SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

    公开(公告)号:US20250050462A1

    公开(公告)日:2025-02-13

    申请号:US18721138

    申请日:2022-10-25

    Inventor: Makoto KASHIWAGI

    Abstract: The present invention relates to a substrate processing method and a substrate processing apparatus for processing a substrate, such as a wafer. In the substrate processing method, rollers (11a, 11b) secured to eccentric shafts (13a, 13b) including a reference shaft (13a) and a movable shaft (13b) are brought into contact with the periphery of a substrate (W) having a notch (Nw), and further the rollers (11a, 11b) are moved in a circular motion, thereby rotating and circularly moving the substrate (W), and further, processing the substrate (W) by bringing a processing tool (201) into contact with the substrate (W). During processing of the substrate (W), a rotational speed of the substrate (W) is calculated based on measured values of a notch detection sensor (77) which is capable of detecting that the notch (Nw) has passed the movable shaft (13b), and an alarm is issued when the rotational speed of the substrate (W) is out of an allowable range which is set with respect to a theoretical rotational speed of the substrate (W).

    Cutting apparatus
    3.
    发明授权

    公开(公告)号:US12220782B2

    公开(公告)日:2025-02-11

    申请号:US17647065

    申请日:2022-01-05

    Abstract: A cutting apparatus includes a cutting unit including a spindle as a rotational shaft and a mount flange for mounting a cutting blade thereon, the mount flange being fixed to a distal end of the spindle, a support unit for supporting a cutting blade housed in a blade case, the support unit including a blade case support for supporting the blade case for housing the cutting blade therein, a changing mechanism for dismounting a cutting blade that has been mounted on the mount flange from the mount flange and mounting the cutting blade that has been supported on the support unit on the mount flange, and a moving mechanism for moving the changing mechanism between a changing position, a blade transfer position, and a retracted position.

    POLISHING APPARATUS
    4.
    发明申请

    公开(公告)号:US20250041989A1

    公开(公告)日:2025-02-06

    申请号:US18782148

    申请日:2024-07-24

    Inventor: Masaki KINOSHITA

    Abstract: A polishing apparatus capable of preventing abrasive grains in a polishing liquid and polishing debris of a workpiece from adhering to an optical sensor head and capable of improving a measuring accuracy of a film thickness of a workpiece is disclosed. The polishing apparatus includes: a polishing table configured to support a polishing pad having a through-hole; a polishing head configured to press a workpiece against the polishing pad; an optical film-thickness measuring system having an optical sensor head disposed below the polishing pad; and a sensor-head cleaning nozzle configured to emit a cleaning liquid to the optical sensor head. The sensor-head cleaning nozzle is disposed in the polishing table and points at the optical sensor head.

    POLISHING APPARATUS AND POLISHING METHOD

    公开(公告)号:US20250010428A1

    公开(公告)日:2025-01-09

    申请号:US18732570

    申请日:2024-06-03

    Inventor: SAURABH KULKARNI

    Abstract: The disclosure provides a polishing apparatus capable of removing a polishing liquid or polishing debris from a light passing portion of a polishing pad. A polishing apparatus 1 includes a polishing table 3 supporting a polishing pad 2 that has a light passing portion 33; a polishing head 5 pressing a substrate W against a polishing surface 2a of the polishing pad 2; an optical sensor 21 disposed in the polishing table 3, irradiating light to the substrate W through the light passing portion 33, and receiving reflected light from the substrate W through the light passing portion 33; and a cleaning portion 12 forming a cleaning space CS that covers the light passing portion 33 above the light passing portion 33 and supplying a cleaning fluid to the light passing portion 33 through the cleaning space CS.

    SUBSTRATE POLISHING APPARATUS
    9.
    发明公开

    公开(公告)号:US20240208003A1

    公开(公告)日:2024-06-27

    申请号:US18393232

    申请日:2023-12-21

    Inventor: Shintaro ISONO

    CPC classification number: B24B49/12

    Abstract: To relatively easily allow monitoring of the operation of a switching device even when the switching device is employed in an optical surface monitoring system of a substrate polishing apparatus. A substrate polishing apparatus includes a polishing table, a substrate holding head, a light source, a first optical head, a switching device, a first optical line, a second optical line, a third optical line, a first optical filter, a spectroscope, and a control device. The substrate holding head is configured to hold a substrate. The first optical head is configured to project light from the light source toward the substrate held by the substrate holding head and receive light reflected from the substrate, the first optical head being disposed inside the polishing table. The switching device includes a plurality of channels. The first optical line optically connects the light source to the first optical head. The second optical line optically connects the first optical head to one channel of the plurality of channels of the switching device. The third optical line optically connects the middle of the first optical line to the middle of the second optical line. The first optical filter is disposed in the third optical line. The spectroscope is optically connected to a downstream side of the switching device. The control device is configured to receive measurement data of the intensity of a wavelength dispersed by the spectroscope. The control device is configured to monitor the operation of the switching device based on the measurement data.

    Methods and apparatus for shaping workpieces

    公开(公告)号:US11958165B2

    公开(公告)日:2024-04-16

    申请号:US16469108

    申请日:2017-12-15

    Inventor: Anthony Beaucamp

    Abstract: Methods and apparatus for shaping workpieces are described in which data representing the surface form of the workpiece is analysed to determine characteristics of curvature of the surface, and these characteristics are used to determine the size and form required for a tool to apply shaping treatment to all parts of the workpiece surface. Measurements of the actual workpiece are then compared with data relating to the required workpiece form, to determine the amount and distribution of material to be removed from the workpiece. A tool path for moving the tool over the workpiece to achieve the required shaping operation is then determined, and the tool and tool path data are provided to a shaping machine to carry out the shaping operation. The shaping tool may comprise an elastomeric body covered in a flexible cloth on which rigid pellets containing abrasive material are fixed. The specification discloses methods of manufacturing such tools, and also discloses methods for conditioning the pelleted cloth. There is also described a method of determining permissible amounts of tool offset to ensure smooth cutting of the workpiece.

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