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公开(公告)号：US6041828A
公开(公告)日：2000-03-28
申请号：US996757
申请日：1997-12-23
申请人： Achim Baukloh , Ulrich Reiter
发明人： Achim Baukloh , Ulrich Reiter
CPC分类号： C23C18/1824 , C23C18/1601 , C23C18/1616 , C23C18/1676 , C23C18/168 , C23C18/31 , C23C18/54 , F16L58/08
摘要： A copper installation pipe having a tin coating that is applied with temperature control so as to be adherent over the entire inner surface. The thickness of the intermetallic phase formed at the transition from the copper pipe to the tin coating is less than 20%, preferably less than 5% of the overall coating thickness. In addition, a method for coating an installation pipe using chemical treatment, where the temperature of the tinning solution is selectively varied. To ensure the smallest possible intermetallic phase at the copper surface, one begins the tinning process at a low temperature. This promotes the formation of a large number of uniformly distributed nuclei of crystallization having the same orientation. The temperature is then selectively adjusted to promote crystal growth, the result being that the crystals grow rapidly with the orientation remaining constant. One then achieves a dense tin coating having a minimal exposed surface area.
摘要翻译： 一种铜安装管，其具有施加温度控制以在整个内表面上粘附的锡涂层。 在从铜管到锡涂层的过渡处形成的金属间相的厚度小于总涂层厚度的20％，优选小于5％。 另外，使用化学处理涂布安装管的方法，其中选择性地改变镀锡溶液的温度。 为了确保铜表面最小的金属间相，可以在低温下开始镀锡工艺。 这促进了具有相同取向的大量均匀分布的结晶核的形成。 然后选择性地调节温度以促进晶体生长，结果是随着取向保持恒定，晶体快速生长。 然后，实现具有最小暴露表面积的致密锡涂层。
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公开(公告)号：US4560593A
公开(公告)日：1985-12-24
申请号：US662546
申请日：1984-10-19
申请人： Herbert Naarmann , Volker Munch , Klaus Penzien
发明人： Herbert Naarmann , Volker Munch , Klaus Penzien
IPC分类号： C23C14/14 , C23C18/16 , C23C18/31 , C23C18/34 , C23C18/38 , C23C18/44 , C23C18/52 , C25D5/56 , H05K3/18 , C23C3/02
摘要： A process for depositing metals onto electrically conductive, polymeric carriers, wherein a finely divided metal M having a standard potential E.sub.o of >-2 V is deposited, from a solution of a metal cation compound of the formula (I) ##EQU1## where M', L.sup.1, L.sup.2, L.sup.3, L.sup.4, l, m, n, o, and p are as defined in the claims, in an aprotic polar or non-polar solvent, onto a polymeric, electrically conductive carrier of the formula (II) ##EQU2## where M" is Li, Na, K, Rb or Cs,P is P=--CH--, --C.sub.6 H.sub.4 --, --C.sub.4 H.sub.2 S--, --C.sub.6 H.sub.4 S--, --C.sub.4 H.sub.2 O--, --C.sub.4 H.sub.2 NH-- --C.sub.6 H.sub.4 O-- or --C.sub.5 H.sub.3 N--y is from 0.001 to 0.6 andx is from 5 to 1,000, or onto a polymeric, electrically conductive carrier of the formula (III)[(P)(X).sub.y ].sub.x (III)whereP is one of the groups listed for formula (II), X is ClO.sub.4.sup..crclbar., AsF.sub.6.sup..crclbar., PF.sub.6.sup..crclbar., SbF.sub.6.sup..crclbar., BF.sub.4.sup..crclbar., HSO.sub.4.sup..crclbar., CF.sub.3 SO.sub.3.sup..crclbar. or Br.sup..crclbar.,y is from 0.001 to 0.6 andx is from 5 to 1,000, by reduction, preferably at from -100.degree. to +100.degree. C. The electrically conductive, polymeric systems can be employed in the electrical industry for the production of solar cells, for converting and fixing radiation, and for the production of electric and magnetic switches and electrical storage devices, and can also be used as heterogeneous catalysts and to provide an antistatic finish on plastics.
