公开(公告)号：US20210225682A1

公开(公告)日：2021-07-22

申请号：US16749336

申请日：2020-01-22

Applicant: Applied Materials, Inc.

Inventor： Dawei Sun ,  Steven M. Anella ,  Qin Chen ,  Ron Serisky ,  Julian G. Blake ,  David J. Chipman

IPC: H01L21/683 ,  B23Q3/154

Abstract: A platen having improved thermal conductivity and reduced friction is disclosed. In one embodiment, vertically aligned carbon nanotubes are grown on the top surface of the platen. The carbon nanotubes have excellent thermal conductivity, thus improving the transfer of heat between the platen and the workpiece. Furthermore, the friction between the carbon nanotubes and the workpiece is much lower than that with conventional embossments, reducing particle generation. In another embodiment, a support plate is disposed on the platen, wherein the carbon nanotubes are disposed on the top surface of the support plate.

公开(公告)号：US11864299B2

公开(公告)日：2024-01-02

申请号：US17740859

申请日：2022-05-10

Applicant: Applied Materials, Inc.

Inventor： David Morrell ,  Dawei Sun ,  Qin Chen

IPC: H05F3/06

CPC classification number: H05F3/06

Abstract: A system and method for reducing charge on a workpiece disposed on a platen is disclosed. The system includes an ionizer to generate ionized gas from the source of backside gas. The ionizer may be used to introduce ionized gas into the backside gas channels of the platen. A controller is used to selectively allow backside gas and/or ionized gas into the backside gas channels. In certain embodiments, the platen also includes an exhaust channel in communication with an exhaust valve to ensure that the pressure within the volume between the top surface of the platen and the workpiece is maintained in a desired range. In one embodiment, the system includes a valving system in communication with the source of backside gas and also in communication with the ionizer. In another embodiment, the amount of ionization performed by the ionizer is programmable.

公开(公告)号：US11875967B2

公开(公告)日：2024-01-16

申请号：US16880500

申请日：2020-05-21

Applicant: Applied Materials, Inc.

Inventor： Qin Chen ,  Julian G. Blake ,  Michael W. Osborne ,  Steven M. Anella ,  Jonathan D. Fischer

IPC: H01J37/317 ,  H01L21/683 ,  H01J37/20 ,  G02B26/08 ,  G02B26/10 ,  H01L21/687

CPC classification number: H01J37/3171 ,  G02B26/0816 ,  G02B26/0875 ,  G02B26/10 ,  H01J37/20 ,  H01L21/687 ,  H01L21/6833

Abstract: An apparatus may include a clamp to clamp a substrate wherein the clamp is arranged opposing a back side of the substrate; and an illumination system, disposed to direct radiation to the substrate, when the substrate is disposed on the clamp, wherein the radiation comprises a radiation energy equal to or above a threshold energy to generate mobile charge in the substrate, where the illumination system is disposed to direct radiation to a front side of the substrate, opposite the back side of the substrate.

公开(公告)号：US11538714B2

公开(公告)日：2022-12-27

申请号：US16880518

申请日：2020-05-21

Applicant: Applied Materials, Inc.

Inventor： Qin Chen ,  Julian G. Blake ,  Michael W. Osborne ,  Steven M. Anella ,  Jonathan D. Fischer

IPC: H01L21/68 ,  H01L21/687 ,  H01L21/683

Abstract: An apparatus may include a clamp to clamp a substrate wherein the clamp is arranged opposing a back side of the substrate; and an illumination system, disposed to direct radiation to the substrate, when the substrate is disposed on the clamp, wherein the radiation comprises a radiation energy, equal to or above a threshold energy to generate mobile charge in the substrate, where the illumination system is disposed to direct radiation to the back side of the substrate.

公开(公告)号：US20210366759A1

公开(公告)日：2021-11-25

申请号：US16880518

申请日：2020-05-21

Applicant: Applied Materials, Inc.

Inventor： Qin Chen ,  Julian G. Blake ,  Michael W. Osborne ,  Steven M. Anella ,  Jonathan D. Fischer

IPC: H01L21/687

Abstract: An apparatus may include a clamp to clamp a substrate wherein the clamp is arranged opposing a back side of the substrate; and an illumination system, disposed to direct radiation to the substrate, when the substrate is disposed on the clamp, wherein the radiation comprises a radiation energy, equal to or above a threshold energy to generate mobile charge in the substrate, where the illumination system is disposed to direct radiation to the back side of the substrate.

