶化）期间必须将硫属化物材料加热至其熔点以上，所以存在需要非常大的重写电流的问题。 在硫族化物材料层/层间绝缘膜之间和硫族化物材料层/插塞之间插入包含具有粘合剂层和高电阻层（耐热层）两者的极薄绝缘体或半导体的界面层。
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公开(公告)号：US20060203542A1
公开(公告)日：2006-09-14
申请号：US11341385
申请日：2006-01-30
申请人： Kenzo Kurotsuchi , Kiyoo Itoh , Norikatsu Takaura , Kenichi Osada
发明人： Kenzo Kurotsuchi , Kiyoo Itoh , Norikatsu Takaura , Kenichi Osada
IPC分类号： G11C11/00
CPC分类号： G11C13/0069 , G11C13/0004 , G11C13/004 , G11C13/0061 , G11C2013/0047 , G11C2013/0073 , G11C2013/0078 , G11C2013/0092 , G11C2213/79
摘要： A semiconductor non volatile memory device capable of multiple write operations with high reliability is implemented. The memory device includes memory cells, each comprising a first electrode, a second electrode, and an information storage section put between the two electrodes, wherein an operation to feed a first pulse current from the first electrode to the second, and another operation to feed a second pulse current from the second electrode to the first. A segregation of composing elements of the information storage section is caused by applying the first pulse, however, the segregation of elements is resolved by applying the second pulse, and the composition of the element recovers to the original state.
摘要翻译： 实现了具有高可靠性的多次写入操作的半导体非易失性存储器件。 存储器件包括存储单元，每个存储单元包括放置在两个电极之间的第一电极，第二电极和信息存储部分，其中将第一脉冲电流从第一电极馈送到第二电极的操作，以及另一个进给 从第二电极到第一电极的第二脉冲电流。 信息存储部分的组合元件的分离是通过施加第一脉冲引起的，然而，通过应用第二脉冲来解决元件的偏析，并且元件的组成恢复到原始状态。
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公开(公告)号：US07071485B2
公开(公告)日：2006-07-04
申请号：US10790764
申请日：2004-03-03
CPC分类号： H01L27/2436 , H01L27/2463 , H01L27/2472 , H01L45/06 , H01L45/1233 , H01L45/126 , H01L45/144 , H01L45/16
摘要： With a high-speed nonvolatile phase change memory, reliability in respect of the number of refresh times is enhanced. In a memory cell forming area of a phase change memory using a MISFET as a transistor for selection of memory cells, a phase change material layer of a memory cell comprising a resistor element, using a phase change material, is formed for common use. As a result, variation in shape and a change in composition of the phase change material, caused by isolation of memory cell elements by etching, are reduced, thereby enhancing reliability of memory cells, in respect of the number of refresh times.
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