公开(公告)号：US20250058432A1

公开(公告)日：2025-02-20

申请号：US18234814

申请日：2023-08-16

Applicant: GrayMatter Robotics Inc.

Inventor： Miguel A. Chavez-Garcia ,  Satyandra K. Gupta ,  Ariyan M. Kabir ,  Vihan Krishnan ,  Ashish Kulkarni ,  Ceasar G. Navarro ,  Husein M. Noble ,  Martin G. Philo ,  Christian A. Salinas ,  Brual C. Shah

IPC: B24D9/08 ,  B24B49/12 ,  B24B49/18

Abstract: A system includes: a pad removal assembly; a replacement pad reservoir; an inspection unit; and a controller. The pad removal assembly includes: a separating element arranged proximal a slot; and a guide surface opposite the separating element. The replacement pad reservoir: arranged adjacent the separating element and housing sanding pads configured to couple the sanding head; and including an aperture in alignment with the guide surface. The inspection unit includes an optical sensor defining a field of view directed toward an imaging plane. The controller configured to: access an image recorded by the optical sensor depicting an abrasive area of a sanding pad arranged on a sanding head; extract features from the image; interpret an abrasive degradation for the abrasive area in the image based on the features; and in response to the abrasive degradation exceeding a threshold degradation, triggering a tool change cycle.

公开(公告)号：US20250050462A1

公开(公告)日：2025-02-13

申请号：US18721138

申请日：2022-10-25

Applicant: EBARA CORPORATION

Inventor： Makoto KASHIWAGI

IPC: B24B49/00 ,  B24B7/04 ,  B24B27/033 ,  B24B41/06 ,  B24B49/12 ,  H01L21/02

Abstract: The present invention relates to a substrate processing method and a substrate processing apparatus for processing a substrate, such as a wafer. In the substrate processing method, rollers (11a, 11b) secured to eccentric shafts (13a, 13b) including a reference shaft (13a) and a movable shaft (13b) are brought into contact with the periphery of a substrate (W) having a notch (Nw), and further the rollers (11a, 11b) are moved in a circular motion, thereby rotating and circularly moving the substrate (W), and further, processing the substrate (W) by bringing a processing tool (201) into contact with the substrate (W). During processing of the substrate (W), a rotational speed of the substrate (W) is calculated based on measured values of a notch detection sensor (77) which is capable of detecting that the notch (Nw) has passed the movable shaft (13b), and an alarm is issued when the rotational speed of the substrate (W) is out of an allowable range which is set with respect to a theoretical rotational speed of the substrate (W).

公开(公告)号：US12220782B2

公开(公告)日：2025-02-11

申请号：US17647065

申请日：2022-01-05

Applicant: DISCO CORPORATION

Inventor： Zhibo Su ,  Kazuki Terada

IPC: B23Q3/157 ,  B24B27/06 ,  B24B41/04 ,  B24B45/00 ,  B24B49/00 ,  B24B49/12 ,  B24B53/12 ,  B24B55/04 ,  B28D5/02 ,  B23Q3/155 ,  B23Q11/08 ,  B23Q13/00

Abstract: A cutting apparatus includes a cutting unit including a spindle as a rotational shaft and a mount flange for mounting a cutting blade thereon, the mount flange being fixed to a distal end of the spindle, a support unit for supporting a cutting blade housed in a blade case, the support unit including a blade case support for supporting the blade case for housing the cutting blade therein, a changing mechanism for dismounting a cutting blade that has been mounted on the mount flange from the mount flange and mounting the cutting blade that has been supported on the support unit on the mount flange, and a moving mechanism for moving the changing mechanism between a changing position, a blade transfer position, and a retracted position.

公开(公告)号：US20250041989A1

公开(公告)日：2025-02-06

申请号：US18782148

申请日：2024-07-24

Applicant: EBARA CORPORATION

Inventor： Masaki KINOSHITA

IPC: B24B53/017 ,  B24B49/04 ,  B24B49/12

Abstract: A polishing apparatus capable of preventing abrasive grains in a polishing liquid and polishing debris of a workpiece from adhering to an optical sensor head and capable of improving a measuring accuracy of a film thickness of a workpiece is disclosed. The polishing apparatus includes: a polishing table configured to support a polishing pad having a through-hole; a polishing head configured to press a workpiece against the polishing pad; an optical film-thickness measuring system having an optical sensor head disposed below the polishing pad; and a sensor-head cleaning nozzle configured to emit a cleaning liquid to the optical sensor head. The sensor-head cleaning nozzle is disposed in the polishing table and points at the optical sensor head.

