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1.
公开(公告)号:US20240331968A1
公开(公告)日:2024-10-03
申请号:US18742934
申请日:2024-06-13
IPC分类号: H01J37/147 , H01J37/09 , H01J37/10 , H01J37/244 , H01J37/28
CPC分类号: H01J37/1471 , H01J37/09 , H01J37/10 , H01J37/244 , H01J37/28 , H01J2237/0453 , H01J2237/24578
摘要: A charged-particle apparatus generates a plurality of sub-beams from a source beam of charged particles and direct the sub-beams downbeam toward a sample position. The charged-particle apparatus comprises a charged particle source, an aperture array, and a charged particle optical component. The charged-particle source comprises an emitter to emit a source beam of charged particles along a divergent path. The aperture array is positioned in the divergent path so the aperture array generates sub-beams from the source beam. The charged-particle-optical component acts on the source beam upbeam of the aperture array. The charged-particle-optical component comprises a multipole and/or a charged-particle lens. The multipole operates on the source beam to vary the position of the divergent path at the aperture array. The multipole may vary a cross-sectional shape of the divergent path at the aperture array. The charged-particle-optical lens compensates for variations in distance between the emitter and the aperture array.
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公开(公告)号:US12094683B2
公开(公告)日:2024-09-17
申请号:US18181395
申请日:2023-03-09
IPC分类号: H01J37/244 , H01J37/28
CPC分类号: H01J37/244 , H01J37/28 , H01J2237/2443 , H01J2237/2445 , H01J2237/2446 , H01J2237/24495 , H01J2237/24578
摘要: A method for operating a multi-beam particle beam microscope includes: scanning a multiplicity of particle beams over an object; directing electron beams emanating from impingement locations of the particle beams at the object onto an electron converter; detecting first signals generated by impinging electrons in the electron converter via a plurality of detection elements of a first detection system during a first time period; detecting second signals generated by impinging electrons in the electron converter via a plurality of detection elements of a second detection system during a second time period; and assigning to the impingement locations the signals which were detected via the detection elements of the first detection system during the first time period, for example on the basis of the detection signals which were detected via the detection elements of the second detection system during the second time period.
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公开(公告)号:US12068128B2
公开(公告)日:2024-08-20
申请号:US17702343
申请日:2022-03-23
发明人: Yusuke Nakamura , Yusuke Abe , Kenji Tanimoto , Takeyoshi Ohashi
IPC分类号: H01J37/28 , H01J37/244 , H01J37/26
CPC分类号: H01J37/28 , H01J37/244 , H01J37/265 , H01J2237/24475 , H01J2237/2448
摘要: An object of the invention is to acquire a high-quality image while maintaining an improvement in throughput of image acquisition (measurement (length measurement)). The present disclosure provides a charged particle beam system including a charged particle beam device and a computer system configured to control the charged particle beam device. The charged particle beam device includes an objective lens, a sample stage, and a backscattered electron detector that is disposed between the objective lens and the sample stage and that adjusts a focus of a charged particle beam with which a sample is irradiated. The computer system adjusts a value of an electric field on the sample in accordance with a change in a voltage applied to the backscattered electron detector.
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公开(公告)号:US20240266142A1
公开(公告)日:2024-08-08
申请号:US18617227
申请日:2024-03-26
申请人: FEI Company
IPC分类号: H01J37/305 , H01J37/20 , H01J37/244 , H01J37/28
CPC分类号: H01J37/3056 , H01J37/20 , H01J37/244 , H01J37/28 , H01J2237/2007 , H01J2237/208 , H01J2237/31745 , H01J2237/31749
摘要: Methods and systems for creating attachments between a sample manipulator and a sample within a charged particle systems are disclosed herein. Methods include translating a sample manipulator so that it is proximate to a sample, and milling portions of the sample manipulator such that portions are removed. The portion of the sample manipulator proximate to the sample is composed of a high sputter yield material, and the high sputter yield material may be the material milled with the charged particle beam such that it is removed from the sample manipulator. According to the present disclosure, the portions of the sample manipulator are milled such that at least some of the removed high sputter yield material redeposits to form an attachment between the sample manipulator and the sample.
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公开(公告)号:US20240249908A1
公开(公告)日:2024-07-25
申请号:US18101260
申请日:2023-01-25
发明人: Frank Sinclair , Paul Joseph Murphy , Bon-Woong Koo , Gregory Edward Stratoti , Tseh-Jen Hsieh , Glenn Green
IPC分类号: H01J37/244 , C23C14/48 , H01J37/09 , H01J37/317
CPC分类号: H01J37/244 , C23C14/48 , H01J37/09 , H01J37/3171 , H01J2237/0453 , H01J2237/24564
摘要: A dose cup assembly that results in less particles in a process chamber is disclosed. The dose cup assembly includes a faceplate attached to a back wall of the process chamber, and having an opening; an aperture plate defining a plurality of slots; and a tunnel having walls and sidewalls and having a proximal end and a distal end, located between the faceplate and the aperture plate, such that the proximal end is nearer to the faceplate and the distal end is nearer to the aperture plate; wherein at least one of the faceplate, the walls, the sidewalls or the aperture plate has one or more exposed outer surfaces that comprise silicon. The exposed outer surfaces may be silicon. In some embodiments, the faceplate, the walls, the sidewalls or the aperture plate may be graphite, aluminum, or stainless steel which is coated with silicon or silicon carbide.
