公开(公告)号：US20240357749A1

公开(公告)日：2024-10-24

申请号：US18232403

申请日：2023-08-10

申请人： Yield Engineering Systems, Inc.

发明人： Kenneth Sautter ,  Syndee Young ,  Charudatta Galande

IPC分类号： H05K3/38 ,  H05K3/14 ,  H05K3/42

CPC分类号： H05K3/389 ,  H05K1/0353 ,  H05K3/146 ,  H05K3/382 ,  H05K3/386 ,  H05K3/42 ,  Y10T29/49155

摘要： An electronic device having a substrate with a metal structure, a mono-layer coating of a selected silane composition on a surface of the metal structure, and an organic layer on the mono-layer coating, wherein the mono-layer coating improves the interfacial adhesion strength between the metal surface and the organic material.

公开(公告)号：US12108540B2

公开(公告)日：2024-10-01

申请号：US17611813

申请日：2020-05-14

申请人： AMOSENSE CO.,LTD

发明人： Kyung Whan Woo ,  Ji Hyung Lee

IPC分类号： H05K3/20 ,  H01L23/373 ,  H05K3/46 ,  H01L21/48 ,  H05K3/12 ,  H05K3/38

CPC分类号： H05K3/202 ,  H05K3/205 ,  H05K3/4641 ,  H01L21/4867 ,  H01L23/3735 ,  H05K3/1283 ,  H05K3/381 ,  H05K2203/04 ,  H05K2203/0425 ,  H05K2203/0723

摘要： A ceramic substrate manufacturing method is provided in which a copper sheet is etched and then bonded to a ceramic substrate, so that the ceramic substrate has reduced to overall processing time and improved reliability and product lifespan. The ceramic substrate manufacturing method includes the steps of: etching a copper sheet so as to prepare a metal substrate; etching a ceramic substrate so as to prepare a unit ceramic substrate; assembling the metal substrate and the unit ceramic substrate; bonding the metal substrate and the unit ceramic substrate so as to form a stack; partially printing a metal paste on the surface of the stack; and sintering the metal paste.

公开(公告)号：US12096549B1

公开(公告)日：2024-09-17

申请号：US17582734

申请日：2022-01-24

申请人： Vicor Corporation

发明人： Patrizio Vinciarelli ,  Patrick R. Lavery ,  Rudolph F. Mutter ,  Jeffery J. Kirk ,  Andrew T. D'Amico

IPC分类号： H05K1/02 ,  H01L23/053 ,  H01L23/057 ,  H01L23/28 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/16 ,  H05K3/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/38 ,  H01L21/44 ,  H01L23/14

CPC分类号： H05K1/0204 ,  H05K1/111 ,  H05K1/181 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/0026 ,  H05K3/0044 ,  H05K3/0079 ,  H05K3/16 ,  H05K3/18 ,  H05K3/207 ,  H05K3/24 ,  H05K3/381 ,  H01L21/44 ,  H01L23/053 ,  H01L23/057 ,  H01L23/147 ,  H01L23/28 ,  H05K2201/1003 ,  Y10T29/49146

摘要： Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.

公开(公告)号：US12091430B2

公开(公告)日：2024-09-17

申请号：US17636092

申请日：2020-09-01

申请人： SHIKOKU CHEMICALS CORPORATION

发明人： Noriaki Yamaji ,  Tatsuya Koga ,  Hirohiko Hirao

IPC分类号： C09D183/08 ,  C07F7/18 ,  C23C22/52 ,  H05K3/38

CPC分类号： C07F7/1804 ,  C23C22/52 ,  H05K3/382 ,  C09D183/08

摘要： The present invention provides a surface treatment liquid for metal having a sufficiently high film-forming property. The present invention relates to a surface treatment liquid for metal comprising an azole silane coupling agent, the surface treatment liquid further comprises (A) an organic acid ion having one to three acidic groups in one molecule; (B) an inorganic acid (or mineral acid) ion; (C) an alkali metal ion and/or an ammonium ion; and (D) a copper ion.

公开(公告)号：US12082337B2

公开(公告)日：2024-09-03

申请号：US17800660

申请日：2021-11-02

申请人： Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

发明人： Jiaxiang Zhang ,  Jiuyuan Bai ,  Xin Mu ,  Mingqiang Wang ,  Hongjin Hu ,  Fei Li ,  Yonglin Chen ,  Kun Zuo ,  Chang Wang ,  Xin Bi ,  Bin Zhang ,  Seungyong Oh

IPC分类号： H05K1/02 ,  H05K3/38

CPC分类号： H05K1/0272 ,  H05K1/028 ,  H05K3/386 ,  H05K2201/10128

摘要： A printed circuit board and a fabricating method thereof, and a displaying device. The printed circuit board includes a hard-board region (30) and a soft-board region (31), the soft-board region (31) is located at the periphery of the first edge (30a) of the hard-board region (30), the printed circuit board within the hard-board region (30) includes a base plate (301), and an adhesive film (302), a covering film (303) and a first metal layer (304) that are arranged in layer configuration on one side of the base plate (301), the adhesive film (302) is closest to the base plate (301), a flow guiding groove (3030) is disposed on the surface of the side of the covering film (303) that is closer to the adhesive film (302), and the flow guiding groove (3030) extends to a second edge (30b) of the hard-board region (30).