公开(公告)号：US20210366757A1

公开(公告)日：2021-11-25

申请号：US16880559

申请日：2020-05-21

Applicant: Applied Materials, Inc.

Inventor： Qin Chen ,  Julian G. Blake ,  Michael W. Osborne ,  Steven M. Anella ,  Jonathan D. Fischer

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/027

Abstract: A method may include providing a substrate in a process chamber, directing radiation from an illumination source to the substrate when the substrate is disposed in the process chamber, and processing the substrate by providing a processing species to the substrate, separate from the radiation, when the substrate is disposed in the process chamber. As such, the radiation may be characterized by a radiation energy, wherein at least a portion of the radiation energy is equal to or greater than 2.5 eV.

公开(公告)号：US20200378837A1

公开(公告)日：2020-12-03

申请号：US16560566

申请日：2019-09-04

Applicant: APPLIED Materials, Inc.

Inventor： Dawei Sun ,  D. Jeffrey Lischer ,  Qin Chen ,  Dale K. Stone ,  Lyudmila Stone ,  Steven Anella ,  Ron Serisky ,  Chi-Yang Cheng

IPC: G01K1/16 ,  G01K7/02 ,  G01J5/10 ,  G01J5/02

Abstract: A temperature measurement apparatus. The temperature measurement apparatus may include a temperature sensor body, the temperature sensor body having a substrate support surface; and a heat transfer layer, disposed on the substrate support surface, the heat transfer layer comprising an array of aligned carbon nanotubes.

公开(公告)号：US11473978B2

公开(公告)日：2022-10-18

申请号：US16560566

申请日：2019-09-04

Applicant: APPLIED Materials, Inc.

Inventor： Dawei Sun ,  D. Jeffrey Lischer ,  Qin Chen ,  Dale K. Stone ,  Lyudmila Stone ,  Steven Anella ,  Ron Serisky ,  Chi-Yang Cheng

IPC: G01K1/16 ,  G01J5/02 ,  G01J5/10 ,  G01K7/02

Abstract: A temperature measurement apparatus. The temperature measurement apparatus may include a temperature sensor body, the temperature sensor body having a substrate support surface; and a heat transfer layer, disposed on the substrate support surface, the heat transfer layer comprising an array of aligned carbon nanotubes.

公开(公告)号：US11315819B2

公开(公告)日：2022-04-26

申请号：US16880540

申请日：2020-05-21

Applicant: Applied Materials, Inc.

Inventor： Qin Chen ,  Julian G. Blake ,  Michael W. Osborne ,  Steven M. Anella ,  Jonathan D. Fischer

IPC: H01L21/683 ,  H05B3/00 ,  H05F3/00 ,  H01J37/05 ,  H01J37/141 ,  H05B3/26 ,  H01J37/147 ,  H02N13/00

Abstract: A method may include providing a substrate on a clamp, and directing radiation from an illumination source to the substrate when the substrate is disposed on the clamp during substrate processing, wherein the radiation is characterized by a radiation energy, wherein at least a portion of the radiation energy is equal to or greater than 2.5 eV.

公开(公告)号：US20230371160A1

公开(公告)日：2023-11-16

申请号：US17740859

申请日：2022-05-10

Applicant: Applied Materials, Inc.

Inventor： David Morrell ,  Dawei Sun ,  Qin Chen

IPC: H05F3/06

CPC classification number: H05F3/06

Abstract: A system and method for reducing charge on a workpiece disposed on a platen is disclosed. The system includes an ionizer to generate ionized gas from the source of backside gas. The ionizer may be used to introduce ionized gas into the backside gas channels of the platen. A controller is used to selectively allow backside gas and/or ionized gas into the backside gas channels. In certain embodiments, the platen also includes an exhaust channel in communication with an exhaust valve to ensure that the pressure within the volume between the top surface of the platen and the workpiece is maintained in a desired range. In one embodiment, the system includes a valving system in communication with the source of backside gas and also in communication with the ionizer. In another embodiment, the amount of ionization performed by the ionizer is programmable.