公开(公告)号：US12128493B2

公开(公告)日：2024-10-29

申请号：US16981777

申请日：2019-02-27

申请人： ACR II GLASS AMERICA INC.

发明人： Olivier Farreyrol

IPC分类号： B23K1/00 ,  B23K35/26 ,  C22C13/00 ,  H01R4/62 ,  H01R12/53 ,  H01R12/57 ,  H01R43/02 ,  H05B3/84 ,  H01Q1/12 ,  H01Q1/36

CPC分类号： B23K1/0008 ,  B23K35/262 ,  C22C13/00 ,  H01R4/625 ,  H01R12/53 ,  H01R12/57 ,  H01R43/02 ,  H05B3/84 ,  H01Q1/1278 ,  H01Q1/364 ,  H05B2203/016 ,  H05B2203/017

摘要： A method of producing a vehicle glass assembly includes (A) providing a harness including a metal wire, a connector at a terminal of the metal wire, including a flat portion made of a metal plate, and a block of lead-free solder, containing tin as a major component, soldered on the flat portion of the connector; (B) providing a glass substrate layer over which a conductive layer, including an electrically conductive wire pattern and a connecting terminal, is formed; (C) sandwiching the block between the flat portion of the connector and the connecting terminal of the conductive layer, and then melting the block to form a solder connection between the connector and the connecting terminal; wherein the amount of the lead-free solder is between 4 mg and 13 mg.

公开(公告)号：US12113307B2

公开(公告)日：2024-10-08

申请号：US18387070

申请日：2023-11-06

申请人： Molex, LLC

发明人： Daishi Gondo

IPC分类号： H01R12/71 ,  H01R12/57 ,  H01R12/70 ,  H01R13/447 ,  H01R13/504 ,  H01R13/627 ,  H01R13/631 ,  H01R13/639

CPC分类号： H01R12/716 ,  H01R12/57 ,  H01R12/707 ,  H01R13/447 ,  H01R13/504 ,  H01R13/6275 ,  H01R13/631 ,  H01R13/6395

摘要： A connector is provided with a half body part, each of which including a connector main body and a plurality of terminals arranged at a predetermined pitch and integrated with the connector main body by insert molding, a main body end part formed at both ends of the connector main body by coupling the connector main bodies of the half body parts arranged in parallel, and a reinforcing metal fitting integrated with the main body end part.

公开(公告)号：US12080980B2

公开(公告)日：2024-09-03

申请号：US17668199

申请日：2022-02-09

申请人： WAGO Verwaltungsgesellschaft mbH

发明人： Henning Meier ,  Thomas Witte

IPC分类号： H01R4/48 ,  H01R4/02 ,  H01R12/57 ,  H01R13/629 ,  H01R4/28 ,  H01R9/24 ,  H01R11/11 ,  H01R12/50 ,  H01R12/51 ,  H01R12/55 ,  H01R12/71 ,  H01R13/04 ,  H01R13/11 ,  H01R13/15 ,  H01R13/17 ,  H01R13/187

CPC分类号： H01R4/48185 ,  H01R4/02 ,  H01R4/48 ,  H01R12/57 ,  H01R13/629 ,  H01R4/28 ,  H01R9/24 ,  H01R11/11 ,  H01R12/50 ,  H01R12/51 ,  H01R12/55 ,  H01R12/71 ,  H01R12/712 ,  H01R12/714 ,  H01R12/716 ,  H01R13/04 ,  H01R13/11 ,  H01R13/112 ,  H01R13/15 ,  H01R13/17 ,  H01R13/187

摘要： A contact element for connecting an electrical conductor and a conductor terminal with such a contact element are provided. The contact element includes a conductor insertion area in which there are two opposite first side walls, a first floor section connecting the first side walls and a first cover section opposite the first floor section. The first side walls, the first floor section and the first cover section limit a conductor insertion channel. One or both first side walls each have at least one spring tongue freed from the first floor section and the first cover section, which tongue forms a clamping point for clamping an electrical conductor by means of a spring force.