公开(公告)号：US20240237229A9

公开(公告)日：2024-07-11

申请号：US18271461

申请日：2021-12-10

申请人： YMT CO., LTD.

发明人： Sung Wook CHUN ,  Bo Mook CHUNG ,  Dea Geun KIM ,  Myong Hwan PARK ,  Nak Eun KO ,  Ju Yong SIM

IPC分类号： H05K3/38 ,  C09J7/40

CPC分类号： H05K3/382 ,  C09J7/401 ,  H05K1/0237

摘要： The present invention relates to a release layer for a metal foil with carrier and a metal foil with carrier including the release layer. The release layer is designed for easy removal of the carrier and includes one or more nitrogenous heterocyclic compounds and one or more inorganic compounds containing at least one metal selected from the group consisting of nickel, molybdenum, cobalt, phosphorus, manganese, and iron.

公开(公告)号：US12028988B2

公开(公告)日：2024-07-02

申请号：US18338737

申请日：2023-06-21

申请人： IBIDEN CO., LTD.

发明人： Takuya Inishi

IPC分类号： B32B3/02 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42

CPC分类号： H05K3/387 ,  H05K3/188 ,  H05K3/429

摘要： A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer and including one or more conductor circuits, an insulating adhesive layer covering a surface of the conductor layer and a part or parts of the insulating layer exposed from the conductor layer, and a resin insulating layer formed on the insulating layer and the conductor layer such that the insulating adhesive layer is sandwiched between the conductor layer and the resin insulating layer. The insulating adhesive layer includes a first portion covering an upper surface of the one or more conductor circuits and a second portion covering a side surface of the one or more conductor circuits and a thickness of the first portion is greater than a thickness of the second portion.

公开(公告)号：US12022622B2

公开(公告)日：2024-06-25

申请号：US16166204

申请日：2018-10-22

申请人： Murata Manufacturing Co., Ltd.

发明人： Yuki Takemori

IPC分类号： H05K3/38 ,  H05K1/09 ,  H05K3/34 ,  H05K3/46 ,  H05K1/02 ,  H05K1/03 ,  H05K3/40

CPC分类号： H05K3/38 ,  H05K1/09 ,  H05K3/34 ,  H05K3/388 ,  H05K3/4644 ,  B32B2305/80 ,  B32B2457/08 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/4007 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0338

摘要： A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer and a surface electrode on a surface of the electronic component body. The surface electrode includes a first sintered layer on the base ceramic layer, a second sintered layer on the first sintered layer, and a plating layer on the second sintered layer. A peripheral section of the first sintered layer has an exposed surface which is not overlaid with the second sintered layer or the plating layer.

公开(公告)号：US20240196541A1

公开(公告)日：2024-06-13

申请号：US18425373

申请日：2024-01-29

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited .

发明人： CHENG-JIA LI ,  Mei Yang

IPC分类号： H05K3/00 ,  H05K3/10 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/0097 ,  H05K3/0026 ,  H05K3/465 ,  H05K3/107 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/4053 ,  H05K3/4076 ,  H05K2201/0108 ,  H05K2201/0323 ,  H05K2203/0152 ,  H05K2203/1572

摘要： A transparent circuit board includes a conductive wiring, a transparent insulating layer, and a cover film stacked on the transparent insulating layer. The conductive wiring penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the conductive wiring. A blackened layer is formed on a surface of the conductive wiring combined with the cover film, a carbon black layer is formed on a surface of the conductive wiring without the blackened layer, thereby improving a light transmittance of the transparent circuit board.

公开(公告)号：US12004295B2

公开(公告)日：2024-06-04

申请号：US17111144

申请日：2020-12-03

申请人： Corning Incorporated

发明人： Shrisudersan Jayaraman

IPC分类号： H05K1/11 ,  H01L21/48 ,  H01L23/14 ,  H01L23/15 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/16 ,  H05K3/38 ,  H05K3/42

CPC分类号： H05K1/115 ,  H01L21/486 ,  H01L23/145 ,  H01L23/15 ,  H01L23/49827 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/16 ,  H05K3/388 ,  H05K3/423

摘要： An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.