公开(公告)号：US20250025985A1

公开(公告)日：2025-01-23

申请号：US18548524

申请日：2023-07-31

Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.

Inventor： Xuzhou YANG ,  Haoming ZHANG ,  Rui WU ,  Chen WEI ,  Pengzhan ZHAO

IPC: B24B49/12 ,  F16M11/10 ,  F16M11/18

Abstract: A wire net monitoring device includes at least one monitor configured to monitor at least one wire net. A signal route of the at least one monitor is configured to monitor the at least one wire net near a side of a workpiece along a rotation direction of the at least one wire net, and the signal route of the at least one monitor crosses a contact surface between the at least one wire net and the workpiece.

公开(公告)号：US20250010428A1

公开(公告)日：2025-01-09

申请号：US18732570

申请日：2024-06-03

Applicant: EBARA CORPORATION

Inventor： SAURABH KULKARNI

IPC: B24B49/12 ,  B08B3/02 ,  B08B7/02 ,  B24D7/12

Abstract: The disclosure provides a polishing apparatus capable of removing a polishing liquid or polishing debris from a light passing portion of a polishing pad. A polishing apparatus 1 includes a polishing table 3 supporting a polishing pad 2 that has a light passing portion 33; a polishing head 5 pressing a substrate W against a polishing surface 2a of the polishing pad 2; an optical sensor 21 disposed in the polishing table 3, irradiating light to the substrate W through the light passing portion 33, and receiving reflected light from the substrate W through the light passing portion 33; and a cleaning portion 12 forming a cleaning space CS that covers the light passing portion 33 above the light passing portion 33 and supplying a cleaning fluid to the light passing portion 33 through the cleaning space CS.

公开(公告)号：US12123205B2

公开(公告)日：2024-10-22

申请号：US17981777

申请日：2022-11-07

Applicant: Canvas Construction, Inc.

Inventor： Maria J. Telleria ,  Gabriel F. Hein ,  Kevin B. Albert ,  Thomas F. Allen ,  Charlie Yan

IPC: E04F21/02 ,  B05B1/28 ,  B05B7/00 ,  B05B9/00 ,  B05B12/12 ,  B05B13/04 ,  B05B15/625 ,  B05C5/00 ,  B05C5/02 ,  B05C11/10 ,  B05D1/02 ,  B05D3/04 ,  B05D3/06 ,  B24B7/18 ,  B24B49/12 ,  B24B55/06 ,  B24B55/10 ,  B25J9/16 ,  B25J11/00 ,  B25J15/00 ,  B26D5/00 ,  E04B1/76 ,  E04F21/00 ,  E04F21/08 ,  E04F21/12 ,  E04F21/16 ,  E04F21/165 ,  E04F21/18 ,  B05B7/24 ,  B05B7/26 ,  B05B9/01 ,  B05B14/00 ,  B05C3/18 ,  B25J9/00 ,  B26D3/08

CPC classification number: E04F21/026 ,  B05B1/28 ,  B05B7/0093 ,  B05B9/007 ,  B05B12/122 ,  B05B13/0431 ,  B05B15/625 ,  B05C5/004 ,  B05C5/02 ,  B05C11/1039 ,  B05D1/02 ,  B05D3/0413 ,  B05D3/067 ,  B24B7/182 ,  B24B49/12 ,  B24B55/06 ,  B24B55/10 ,  B25J9/1661 ,  B25J9/1697 ,  B25J11/0055 ,  B25J11/0075 ,  B25J15/0019 ,  B26D5/007 ,  E04B1/7654 ,  E04F21/0046 ,  E04F21/08 ,  E04F21/085 ,  E04F21/12 ,  E04F21/16 ,  E04F21/165 ,  E04F21/1652 ,  E04F21/1657 ,  E04F21/18 ,  B05B7/24 ,  B05B7/26 ,  B05B9/01 ,  B05B14/00 ,  B05C3/18 ,  B25J9/0084 ,  B26D3/085 ,  G05B2219/40114 ,  G05B2219/40298 ,  Y10S901/01 ,  Y10S901/41 ,  Y10S901/43 ,  Y10S901/47

