公开(公告)号：US08052858B2

公开(公告)日：2011-11-08

申请号：US10530516

申请日：2003-10-09

Applicant: Motoki Hiraoka ,  Takeshi Bessho ,  Sigeru Sibata

Inventor： Motoki Hiraoka ,  Takeshi Bessho ,  Sigeru Sibata

IPC: B05D3/02 ,  C25D5/56 ,  C25D5/34 ,  C23C28/02 ,  C23C18/18 ,  C23C18/22 ,  C23C18/26

CPC classification number: C23C18/1653 ,  C23C18/2006 ,  C23C18/204

Abstract: A resin material is brought into contact with a first solution containing ozone, and at the same time, ultraviolet rays are irradiated. The activation due to the treatment with ozone water and the activation due to the treatment with ultraviolet rays are synergistically operated to enable the formation of a plated coating having excellent adhesive strength by a short treatment. In addition, even by a long treatment, the adhesive strength can be restrained from lowering. Consequently, a plated coating having excellent adhesion can be formed without roughening the surface of the resin material by a short pretreatment.

Abstract translation: 使树脂材料与含有臭氧的第一溶液接触，同时照射紫外线。 由臭氧水处理引起的活化和紫外线处理引起的活化协同作用，能够通过短时间处理形成具有优异粘合强度的镀覆层。 此外，即使通过长时间处理，也可以抑制粘合强度的降低。 因此，可以通过短预处理而不使树脂材料的表面粗糙化来形成具有优异粘附性的镀覆涂层。

公开(公告)号：US5685898A

公开(公告)日：1997-11-11

申请号：US513884

申请日：1995-11-02

Applicant: Olivier Dupuis ,  Mary-Helene Delvaux ,  Pascale Dufour ,  Marie-Carmen Malerno Fernandez ,  Jean-Philippe Soumillion ,  Henri Sendrowicz

Inventor： Olivier Dupuis ,  Mary-Helene Delvaux ,  Pascale Dufour ,  Marie-Carmen Malerno Fernandez ,  Jean-Philippe Soumillion ,  Henri Sendrowicz

IPC: C08K3/00 ,  C08J3/215 ,  C08K3/10 ,  C08K3/18 ,  C08K5/09 ,  C08K13/02 ,  C08L101/00 ,  C08L101/12 ,  C23C18/26 ,  C23C18/28 ,  C23C18/30 ,  H01L21/28 ,  H01L21/3205 ,  C23C18/16 ,  C23C18/20

CPC classification number: C23C18/30 ,  C08K13/02

Abstract: A polymeric resin of adjustable viscosity and pH for depositing catalytic palladium on a substrate, comprising in combination a palladium salt, a complexing agent of the carboxylic acid or chloride type, a water soluble polymer containing hydroxyl and/or carboxyl groups, an alkaline compound and a solvent chosen amongst water, methanol and ethanol, its preparation method and applications.

Abstract translation: PCT No.PCT / BE94 / 00099 Sec。 371日期：1995年11月2日 102（e）日期1995年11月2日PCT 1994年12月30日PCT PCT。 第WO95 / 18879号公报 日期1995年7月13日一种可调粘度和pH的聚合树脂，用于在基底上沉积催化剂钯，其包括钯盐，羧酸或氯化物络合剂，含有羟基和/或羧基的水溶性聚合物 ，碱性化合物和选自水，甲醇和乙醇的溶剂，其制备方法和应用。

公开(公告)号：US4751106A

公开(公告)日：1988-06-14

申请号：US911453

申请日：1986-09-25

Applicant: Gary M. Wilkinson ,  Cheryl A. Deckert ,  Jeffrey J. Doubrava

Inventor： Gary M. Wilkinson ,  Cheryl A. Deckert ,  Jeffrey J. Doubrava

IPC: C23C18/16 ,  C23C18/18 ,  C23C18/24 ,  C23C18/26 ,  C23C18/28 ,  C23C18/30 ,  C23C18/31 ,  C23C18/40 ,  H05K3/00 ,  H05K3/38 ,  H05K3/42 ,  B05D5/12

CPC classification number: H05K3/422 ,  C23C18/28 ,  H05K3/42 ,  H05K2203/0796 ,  H05K2203/122 ,  H05K3/0055 ,  H05K3/383 ,  H05K3/427

Abstract: A process for the formation of a plated through-hole printed circuit board comprising treating a circuit board base material as follows:1. condition with an oxidant solution;2(A). contact with a copper etchant that etches copper and neutralizes oxidant residues on the surface to be plated; and2(B). contact with a conditioner that conditions the board surface for enhanced catalyst adsorption; or2(A). contact with a neutralizer for oxidant residues that neutralizes said residues and conditions the board surface for enhanced catalyst adsorption; and2(B). contact with a copper etchant; and3. catalyze the board; and4. plate electroless metal onto catalyzed surfaces from a plating solution containing a source of halide ions in a concentration of at least 0.1 moles per liter of solution.The process is characterized by the absence of a step of acceleration and contains fewer processing steps than prior art processes.

