公开(公告)号：US20240371602A1

公开(公告)日：2024-11-07

申请号：US18143666

申请日：2023-05-05

Applicant: Applied Materials, Inc.

Inventor： Frank Sinclair ,  Paul Joseph Murphy ,  Bon-Woong Koo ,  Gregory Edward Stratoti ,  Tseh-Jen Hsieh ,  Alexandre Likhanskii ,  Glenn Green

IPC: H01J37/317 ,  H01J37/08 ,  H01J37/147

Abstract: An ion implanter that includes an ion source to generate an ion beam, a platen disposed in a process chamber to support a workpiece that is treated with the ion beam, and a plasma flood gun that results in fewer particles in the process chamber is disclosed. The plasma flood gun includes at least one plasma chamber, each having at least one aperture through which low energy ions and electrons are emitted. A sweeper is located near the aperture, positioned so as to be between the aperture and the upstream components. The sweeper is heated using resistive elements or a halogen lamp so as to elevate its temperature, which limited the amount of deposition that occurs on the sweeper.

公开(公告)号：US12278124B2

公开(公告)日：2025-04-15

申请号：US17513241

申请日：2021-10-28

Applicant: Applied Materials, Inc.

Inventor： D. Jeffrey Lischer ,  Bon-Woong Koo ,  Dawei Sun ,  Chi-Yang Cheng ,  Paul Joseph Murphy ,  Frank Sinclair ,  Gregory Edward Stratoti ,  Tseh-Jen Hsieh ,  Wayne Chen ,  Guy Oteri

IPC: H01L21/67 ,  G05D22/02

Abstract: A load lock in which the pumping speed is controlled so as to minimize the possibility of condensation is disclosed. The load lock is in communication with a vacuum pump and a valve. A controller is used to control the valve such that the supersaturation ratio within the load lock does not exceed a predetermined threshold, which is less than or equal to the critical value at which vapor condenses. In certain embodiments, a computer model is used to generate a profile, which may be a pumping speed profile or a pressure profile, and the valve is controlled according to the profile. In another embodiment, the load lock comprises a temperature sensor and a pressure sensor. The controller may calculate the supersaturation ratio based on these parameters and control the valve accordingly.

公开(公告)号：US20240249908A1

公开(公告)日：2024-07-25

申请号：US18101260

申请日：2023-01-25

Applicant: Applied Materials, Inc.

Inventor： Frank Sinclair ,  Paul Joseph Murphy ,  Bon-Woong Koo ,  Gregory Edward Stratoti ,  Tseh-Jen Hsieh ,  Glenn Green

IPC: H01J37/244 ,  C23C14/48 ,  H01J37/09 ,  H01J37/317

CPC classification number: H01J37/244 ,  C23C14/48 ,  H01J37/09 ,  H01J37/3171 ,  H01J2237/0453 ,  H01J2237/24564

Abstract: A dose cup assembly that results in less particles in a process chamber is disclosed. The dose cup assembly includes a faceplate attached to a back wall of the process chamber, and having an opening; an aperture plate defining a plurality of slots; and a tunnel having walls and sidewalls and having a proximal end and a distal end, located between the faceplate and the aperture plate, such that the proximal end is nearer to the faceplate and the distal end is nearer to the aperture plate; wherein at least one of the faceplate, the walls, the sidewalls or the aperture plate has one or more exposed outer surfaces that comprise silicon. The exposed outer surfaces may be silicon. In some embodiments, the faceplate, the walls, the sidewalls or the aperture plate may be graphite, aluminum, or stainless steel which is coated with silicon or silicon carbide.

公开(公告)号：US20240274404A1

公开(公告)日：2024-08-15

申请号：US18107819

申请日：2023-02-09

Applicant: Applied Materials, Inc.

Inventor： Frank Sinclair ,  Tseh-Jen Hsieh ,  Vikram M. Bhosle ,  Bon-Woong Koo ,  Gregory Edward Stratoti

IPC: H01J37/304 ,  C23C14/22 ,  C23C14/54 ,  H01J37/09 ,  H01J37/317

CPC classification number: H01J37/304 ,  C23C14/221 ,  C23C14/54 ,  H01J37/09 ,  H01J37/3171 ,  H01J2237/006 ,  H01J2237/0453 ,  H01J2237/24564 ,  H01J2237/327

Abstract: An ion implanter and a method for reducing particle formation in a process chamber are disclosed. The ion implanter includes one or more gas sources in communication with the process chamber to introduce an oxygen-containing gas. After certain criteria has been met, a gas treatment process is initiated. This criteria may be related to the number of workpieces that have been processed or based on the number of particles detected in the process chamber. During the gas treatment process, the oxygen-containing gas is introduced and interacts with depositions disposed on the walls of the process chamber to transform the brittle film into a softer more pliable film that may be less susceptible to breaking. In some embodiments, the oxygen-containing gas may be oxygen gas, ozone or oxygen radicals which are introduced to the process chambers. In some embodiments, water vapor is introduced.

公开(公告)号：US20230138326A1

公开(公告)日：2023-05-04

申请号：US17513241

申请日：2021-10-28

Applicant: Applied Materials, Inc.

Inventor： D. Jeffrey Lischer ,  Bon-Woong Koo ,  Dawei Sun ,  Chi-Yang Cheng ,  Paul Joseph Murphy ,  Frank Sinclair ,  Gregory Edward Stratoti ,  Tseh-Jen Hsieh ,  Wayne Chen ,  Guy Oteri

IPC: H01L21/67 ,  G05D22/02

Abstract: A load lock in which the pumping speed is controlled so as to minimize the possibility of condensation is disclosed. The load lock is in communication with a vacuum pump and a valve. A controller is used to control the valve such that the supersaturation ratio within the load lock does not exceed a predetermined threshold, which is less than or equal to the critical value at which vapor condenses. In certain embodiments, a computer model is used to generate a profile, which may be a pumping speed profile or a pressure profile, and the valve is controlled according to the profile. In another embodiment, the load lock comprises a temperature sensor and a pressure sensor. The controller may calculate the supersaturation ratio based on these parameters and control the valve accordingly.