公开(公告)号：US20240248266A1

公开(公告)日：2024-07-25

申请号：US18229339

申请日：2023-08-02

申请人： DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD

发明人： Bin HUANG ,  Qiongnan CHEN ,  Hongji CHEN ,  Chuanqi GONG

IPC分类号： G02B6/42 ,  H01R12/57 ,  H01R13/512 ,  H01R13/516 ,  H01R13/6582

CPC分类号： G02B6/4269 ,  G02B6/4246 ,  H01R12/57 ,  H01R13/512 ,  H01R13/516 ,  H01R13/6582

摘要： A connector assembly includes an electrical connector, a metal shielding cage, a heat sink and a fastening member. The electrical connector includes an insulating body and a number of conductive terminals configured to be mounted on a circuit board. The insulating body includes a mating slot. The metal shielding cage is shielded on a periphery of the electrical connector. The metal shielding cage includes a receiving chamber in communication with the mating slot for receiving a mating connector along a first direction. The first direction is perpendicular to the circuit board. The heat sink is fixed to the metal shielding cage. The fastening member passes through the circuit board and is fastened to the heat sink.

公开(公告)号：US20240178593A1

公开(公告)日：2024-05-30

申请号：US18384945

申请日：2023-10-30

申请人： Japan Aviation Electronics Industry, Ltd.

发明人： Kenta ASHIBU

IPC分类号： H01R12/71 ,  H01R12/57 ,  H01R12/70

CPC分类号： H01R12/716 ,  H01R12/57 ,  H01R12/707

摘要： A spring piece of each contact includes a first spring part extending between a contact part and a fixed part, and a second spring part extending downward from the contact part. In a plurality of contacts, when a board-to-board connector is mounted on a main board, the second spring part is separated from the main board. In the plurality of contacts, when the spring piece receives a load from a sub-board and thereby the contact part is displaced downward, the first spring part is deformed, and further the second spring part is deformed in contact with the main board. In at least any one of the plurality of contacts, after the load is removed and thereby the contact part is displaced upward, the second spring part remains in contact with the main board.

公开(公告)号：US20240162637A1

公开(公告)日：2024-05-16

申请号：US18506538

申请日：2023-11-10

申请人： SEIKO EPSON CORPORATION

发明人： Hitoshi UENO

IPC分类号： H01R12/57 ,  H05K1/18

CPC分类号： H01R12/57 ,  H05K1/181 ,  G01C19/5783 ,  H05K2201/10151 ,  H05K2201/1034 ,  H05K2201/10378 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10545

摘要： An electronic device includes a substrate having a first surface and a second surface in a front-back relation, a first electronic component mounted on the second surface, and a lead joined to the second surface of the substrate via a conductive joint member, wherein the lead includes a base end portion extending in a direction along the substrate and joined to the second surface via the joint member, a distal end portion located distally from the substrate with respect to the base end portion in a thickness direction of the substrate and having a terminal surface, and a coupling portion coupling the base end portion and the distal end portion, and θ1>θ2, wherein, as seen from a direction orthogonal to a plane along which the lead extends, an angle formed by a line connecting an outermost position in which the joint member contacts the base end portion and an outer edge of the substrate and the base end portion is θ1, a distance between the first electronic component and the terminal surface in the thickness direction of the substrate is d1, a distance between a boundary part between the base end portion and the coupling portion and the joint member in the direction along the substrate is d2, and arctan(d1/d2)=θ2.

公开(公告)号：US20240106139A1

公开(公告)日：2024-03-28

申请号：US17955369

申请日：2022-09-28

申请人： Intel Corporation

发明人： Jiun Hann SIR ,  Eng Huat GOH ,  Poh Boon KHOO ,  Chin Mian CHOONG ,  Jooi Wah WONG ,  Jia Yun WONG

IPC分类号： H01R12/57 ,  H01L25/065 ,  H01L25/10 ,  H01R12/52 ,  H01R12/79 ,  H01R13/03 ,  H01R13/508 ,  H01R43/20

CPC分类号： H01R12/57 ,  H01L25/0652 ,  H01L25/105 ,  H01R12/526 ,  H01R12/79 ,  H01R13/03 ,  H01R13/508 ,  H01R43/205 ,  H01L24/16

摘要： Embodiments herein relate to systems, apparatuses, or processes for a connector for a modular memory package that includes one or more memory dies on a substrate, where the connector directly electrically couples electrical contacts at an edge and on each side the substrate of the memory package to electrical contacts at an edge and on each side of another substrate that includes a compute die. The connector may include a first plurality of leads that are substantially parallel with each other, and a second plurality of leads that are substantially parallel with each other that are below the first plurality of leads and electrically couple the two substrates. Other embodiments may be described and/or claimed.