Abstract translation: 一种用于形成电镀通孔印刷电路板的方法，包括如下处理电路板基材：1.用氧化剂溶液的状态; 2（A）。 与腐蚀铜并消除待镀表面上的氧化剂残留物的铜蚀刻剂接触; 和2（B）。 与调节板表面的调理剂接触以增强催化剂吸附; 或2（A）。 与用于中和所述残留物的氧化剂残余物的中和剂接触，并且调节板表面以增强催化剂吸附; 和2（B）。 与铜蚀刻剂接触; 和3.催化董事会; 和4.从含有浓度为每升溶液至少0.1摩尔的卤离子源的电镀溶液将催化表面上的无电镀金属镀到板上。 该方法的特征在于不存在加速步骤，并且比现有技术方法包含较少的加工步骤。

公开(公告)号：US3907621A

公开(公告)日：1975-09-23

申请号：US22744672

申请日：1972-02-18

Applicant: PHOTOCIRCUITS CORP

Inventor： POLICHETTE JOSEPH ,  LEECH EDWARD J ,  NUZZI FRANCIS J

IPC: C23C18/16 ,  C23C18/26 ,  C23C18/28 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02 ,  C23F1/00

CPC classification number: H05K3/185 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/26 ,  H05K3/181 ,  H05K3/182 ,  H05K3/381 ,  H05K3/387 ,  H05K2203/0783 ,  H05K2203/122

Abstract: There is provided a new process for the production of printed circuits. The process comprises coating a base with a layer of copper, nickel, cobalt or iron salts or salt compositions, which on exposure to radiant energy, such as heat, light, etc., thermal or chemical reducing agents are converted to a layer of metal nuclei that is non-conductive, but which is capable of catalyzing the deposition of metal onto the base from an electroless metal deposition solution in contact with the metal nuclei.

Abstract translation: 为生产印刷电路提供了新的工艺。 该方法包括用一层铜，镍，钴或铁盐或盐组合物涂覆碱，其在暴露于辐射能（例如热，光等）的情况下，将热或化学还原剂转化为金属层 核，其是非导电的，但是能够从与金属核接触的无电金属沉积溶液催化金属沉积到基底上。

公开(公告)号：US3616294A

公开(公告)日：1971-10-26

申请号：US3616294D

申请日：1967-05-03

Applicant: STANDARD OIL CO

Inventor： KHELGHATIAN HABET M ,  FITZPATRICK JAMES E ,  JEZL JAMES L

IPC: B44D3/18 ,  C23C18/24 ,  C23C18/26 ,  C23B5/60 ,  B44D1/22

CPC classification number: C03C10/0054 ,  B44D3/18 ,  C23C18/24 ,  C23C18/26 ,  Y10S205/927

Abstract: In the art of treating plastic surfaces to improve the adhesion of paints or metals thereto wherein the surface is treated with a strong mineral acid solution containing hexavalent chromium, the adhesion is improved by adding to the acid solution from 0.1 to 6 percent by volume of a petroleum fraction boiling between 80* C. and 240* C. which is rich in branched chain aliphatic hydrocarbons and alicyclic hydrocarbons, olefins containing a neopentyl group, or carboxylic acids containing a neopentyl group.

公开(公告)号：US3563784A

公开(公告)日：1971-02-16

申请号：US3563784D

申请日：1968-09-09

Applicant: MACDERMID INC

Inventor： INNES WILLIAM P ,  OTTAVIO EUGENE D D ,  BROWN SHARON D

IPC: C23C18/20 ,  C23C18/26 ,  C23C3/00 ,  B44D1/40

CPC classification number: C23C18/30 ,  C23C18/208 ,  C23C18/24 ,  C23C18/26 ,  C23C18/285

Abstract: AQUEOUS DILUTE SURFACTANT SOLUTIONS ARE EMPLOYED IN THE TREATMENT OF PLASTIC SUBSTRATES TO PREPARE THEM FOR ELECTROLESS PLAING TO ENSURE COMPLETE COVERAGE OF THE SUBSTRATE SURFACE BY THE METAL. THE SUBSTRATES ARE IMMERSED IN THE SUFACTANT SOLUTION AS A PRELIMINARY STEP IMMEDIATELY PRECEDING THE ACTIVATION OF THE SUBSTRATE IN THE NORMAL CYCLE OF ELECTROLESS PLATING OPERATIONS, SUPPLANTING VARIOUS OTHER PRE-ACTIVATION STEPS AND, UNLIKE SUCH PRIOR STEPS, BEING OPERATIVE FOR ALL TYPES OF SYNTHETIC RESINS ENCOUNTERED IN ELECTROLESS PLATING OPERATIONS.

