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1.发明公开公开(公告)号：US20240266174A1
公开(公告)日：2024-08-08
申请号：US18431870
申请日：2024-02-02
Applicant: Applied Materials, Inc.
Inventor： Wonjae Lee , Pradeep Kumar Subrahmanyan , D. Jeffrey Lischer , Frank Sinclair
IPC: H01L21/265 , H01L21/66 , H01L21/67
CPC classification number: H01L21/265 , H01L21/67288 , H01L22/12
Abstract: Disclosed systems and techniques are directed to correct an out-of-plane deformation (OPD) of a substrate. The techniques include obtaining, using optical inspection data, a profile of the out-of-plane deformation of the substrate and identifying, using the obtained profile, one or more parameters characterizing a saddle-shaped stress of the substrate. The techniques further include computing, using the one or more identified parameters, one or more characteristics of a stress-compensation layer (SCL) for the substrate and causing the SCL to be deposited on the substrate. The techniques further include causing a stress-mitigation beam to be applied to a plurality of edge regions of the SCL, wherein settings of the stress-mitigation beam are determined using the one or more identified parameters.
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公开(公告)号：US20200381271A1
公开(公告)日：2020-12-03
申请号：US16560326
申请日：2019-09-04
Applicant: APPLIED Materials, Inc.
Inventor： Dawei Sun , Dale K. Stone , D. Jeffrey Lischer , Lyudmila Stone , Steven Anella , Julian G. Blake , Ron Serisky , Daniel A. Hall , Robert H. Bettencourt
Abstract: A heating system for heating a substrate. The heating system may include a susceptor, where the susceptor has a substrate support surface. The heating system may further include a heat transfer layer, disposed on the substrate support surface, where the heat transfer layer comprising an array of aligned carbon nanotubes.
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公开(公告)号：US11545375B2
公开(公告)日：2023-01-03
申请号：US16443043
申请日：2019-06-17
Applicant: Applied Materials, Inc.
Inventor： James D. Strassner , Bradley M. Pomerleau , D. Jeffrey Lischer , Dawei Sun , Michael Paul Rohrer
Abstract: A system and method of heating a workpiece to a desired temperature is disclosed. This system and method consider the physical limitations of the temperature device, such as time lag, temperature offset, and calibration, in creating a hybrid approach that heats the workpiece more efficiently. First, the workpiece is heated using open loop control to heat the workpiece to a threshold temperature. After the threshold temperature is reach, a closed loop maintenance mode is utilized. In certain embodiments, an open loop maintenance mode is employed between the open loop warmup mode and the closed loop maintenance mode. Additionally, a method of calibrating a pyrometer using a contact thermocouple is also disclosed.
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公开(公告)号：US20210296146A1
公开(公告)日：2021-09-23
申请号：US16826970
申请日：2020-03-23
Applicant: Applied Materials, Inc.
Inventor： Michael Blanchard , Steven M. Anella , Brant S. Binns , Jordan B. Tye , D. Jeffrey Lischer
IPC: H01L21/67 , H01L21/677 , H01L21/673
Abstract: A cassette with embedded temperature sensors that is disposed within a load lock is disclosed. The temperature sensors may be disposed in a plurality of shelves of the load lock cassette to monitor the temperature of each of a plurality of workpieces disposed in the load lock. The output of these temperature sensors may be provided to a controller, which controls when the load lock is opened. The load lock cassette may also include cooling channels to accelerate the cooling of the workpieces to improve throughput. The cooling may be controlled using closed loop control, where a controller monitors the temperature of the workpieces during the cooling operation.
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5.发明公开公开(公告)号：US20240266231A1
公开(公告)日：2024-08-08
申请号：US18431909
申请日：2024-02-02
Applicant: Applied Materials, Inc.
Inventor： Wonjae Lee , Pradeep Kumar Subrahmanyan , D. Jeffrey Lischer , Frank Sinclair
CPC classification number: H01L22/12 , C23C14/547 , G01B9/02095 , G01B11/162 , H01L23/562
Abstract: Disclosed systems and techniques are directed to correct an out-of-plane deformation (OPD) of a substrate. The techniques include obtaining, using optical inspection data, an OPD profile of the substrate and obtaining a polynomial representation of the OPD profile to determine a plurality of polynomial coefficients characterizing respective elemental deformation shapes of the substrate. The techniques further include identifying one or more cylindric decompositions of a quadratic part of the OPD profile and computing, using a selected cylindric decomposition of the one or more cylindric decompositions, one or more characteristics of a stress-compensation layer (SCL) for the substrate. The techniques further include causing the SCL to be deposited on the substrate and the SCL to be exposed to a stress-mitigation beam.
