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公开(公告)号：US20240140905A1
公开(公告)日：2024-05-02
申请号：US18342397
申请日：2023-06-27
申请人： YMT CO., LTD.
发明人： Dea Geun KIM , Sung Wook CHUN , Bo Mook CHUNG , Nak Eun KO
IPC分类号： C25D3/38 , C07D233/64 , C07D241/12
CPC分类号： C25D3/38 , C07D233/64 , C07D241/12
摘要： The present invention relates to a leveler capable of efficiently filling the inside of via holes formed during the manufacturing process of a printed circuit board, and an electroplating composition comprising the same. When via holes on a substrate are filled with the electroplating composition according to the present invention, the via holes can be filled in a relatively short time while minimizing the formation of dimples or voids.
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2.发明公开公开(公告)号：US20240015885A1
公开(公告)日：2024-01-11
申请号：US18038671
申请日：2021-12-10
申请人： YMT CO., LTD
发明人： Sung Wook CHUN , Bo Mook CHUNG , Dea Geun KIM , Myong Hwan PARK , Nak Eun KO , Ju Yong SIM
CPC分类号： H05K1/09 , H05K1/0237 , H05K2201/0355
摘要： The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. The rough surface is naturally formed during formation of the metal foil. The formation of the rough surface allows the metal foil to have a high adhesive strength to an insulating resin substrate and enables the manufacture of a printed circuit board with improved efficiency.
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公开(公告)号：US20240237229A9
公开(公告)日：2024-07-11
申请号：US18271461
申请日：2021-12-10
申请人： YMT CO., LTD.
发明人： Sung Wook CHUN , Bo Mook CHUNG , Dea Geun KIM , Myong Hwan PARK , Nak Eun KO , Ju Yong SIM
CPC分类号： H05K3/382 , C09J7/401 , H05K1/0237
摘要： The present invention relates to a release layer for a metal foil with carrier and a metal foil with carrier including the release layer. The release layer is designed for easy removal of the carrier and includes one or more nitrogenous heterocyclic compounds and one or more inorganic compounds containing at least one metal selected from the group consisting of nickel, molybdenum, cobalt, phosphorus, manganese, and iron.
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公开(公告)号：US20240138075A1
公开(公告)日：2024-04-25
申请号：US18271461
申请日：2021-12-10
申请人： YMT CO>< LTD.
发明人： Sung Wook CHUN , Bo Mook CHUNG , Dea Geun KIM , Myong Hwan PARK , Nak Eun KO , Ju Young SIM
CPC分类号： H05K3/382 , C09J7/401 , H05K1/0237
摘要： The present invention relates to a release layer for a metal foil with carrier and a metal foil with carrier including the release layer. The release layer is designed for easy removal of the carrier and includes one or more nitrogenous heterocyclic compounds and one or more inorganic compounds containing at least one metal selected from the group consisting of nickel, molybdenum, cobalt, phosphorus, manganese, and iron.
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公开(公告)号：US20240133039A1
公开(公告)日：2024-04-25
申请号：US17926116
申请日：2022-07-29
申请人： YMT CO., LTD.
发明人： Sung Wook CHUN , Bo Mook CHUNG , Dea Geun KIM , Nak Eun KO , Ju Yong SIM
CPC分类号： C23C18/1653 , C25D5/18 , H05K3/423
摘要： The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.
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公开(公告)号：US20240132441A1
公开(公告)日：2024-04-25
申请号：US17926115
申请日：2022-07-29
申请人： YMT CO., LTD.
发明人： Sung Wook CHUN , Bo Mook CHUNG , Dea Geun KIM , Nak Eun KO , Ju Yong SIM
IPC分类号： C07C217/76 , C07D213/30 , C23C18/16 , C23C18/38 , C23C28/02 , C25D3/38 , C25D5/18 , H05K3/42
CPC分类号： C07C217/76 , C07D213/30 , C23C18/1653 , C23C18/38 , C23C28/023 , C25D3/38 , C25D5/18 , H05K3/425 , H05K2203/072 , H05K2203/0723
摘要： The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.
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7.发明公开公开(公告)号：US20230203693A1
公开(公告)日：2023-06-29
申请号：US17927736
申请日：2021-03-22
申请人： YMT CO., LTD.
发明人： Sung Wook CHUN , Bo Mook CHUNG , Dea Geun KIM , Jong II Kim , Jinseok KANG
摘要： The present invention relates to a surface modifier for electrolytic nickel plating including at least one carboxyl group-containing compound and a nickel electroplating solution including the surface modifier. The use of the nickel electroplating solution according to the present invention enables efficient formation of a plated nickel layer with high surface roughness and mattness even without performing strong electrolysis, unlike in the prior art.
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