公开(公告)号：US3445264A

公开(公告)日：1969-05-20

申请号：US3445264D

申请日：1965-06-24

Applicant: IBM

Inventor： HAINES ROBERT S

IPC: C08J7/12 ,  C23C18/20 ,  C23C18/26 ,  G11B5/702 ,  G11B5/73 ,  H01F10/28 ,  H01F41/24 ,  B44D1/20

CPC classification number: H01F41/24 ,  C08J7/12 ,  C23C18/208 ,  C23C18/26 ,  C23C18/28 ,  C23C18/30 ,  G11B5/7028 ,  G11B5/73 ,  G11B5/7305 ,  H01F10/28

公开(公告)号：US20220195219A1

公开(公告)日：2022-06-23

申请号：US17577592

申请日：2022-01-18

Applicant: AC PRODUCTS, INC.

Inventor： David TOMLINSON ,  Bryan VU ,  James WICHMANN ,  Peter WEISSMAN ,  Gregory DANCY ,  Thomas FARRELL

IPC: C09D9/00 ,  C09D175/04 ,  C09D175/02 ,  C23C18/26 ,  C23F1/14

Abstract: A method for reducing adhesion between a maskant and a substrate, wherein the maskant is adhered to a surface of the substrate, the method comprising applying a composition to the maskant.

公开(公告)号：US20180202048A1

公开(公告)日：2018-07-19

申请号：US15748251

申请日：2016-07-21

Applicant: BASF SE

Inventor： Axel KIRSTE ,  Tobias URBAN ,  Fabio NICOLINI ,  Simone LUTTER ,  Frank RICHTER ,  Andre CEZANNE

IPC: C23C18/26 ,  C23C18/20 ,  C23C18/40 ,  C23C18/34 ,  C23C18/16 ,  C23C18/30

CPC classification number: C23C18/26 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/2026 ,  C23C18/2073 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/34 ,  C23C18/40

Abstract: The invention relates to a process for coating plastic surfaces with metals, especially plastic surfaces composed of acrylonitrile/butadiene/styrene copolymers (ABS) and composed of mixtures of these copolymers with other plastics (ABS blends), using an etch solution (composition C) comprising at least one ionic liquid IL, wherein the process comprises the treating of the plastic surface after the etching with an aqueous rinse solution RS while applying ultrasound.

公开(公告)号：US6087258A

公开(公告)日：2000-07-11

申请号：US764001

申请日：1996-12-12

Applicant: Logan Lloyd Simpson ,  Cindy Reidsema Simpson ,  Joseph Edward Varsik

Inventor： Logan Lloyd Simpson ,  Cindy Reidsema Simpson ,  Joseph Edward Varsik

IPC: C23C18/14 ,  C23C18/26 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/40 ,  H01L21/44

CPC classification number: H05K3/105 ,  C23C18/14 ,  H05K3/185 ,  H05K3/403 ,  H01L2924/0002 ,  H05K2201/09645 ,  H05K3/0082 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A method for selectively metallizing one or more through-holes, other openings (such as slots), or edges of an electronic circuit package comprising the steps of forming a layer of seeding solution on a drilled surface of a substrate of interest exposing this layer to light of appropriate wavelength, through a mask that does not completely cover the through-holes or openings and thereby results in the formation of metal seed on regions of the substrate surface corresponding to the regions of the layer of seeding solution exposed to light; removing the unexposed regions of the layer of seeding solution by subjecting the exposed and unexposed regions of the layer of seeding solution to an alkaline solution. Thereafter, additional metal is deposited, e.g., plated, onto the metal seed using conventional techniques. Significantly, this method does not involve the use of a photoresist, or of a corresponding chemical developer or photoresist stripper. Of additional significance, this method yields plated through-holes or other openings, each of which can accommodate multiple wires, rather then the traditional one wire per through-hole.

Abstract translation: 一种用于选择性地金属化一个或多个通孔，电子电路封装的其它开口（例如槽）或边缘的方法，包括以下步骤：在感兴趣的衬底的钻孔表面上形成接种溶液层，从而将该层暴露于 通过不完全覆盖通孔或开口的掩模，从而导致在与暴露于光的接种溶液层的区域相对应的基底表面的区域上形成金属种子; 通过使接种溶液层的暴露和未曝光区域经受碱溶液来除去接种溶液层的未曝光区域。 此后，使用常规技术将另外的金属沉积，例如电镀到金属种子上。 重要的是，该方法不涉及光致抗蚀剂或相应的化学显影剂或光致抗蚀剂剥离剂的使用。 具有其他意义的是，该方法产生电镀通孔或其他开口，每个开口可以容纳多条电线，而不是每个通孔的传统单线。