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公开(公告)号:US12046446B2
公开(公告)日:2024-07-23
申请号:US17640279
申请日:2019-09-04
发明人: Hiroyuki Chiba , Wei Chean Tan , Ryo Komatsuzaki , Hirofumi Sato
IPC分类号: H01J37/22 , G06T7/70 , G06V10/22 , G06V10/24 , G06V10/774 , H01J37/244 , H01J37/28
CPC分类号: H01J37/222 , G06T7/70 , G06V10/22 , G06V10/245 , G06V10/774 , H01J37/244 , H01J37/28 , G06T2207/10061 , G06T2207/20081 , H01J2237/221 , H01J2237/24578 , H01J2237/2814
摘要: A charged particle beam device 100 includes: an irradiation unit 110 configured to irradiate a sample S with a charged particle beam; a particle detection unit 130 configured to detect a particle caused by the irradiation of the sample with the charged particle beam; and a control unit 151 configured to generate an image of the sample based on an output from the particle detection unit, wherein the control unit 151 inputs the image of the sample S into models M1 and M2 for detecting a first structure 401 and a second structure 402, acquires a first detection result related to the first structure 401 and a second detection result related to the second structure 402 from the models M1 and M2, determines locations or regions of the first structure 401 and the second structure 402 based on the first detection result and the second detection result, and outputs an integration result image 203 representing the location or the region of the first structure 401 and the location or the region of the second structure 402.
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公开(公告)号:US12033830B2
公开(公告)日:2024-07-09
申请号:US17944157
申请日:2022-09-13
发明人: Weiming Ren , Xuerang Hu , Qingpo Xi , Xuedong Liu
IPC分类号: H01J37/244 , H01J37/153 , H01J37/28
CPC分类号: H01J37/244 , H01J37/153 , H01J37/28 , H01J2237/0453 , H01J2237/24475 , H01J2237/2448
摘要: Systems and methods of enhancing imaging resolution by reducing crosstalk between detection elements of a secondary charged-particle detector in a multi-beam apparatus are disclosed. The multi-beam apparatus may comprise an electro-optical system for projecting a plurality of secondary charged-particle beams from a sample onto a charged-particle detector. The electro-optical system may include a first pre-limit aperture plate comprising a first aperture configured to block peripheral charged-particles of the plurality of secondary charged-particle beams, and a beam-limit aperture array comprising a second aperture configured to trim the plurality of secondary charged-particle beams. The charged-particle detector may include a plurality of detection elements, wherein a detection element of the plurality of detection elements is associated with a corresponding trimmed beam of the plurality of secondary charged-particle beams.
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8.
公开(公告)号:US20240212973A1
公开(公告)日:2024-06-27
申请号:US18534853
申请日:2023-12-11
发明人: Kaoru SAKAI , Mayuka OSAKI , Hajime KAWANO
IPC分类号: H01J37/22 , G06T5/70 , G06T5/94 , G06T7/00 , G06T7/70 , G06V10/22 , G06V10/74 , H01J37/244 , H01J37/28
CPC分类号: H01J37/222 , G06T5/70 , G06T5/94 , G06T7/001 , G06T7/70 , G06V10/22 , G06V10/74 , H01J37/244 , H01J37/28 , G06T2207/10061 , G06T2207/30148 , H01J2237/2448
摘要: A processor system capable of communicating with the multi-charged particle beam device includes reducing an influence of first crosstalk caused by a first detector detecting secondary electrons from a second scanning region by recognizing a first ghost caused by the first crosstalk from a first image using the first image. The processor system modifies a first occurrence region of the first ghost, or outputs a defect candidate position as a defect position when the detected defect candidate position is outside the first occurrence region.
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公开(公告)号:US12014896B2
公开(公告)日:2024-06-18
申请号:US17579309
申请日:2022-01-19
申请人: ATTOLIGHT AG
发明人: Matthew J. Davies
IPC分类号: H01J37/244 , H01J37/22
CPC分类号: H01J37/244 , H01J37/228
摘要: A wafer having μLEDs is inspected using cathodoluminescence microscopes. A fast scan is enabled by splitting the CL beam into several beams and sensing the beams with point detectors. Optical filters are inserted in the optical path upstream of the detectors, such that each detector senses a different frequency band. The signals are ratioed and the ratios are compared to expected reference. Regions of extreme value are identified and, if desired, a high resolution scan is performed on the regions or a sample of the regions. Viability score is calculated for each identified region.
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公开(公告)号:US20240186107A1
公开(公告)日:2024-06-06
申请号:US18411525
申请日:2024-01-12
发明人: Bernardo KASTRUP , Johannes Catharinus Hubertus Mulkens , Marinus Aart Van Den Brink , Jozef Petrus Henricus Benschop , Erwin Paul Smakman , Tamara Druzhinina , Coen Adrianus Verschuren
CPC分类号: H01J37/263 , H01J37/023 , H01J37/15 , H01J37/22 , H01J37/244 , H01J37/28 , H01J2237/0245 , H01J2237/2817
摘要: An electron beam inspection apparatus, the apparatus including a plurality of electron beam columns, each electron beam column configured to provide an electron beam and detect scattered or secondary electrons from an object, and an actuator system configured to move one or more of the electron beam columns relative to another one or more of the electron beam columns, the actuator system including a plurality of first movable structures at least partly overlapping a plurality of second movable structures, the first and second movable structures supporting the plurality of electron beam columns.
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