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Patent Agency Ranking
公开(公告)号：US20230138326A1
公开(公告)日：2023-05-04
申请号：US17513241
申请日：2021-10-28
Applicant: Applied Materials, Inc.
Inventor： D. Jeffrey Lischer , Bon-Woong Koo , Dawei Sun , Chi-Yang Cheng , Paul Joseph Murphy , Frank Sinclair , Gregory Edward Stratoti , Tseh-Jen Hsieh , Wayne Chen , Guy Oteri
Abstract: A load lock in which the pumping speed is controlled so as to minimize the possibility of condensation is disclosed. The load lock is in communication with a vacuum pump and a valve. A controller is used to control the valve such that the supersaturation ratio within the load lock does not exceed a predetermined threshold, which is less than or equal to the critical value at which vapor condenses. In certain embodiments, a computer model is used to generate a profile, which may be a pumping speed profile or a pressure profile, and the valve is controlled according to the profile. In another embodiment, the load lock comprises a temperature sensor and a pressure sensor. The controller may calculate the supersaturation ratio based on these parameters and control the valve accordingly.
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公开(公告)号：US11543296B2
公开(公告)日：2023-01-03
申请号：US16551128
申请日：2019-08-26
Applicant: Applied Materials, Inc.
Inventor： Eric D. Wilson , Steven Anella , D. Jeffrey Lischer , James McLane , Bradley M. Pomerleau , Dawei Sun
Abstract: A method may include heating a substrate in a first chamber to a platen temperature, the heating comprising heating the substrate on a platen; measuring the platen temperature in the first chamber using a contact temperature measurement; transferring the substrate to a second chamber after the heating; and measuring a voltage decay after transferring the substrate to the second chamber, using an optical pyrometer to measure pyrometer voltage as a function of time.
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公开(公告)号：US20200378837A1
公开(公告)日：2020-12-03
申请号：US16560566
申请日：2019-09-04
Applicant: APPLIED Materials, Inc.
Inventor： Dawei Sun , D. Jeffrey Lischer , Qin Chen , Dale K. Stone , Lyudmila Stone , Steven Anella , Ron Serisky , Chi-Yang Cheng
Abstract: A temperature measurement apparatus. The temperature measurement apparatus may include a temperature sensor body, the temperature sensor body having a substrate support surface; and a heat transfer layer, disposed on the substrate support surface, the heat transfer layer comprising an array of aligned carbon nanotubes.
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公开(公告)号：US20200378832A1
公开(公告)日：2020-12-03
申请号：US16551128
申请日：2019-08-26
Applicant: Applied Materials, Inc.
Inventor： Eric D. Wilson , Steven Anella , D. Jeffrey Lischer , James McLane , Bradley M. Pomerleau , Dawei Sun
Abstract: A method may include heating a substrate in a first chamber to a platen temperature, the heating comprising heating the substrate on a platen; measuring the platen temperature in the first chamber using a contact temperature measurement; transferring the substrate to a second chamber after the heating; and measuring a voltage decay after transferring the substrate to the second chamber, using an optical pyrometer to measure pyrometer voltage as a function of time.
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公开(公告)号：US12278124B2
公开(公告)日：2025-04-15
申请号：US17513241
申请日：2021-10-28
Applicant: Applied Materials, Inc.
Inventor： D. Jeffrey Lischer , Bon-Woong Koo , Dawei Sun , Chi-Yang Cheng , Paul Joseph Murphy , Frank Sinclair , Gregory Edward Stratoti , Tseh-Jen Hsieh , Wayne Chen , Guy Oteri
Abstract: A load lock in which the pumping speed is controlled so as to minimize the possibility of condensation is disclosed. The load lock is in communication with a vacuum pump and a valve. A controller is used to control the valve such that the supersaturation ratio within the load lock does not exceed a predetermined threshold, which is less than or equal to the critical value at which vapor condenses. In certain embodiments, a computer model is used to generate a profile, which may be a pumping speed profile or a pressure profile, and the valve is controlled according to the profile. In another embodiment, the load lock comprises a temperature sensor and a pressure sensor. The controller may calculate the supersaturation ratio based on these parameters and control the valve accordingly.
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