公开(公告)号：US11936142B2

公开(公告)日：2024-03-19

申请号：US17714751

申请日：2022-04-06

申请人： Palo Alto Innovation, LLC

发明人： Samuel Alexander Tramiel ,  Dawid Bogdal ,  Darius Mostowfi

IPC分类号： H01R12/57 ,  G06F1/18 ,  H01R13/66 ,  H01R13/717

CPC分类号： H01R13/665 ,  G06F1/185 ,  H01R12/57 ,  H01R13/7175

摘要： A power connector includes a first printed circuit board (PCB) to connect to a plurality of power cables and receive power from the plurality of power cables. The power connector also includes a plug, which is electrically connected to the first PCB, to connect to a graphics card and provide the power to the graphics card. The power connector may further include a second PCB electrically connected between the first PCB and the plug, a casing to house the first PCB and/or the second PCB, and/or light-emitting diodes (LEDs) to be illuminated during operation of the graphics card.

公开(公告)号：US20240047446A1

公开(公告)日：2024-02-08

申请号：US17882626

申请日：2022-08-08

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Mao-Yen Chang ,  Chun-Cheng Lin ,  Chih-Wei Lin ,  Yi-Da Tsai ,  Hsaing-Pin Kuan ,  Chih-Chiang Tsao ,  Hsuan-Ting Kuo ,  Hsiu-Jen Lin ,  Yu-Chia Lai ,  Kuo-Lung Pan ,  Hao-Yi Tsai ,  Ching-Hua Hsieh

IPC分类号： H01L25/18 ,  H01L23/00 ,  H01R12/57 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L25/18 ,  H01L24/19 ,  H01L24/95 ,  H01R12/57 ,  H01L24/13 ,  H01L25/0652 ,  H01L24/20 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L24/11 ,  H01L2224/19 ,  H01L2224/95001 ,  H01L2224/214 ,  H01L2224/2101 ,  H01L2224/81815 ,  H01L2224/81201 ,  H01L2224/81862 ,  H01L2224/81193 ,  H01L2224/81906 ,  H01L2224/1403 ,  H01L2224/14517 ,  H01L2224/14505 ,  H01L2224/1319 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/07025 ,  H01L2224/1329 ,  H01L2224/13386 ,  H01L2924/05442 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13144 ,  H01L2224/16108 ,  H01L2224/16238 ,  H01L2224/16059 ,  H01L2224/13016 ,  H01L2224/1607 ,  H01L2224/8192 ,  H01L2224/1131 ,  H01L2924/1427 ,  H01L2924/14361 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1431

摘要： A semiconductor package and a manufacturing method thereof are described. The semiconductor package includes a package having dies encapsulated by an encapsulant, a redistribution circuit structure, first and second modules and affixing blocks. The redistribution circuit structure is disposed on the package. The first and second modules are disposed on and respectively electrically connected to the redistribution circuit structure by first and second connectors disposed there-between. The first and second modules are adjacent to each other and disposed side by side on the redistribution circuit structure. The affixing blocks are disposed on the redistribution circuit structure and between the first and second modules and the redistribution circuit structure. The affixing blocks include first footing portions located below the first module, second footing portions located below the second module, and exposed portions exposed from the first and second modules. The affixing blocks join the first and second modules to the redistribution circuit structure.

公开(公告)号：US11888248B2

公开(公告)日：2024-01-30

申请号：US17178106

申请日：2021-02-17

申请人： Hirose Electric Co., Ltd.

发明人： Xingyu Cheng

IPC分类号： H01R12/70 ,  H01R31/06 ,  H01R13/627 ,  H01R13/508 ,  H01R12/71 ,  H01R12/73 ,  H01R12/57 ,  H01R13/6586 ,  H01R13/11 ,  H01R13/639 ,  H01R13/502

CPC分类号： H01R12/7082 ,  H01R12/716 ,  H01R12/73 ,  H01R13/508 ,  H01R13/6273 ,  H01R31/06 ,  H01R12/57 ,  H01R12/70 ,  H01R13/11 ,  H01R13/502 ,  H01R13/639 ,  H01R13/6586

摘要： An intermediate electrical connector 1 which, upon connection of a first counterpart connect body 2 and a second counterpart connect body each from different sides in a manner permitting plugging and unplugging, mediates between the two counterpart connect bodies, the intermediate electrical connector 1 comprising terminals that are enabled to contact, respectively, the first counterpart connect body 2 and the second counterpart connect body, and a housing that directly or indirectly secures the terminals in place, wherein the connector has locking fittings 100 supported by the housing of the intermediate electrical connector 1, and the locking fittings 100 have locking portions 104A enabled to engage lockable portions 151 provided in the first counterpart connect body 2 in the direction of disengagement when the intermediate electrical connector 1 and said first counterpart connect body 2 are connected.