摘要翻译： 一种将金属沉积在导电聚合物载体上的方法，其中从式（I）的化学式（I）的化学式（I）的化学物质中沉积出具有> -2V的标准电位Eo的细碎金属M（I ）其中M'，L1，L2，L3，L4，l，m，n，o和p如权利要求中所定义，在非质子传递极性或非极性溶剂中， （II）其中M“是Li，Na，K，Rb或Cs，P是P = -CH-，-C6H4-，-C4H2S-，-C6H4S-， -C 4 H 2 O-，-C 4 H 2 NH-C 6 H 4 O-或-C 5 H 3 N-y为0.001至0.6，x为5至1,000，或通式（III）[（P）（X）y）的聚合导电载体上 ] x（III）其中P是式（II）中所列的基团之一，X是ClO 4（ - ），AsF 6（ - ），PF 6（ - ），SbF 6（ - ），BF 4（ - ），HSO 4 ，CF 3 SO 3（ - ）或Br（ - ），y为0.001至0.6，x为5至1,000，通过还原，优选为-100至+ 100℃。可使用导电聚合体系 在电气工业中用于生产太阳能电池，用于转换和固定辐射，以及用于生产电磁开关和蓄电装置，并且还可以用作非均相催化剂并在塑料上提供抗静电涂饰。
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3.发明授权
公开(公告)号：US4534797A
公开(公告)日：1985-08-13
申请号：US567723
申请日：1984-01-03
CPC分类号： C23C18/40
摘要： An electroless copper plating bath which is in the take mode is provided by determining the amount in the bath of at least four of the components selected from the group of oxygen, reducing agent, cyanide salt, cupric salt, and complexing agent; solving the equation:R=(CABD)/Ewherin C is the concentration of cupric salt, A is the concentration of reducing agent, B is the concentration of oxygen, D is the concentration of cyanide salt, E is the concentration of complexing agent, and R is a unitless number.The bath is provided with quantities of the above ingredients so that R in the equation is between about 5 and about 15.
摘要翻译： 通过确定浴中至少四种选自氧，还原剂，氰化物盐，铜盐和络合剂的组分中的量来提供处于取样模式的化学镀铜浴; 求解方程：R =（CABD）/ E，C是铜盐的浓度，A是还原剂的浓度，B是氧的浓度，D是氰化物盐的浓度，E是络合剂的浓度 ，R是无单位数。 浴中提供了上述成分的数量，使得方程式中的R为约5至约15。
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公开(公告)号：US4525390A
公开(公告)日：1985-06-25
申请号：US588035
申请日：1984-03-09
摘要： Copper is deposited onto a substrate by plating a first layer of copper onto the substrate from an electroless plating bath and plating a second layer of copper onto the first layer of copper from a second and different electroless plating bath. The first and second plating baths differ from each other in at least the cyanide content and oxygen content. The process reduces plating void defects and reduces nodule formation.
摘要翻译： 通过从无电解镀浴将铜的第一层镀到衬底上并将铜从第二和不同的化学镀浴镀到第一层铜上，从而将铜沉积到衬底上。 至少氰化物含量和氧含量，第一和第二电镀槽彼此不同。 该方法减少电镀空隙缺陷并减少结节形成。
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公开(公告)号：US4520046A
公开(公告)日：1985-05-28
申请号：US510428
申请日：1983-06-30
申请人： John E. McCaskie , Chris Tsiamis
发明人： John E. McCaskie , Chris Tsiamis
摘要： A simple and highly effective process for preparing the surface and plating a plastic or elastomer material is disclosed by the present invention.A uniform, highly adherent metal layer is deposited by the claimed process. The surface of the materials to be plated is prepared by exposure to a gas etch atmosphere and activation of the etched surface by providing a metal colloid thereon. Another aspect relates to the use of a one-step or two-step conditioner treatment in the process for improved results.After the surface preparation and activation, a desired metal coating can be electroless metal plated in a conventional manner.
摘要翻译： 本发明公开了一种用于制备表面和镀覆塑料或弹性体材料的简单且高效的方法。 通过要求保护的方法沉积均匀的，高附着的金属层。 要镀覆的材料的表面通过暴露在气体蚀刻气氛中并通过在其上提供金属胶体来激活蚀刻表面来制备。 另一方面涉及在该方法中使用一步或两步调理剂处理以获得改进的结果。 在表面制备和活化之后，所需的金属涂层可以以常规方式进行无电金属镀覆。
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公开(公告)号：US4503131A
公开(公告)日：1985-03-05
申请号：US340369
申请日：1982-01-18
申请人： Donald W. Baudrand
发明人： Donald W. Baudrand
CPC分类号： H05K3/244 , H01B1/026 , H01L23/48 , H01L2924/0002 , Y10S428/926 , Y10S428/929 , Y10S428/936 , Y10T428/12889 , Y10T428/1291 , Y10T428/12944
摘要： Electrical contact materials are provided which belong to the general category of copper that is overplated with a noble metal, usually gold. The improvement resides in the provision of an electroless nickel deposit laid down over the copper layer and under the gold layer, which electroless nickel deposit is laid down from a particular class of nickel-boron or nickel-phosphorus baths.
