Abstract:
A configuration setting manager of a memory device receives a request to perform an adjustment operation on one or more configuration setting values of the memory device; calculate one or more updated configuration setting values by applying a multiplier value to the one or more configuration setting values based on a configuration adjustment definition associated with the one or more configuration setting values, wherein the multiplier value is associated with a number of memory operations performed on the memory device; and store the one or more updated configuration setting values to one or more corresponding configuration registers.
Abstract:
A configuration setting manager of a memory device receives a request to perform an adjustment operation on a set of configuration setting values for the memory device, where each configuration setting value of the set of configuration setting values is stored in a corresponding configuration register of a set of configuration registers; determines a configuration adjustment definition associated with one or more configuration setting values of the set of configuration setting values; calculates an updated set of configuration setting values by applying a multiplier value to the configuration adjustment definition, wherein the multiplier value is associated with a number of programming operations performed on the memory device; and stores the updated set of configuration setting values in the corresponding configuration registers.
Abstract:
An operation method of a memory device for programming memory cells to a plurality of program states includes providing a series of program pulses to selected memory cells, performing a first verification operation of verifying a target program state among the plurality of program states, performing, when the first verification operation is passed, a second verification operation of detecting fail cells among the selected memory cells to determine if these memory cells have been overprogrammed. When the number of detected fail cells is greater than or equal to a reference value, the program operation may be terminated for that location and the data may be written to another location.
Abstract:
Methods of operating a memory device include programming a page of a memory block of the memory device using a particular starting programming voltage, determining a programming voltage indicative of a programming efficiency of the page of the memory block during programming of the page of the memory block, storing a representation of the programming voltage indicative of the programming efficiency of the page of the memory block, setting a starting programming voltage for a different page of the memory block in response to the stored representation of the programming voltage indicative of the programming efficiency of the page of the memory block, and programming the different page of the memory block using its starting programming voltage.
Abstract:
A semiconductor memory device includes a memory string on a well, the memory string including a memory cell connected in series between first and second select transistors, a bit line and a source line respectively connected to the first and second select transistors, a well line connected to the well, first and second select lines respectively connected to gates of the first and second select transistors, a word line connected to a gate of the memory cell transistor, and a control circuit that performs a write operation on the first select transistor, the write operation including a pre-charge operation of the bit line, in which a first voltage is applied to the word line and the second select line, a second voltage higher than the first voltage to the source line and the well line, and a third voltage higher than the first voltage to the first select line.
Abstract:
A method of operating a semiconductor memory device includes performing a first program operation in order to raise threshold voltages of memory cells, performing a program verification operation for detecting fast program memory cells, each having a threshold voltage risen higher than a first sub-verification voltage from a second sub-verification voltage or lower, by using a target verification voltage and the first sub-verification voltage and the second sub-verification voltage which are sequentially lower than the target verification voltage, and performing a second program operation under a condition that an increment of each of threshold voltages of memory cells, which is lower than the target verification voltage, is greater than an increment of the threshold voltage of each of the fast program memory cells.
Abstract:
A linear hot-electron injection technique is provided for a non-volatile memory arrangement. The non-volatile memory is comprised of: a floating gate transistor; a capacitor with a first terminal electrically coupled to the gate node of the floating gate transistor; a current reference circuit electrically coupled to the source node of the floating gate transistor; and a feedback circuit electrically coupled between the source node of the floating gate transistor and a second terminal of the capacitor. The feedback circuit operates to adjust a voltage at the gate node of the floating gate transistor in accordance with a source-to-drain voltage across the floating gate transistor.
Abstract:
A programmable memory cell includes a non-volatile memory unit, a reference current generator and a readout unit. The non-volatile memory unit is configured to be performed by a program operation, a read operation or an erase operation. The reference current generator is configured to generate a reference current; wherein a value of the reference current is dynamically modulated according to a count number of the program and erase operations performed on the non-volatile memory unit. The readout unit, electrically coupled to the non-volatile memory unit and the reference current generator, is configured to read a data stored in the non-volatile memory cell according to the reference current. A data read method applied to the aforementioned programmable memory cell is also provided.
Abstract:
According to exemplary embodiments, a system, method, and computer program product are provided for BER-based wear leveling in a SSD. A block-level BER value for a block in the SSD is determined. An adjusted PE cycle count for the block is incremented or decremented based on the block-level BER value. Wear leveling is then performed in the SSD based on the adjusted PE cycle count.
Abstract:
A nonvolatile memory with a multi-pass programming scheme enables a page of multi-level memory cells to be programmed with reduced floating-gate to floating-gate perturbations (Yuping effect). The memory cells operate within a common threshold voltage range or window, which is partitioned into multiple bands to denote a series of increasingly programmed states. The series is divided into two halves, a lower set and a higher set. The memory cells are programmed in a first, coarse programming pass such that the memory cells of the page with target states from the higher set are programmed to a staging area near midway in the threshold window. In particular, they are programmed closer to their targeted destinations than previous schemes, without incurring much performance penalty. Subsequent passes will then complete the programming more quickly. Yuping effect is reduced since the threshold voltage change in subsequent passes are reduced.