Abstract: An automated drywalling system network that including one or more automated drywalling systems that each has a robotic arm. The automated drywalling system network can also include a computational planner that generates instructions for the one or more automated drywalling systems to perform two or more drywalling tasks associated with a target wall assembly. The two or more drywalling tasks can include a hanging task that includes hanging pieces of drywall on studs of the target wall assembly; a mudding task that includes applying joint compound to pieces of drywall hung on studs of the target wall assembly; a sanding task that includes sanding joint compound applied to the pieces of drywall hung on studs of the target wall assembly; and a painting task that includes painting sanded the joint compound applied to the pieces of drywall hung on studs of the target wall assembly.

公开(公告)号：US12070833B2

公开(公告)日：2024-08-27

申请号：US18341421

申请日：2023-06-26

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chunhung Chen ,  Jung-Yu Li ,  Sheng-Chen Wang ,  Shih-Sian Huang

IPC: B24B37/24 ,  B24B37/005 ,  B24B37/10 ,  B24B37/22 ,  B24B37/26 ,  B24B49/12 ,  B24B53/017

CPC classification number: B24B37/26 ,  B24B37/005 ,  B24B37/10 ,  B24B37/22 ,  B24B37/24 ,  B24B49/12 ,  B24B53/017

Abstract: A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves. The method further includes spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region includes a plurality of second grooves. The method further includes spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region includes a plurality of third grooves.

公开(公告)号：US20240208003A1

公开(公告)日：2024-06-27

申请号：US18393232

申请日：2023-12-21

Applicant: EBARA CORPORATION

Inventor： Shintaro ISONO

IPC: B24B49/12

CPC classification number: B24B49/12

Abstract: To relatively easily allow monitoring of the operation of a switching device even when the switching device is employed in an optical surface monitoring system of a substrate polishing apparatus. A substrate polishing apparatus includes a polishing table, a substrate holding head, a light source, a first optical head, a switching device, a first optical line, a second optical line, a third optical line, a first optical filter, a spectroscope, and a control device. The substrate holding head is configured to hold a substrate. The first optical head is configured to project light from the light source toward the substrate held by the substrate holding head and receive light reflected from the substrate, the first optical head being disposed inside the polishing table. The switching device includes a plurality of channels. The first optical line optically connects the light source to the first optical head. The second optical line optically connects the first optical head to one channel of the plurality of channels of the switching device. The third optical line optically connects the middle of the first optical line to the middle of the second optical line. The first optical filter is disposed in the third optical line. The spectroscope is optically connected to a downstream side of the switching device. The control device is configured to receive measurement data of the intensity of a wavelength dispersed by the spectroscope. The control device is configured to monitor the operation of the switching device based on the measurement data.

公开(公告)号：US11958165B2

公开(公告)日：2024-04-16

申请号：US16469108

申请日：2017-12-15

Applicant: Zeeko Innovations Limited

Inventor： Anthony Beaucamp

IPC: B24B53/017 ,  B24B49/12 ,  B24B51/00 ,  B24D3/28 ,  B24D18/00

CPC classification number: B24B53/017 ,  B24B49/12 ,  B24B51/00 ,  B24D3/28 ,  B24D18/0009 ,  B24D2203/00

Abstract: Methods and apparatus for shaping workpieces are described in which data representing the surface form of the workpiece is analysed to determine characteristics of curvature of the surface, and these characteristics are used to determine the size and form required for a tool to apply shaping treatment to all parts of the workpiece surface. Measurements of the actual workpiece are then compared with data relating to the required workpiece form, to determine the amount and distribution of material to be removed from the workpiece. A tool path for moving the tool over the workpiece to achieve the required shaping operation is then determined, and the tool and tool path data are provided to a shaping machine to carry out the shaping operation. The shaping tool may comprise an elastomeric body covered in a flexible cloth on which rigid pellets containing abrasive material are fixed. The specification discloses methods of manufacturing such tools, and also discloses methods for conditioning the pelleted cloth. There is also described a method of determining permissible amounts of tool offset to ensure smooth cutting of the workpiece.