摘要翻译： 提供了电接触材料，它们属于通常是金的贵金属镀覆的铜的一般类别。 改进在于提供放置在铜层和金层之下的无电镍沉积物，其中无电镍沉积物从特定类别的镍 - 硼或镍 - 磷浴放置。
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公开(公告)号：US4495216A
公开(公告)日：1985-01-22
申请号：US400884
申请日：1982-07-22
申请人： Gunnar Soerensen , Leo G. Svendsen
发明人： Gunnar Soerensen , Leo G. Svendsen
CPC分类号： C23C18/285 , H05K3/182 , Y10T428/2998
摘要： A powdered composition for use in dry sensitization for electroless metal deposition. The composition contains a hydrophobic thermoplastic material having deposited on its surface a surfactant and a sensitizing tin compound.
摘要翻译： 用于无电金属沉积的干燥敏化的粉末状组合物。 该组合物含有在其表面上沉积有表面活性剂和敏化锡化合物的疏水性热塑性材料。
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8.发明授权Nickel and/or cobalt chemical plating bath using a reducing agent based on boron or phosphorous 失效使用基于硼或磷的还原剂的镍和/或钴化学镀浴
公开(公告)号：US4486233A
公开(公告)日：1984-12-04
申请号：US518431
申请日：1983-07-29
CPC分类号： C23C18/34
摘要： A nickel and/or cobalt chemical plating bath comprises: a salt of the metal(s) to be deposited; one or more complexing agents of said metal(s), a reducing agent based on boron or phosphorous; and a stabilizing agent. To avoid including sources of corrosion and/or toxic substances in the plating, the stabilizing agent comprises a water soluble organic compound which possesses a readily accessible electron pair, and which does not include any metal or metalloid from group IIIa (other than boron or aluminum), IVa (other than carbon), Va (other than nitrogen or phosphorous), VIa (other than oxygen), or VIIa (other than fluorine or chlorine).
摘要翻译： 镍和/或钴化学镀液包括：要沉积的金属的盐; 所述金属的一种或多种络合剂，基于硼或磷的还原剂; 和稳定剂。 为了避免在电镀中包含腐蚀源和/或有毒物质，稳定剂包括具有容易获得的电子对的水溶性有机化合物，并且不包括IIIa族（硼或铝以外的）金属或准金属 ），IVa（除碳以外），Va（除了氮或磷以外），VIa（除氧以外）或VIIa（氟或氯以外）。
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公开(公告)号：US4450191A
公开(公告)日：1984-05-22
申请号：US413225
申请日：1982-09-02
申请人： Donald A. Arcilesi
发明人： Donald A. Arcilesi
CPC分类号： C23C18/40
摘要： A process and composition for use in electroless copper plating where the process includes contacting a substrate with a solution comprising copper, a complexing agent, a reducing agent, and a pH adjuster. A stabilizer may also be used. The improvement of the present invention includes contacting the substrate with a solution further comprising ammonium ions present in an amount effective to function as a plating rate controller. The improved solution is relatively stable, easy to control, and is of versatile use.
摘要翻译： 一种用于无电镀铜的方法和组合物，其中该方法包括使基底与包含铜，络合剂，还原剂和pH调节剂的溶液接触。 也可以使用稳定剂。 本发明的改进包括使基底与进一步包含以有效起到电镀速率控制器的作用的量存在的铵离子的溶液接触。 改进的解决方案相对稳定，易于控制，具有通用性。
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10.发明授权
公开(公告)号：US4448811A
公开(公告)日：1984-05-15
申请号：US505133
申请日：1983-06-16
申请人： Warren R. Doty , Timothy J. Kinney
发明人： Warren R. Doty , Timothy J. Kinney
摘要： A process for treating a polymeric plastic substrate to render it receptive to electroless plating in a process of the type including the steps of etching the substrate and activating the etched substrate. The present improvement includes the step of accelerating the activated substrate with an improved aqueous accelerating solution containing an aqueous soluble compatible oxidizing agent present in an amount effective to increase the activity of the accelerating solution. The improved accelerating solution inhibits the plating of stop-off coatings and plating racks and is of versatile use.
摘要翻译： 一种用于处理聚合物塑料基材以使其接受化学镀的方法，该方法包括以下步骤：蚀刻基材并激活蚀刻的基材。 本改进包括用改善的含水促进溶液加速活化的底物的步骤，所述改进的含水促进溶液含有水溶性相容性氧化剂，其量以有效提高加速溶液的活性的量存在。 改进的加速溶液抑制了停止涂层和电镀架的电镀，并且具有通用性。
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