公开(公告)号：US4486233A

公开(公告)日：1984-12-04

申请号：US518431

申请日：1983-07-29

申请人： Pierre Josso ,  Pierre Lepetit ,  Pierre Mazars ,  Marcel J. Massard, deceased

发明人： Pierre Josso ,  Pierre Lepetit ,  Pierre Mazars ,  Marcel J. Massard, deceased

IPC分类号： C23C18/34 ,  C23C3/02

CPC分类号： C23C18/34

摘要： A nickel and/or cobalt chemical plating bath comprises: a salt of the metal(s) to be deposited; one or more complexing agents of said metal(s), a reducing agent based on boron or phosphorous; and a stabilizing agent. To avoid including sources of corrosion and/or toxic substances in the plating, the stabilizing agent comprises a water soluble organic compound which possesses a readily accessible electron pair, and which does not include any metal or metalloid from group IIIa (other than boron or aluminum), IVa (other than carbon), Va (other than nitrogen or phosphorous), VIa (other than oxygen), or VIIa (other than fluorine or chlorine).

摘要翻译： 镍和/或钴化学镀液包括：要沉积的金属的盐; 所述金属的一种或多种络合剂，基于硼或磷的还原剂; 和稳定剂。 为了避免在电镀中包含腐蚀源和/或有毒物质，稳定剂包括具有容易获得的电子对的水溶性有机化合物，并且不包括IIIa族（硼或铝以外的）金属或准金属 ），IVa（除碳以外），Va（除了氮或磷以外），VIa（除氧以外）或VIIa（氟或氯以外）。