公开(公告)号：US12134166B1

公开(公告)日：2024-11-05

申请号：US18679276

申请日：2024-05-30

Applicant: GrayMatter Robotics Inc.

Inventor： Avadhoot L. Ahire ,  Bharat S. Deshkulkarni ,  Satyandra K. Gupta ,  Nathan Ince ,  Ariyan M. Kabir ,  Ashish Kulkarni ,  Sagarkumar J. Panchal ,  Martin G. Philo ,  Brual C. Shah ,  Jeano J. Vincent

IPC: B24B51/00 ,  B24B49/04 ,  B24B49/12 ,  B24B49/14 ,  B24B49/16 ,  B25J9/16 ,  B25J11/00 ,  G06T1/00 ,  G06T7/60 ,  G06T19/20

Abstract: A method for autonomously grinding a workpiece includes: accessing a virtual model defining a geometry of the workpiece; identifying a grinding region on the workpiece; and projecting a target grinding profile onto the grinding region on the workpiece. The method also includes: based a geometry of the workpiece and the target grinding profile, generating a tool path for removal of material from the grinding region to the target grinding profile; and assigning a target force to the target region. The method also includes, during a processing cycle: accessing a sequence of force values output by a force sensor coupled to a grinding head; navigating the grinding head across the grinding region according to the tool path; and, based on the sequence of force values, deviating the grinding head from the tool path to maintain forces of the grinding head on the grinding region proximal the target force.

公开(公告)号：US20240326196A1

公开(公告)日：2024-10-03

申请号：US18611535

申请日：2024-03-20

Applicant: EBARA CORPORATION

Inventor： Yuko SHIMIZU

IPC: B24B49/04 ,  B24B49/10 ,  B24B49/12

CPC classification number: B24B49/04 ,  B24B49/105 ,  B24B49/12

Abstract: A polishing endpoint detecting method capable of accurately detecting a polishing endpoint of a substrate is disclosed. The polishing endpoint detecting method includes: polishing a substrate W; creating a film-thickness profile of the substrate by used of a film-thickness sensor 7 mounted to a polishing table 2; dividing the film-thickness profile into a plurality of measurement zones and selecting a monitoring zone from the plurality of measurement zones for determining a polishing endpoint of the substrate; determining whether or not the monitoring zone is changed to another measurement zone based on changes in the film-thickness profile obtained from start to end of polishing of the substrate; and determining a polishing endpoint of the substrate based on the signals in the monitoring zone.

公开(公告)号：US20240293913A1

公开(公告)日：2024-09-05

申请号：US18591463

申请日：2024-02-29

Applicant: Brian F. Smith

Inventor： Brian F. Smith

IPC: B24B49/04 ,  B24B3/36

CPC classification number: B24B49/04 ,  B24B3/36

Abstract: Provided are systems and methods for controlling a blade sharpening and task robot. The system may include at least one processor configured to receive blade data associated with a blade of a lawn mower. The at least one processor may be configured to determine a task of a plurality of tasks associated with the blade of the lawn mower based on the blade data. The at least one processor may be configured to generate a message including data associated with the task. The at least one processor may be configured to send the message to a computing device, where the computing device is configured to display the message via a display of the computing device. The at least one processor may be configured to perform the task. The task may include sharpening the blade of the lawn mower and/or repairing the blade of the lawn mower.

公开(公告)号：US12076833B2

公开(公告)日：2024-09-03

申请号：US17018720

申请日：2020-09-11

Applicant: Nidec Motor Corporation

Inventor： Son N. Dang ,  Jordan L Wahl

IPC: B24B49/04 ,  B24B9/00 ,  B24B19/16 ,  G01R1/067

CPC classification number: B24B49/045 ,  B24B9/007 ,  B24B19/165 ,  G01R1/06711

Abstract: A probe sanding fixture includes a base, a probe adapter including a probe guide defining one or more channels defined therein, and a sander tool including a sanding wheel and a gauge pin configured to process one or more probes positioned in the channels. The probe adapter is coupleable to the base such that the channels are extendable generally along a first axis. The sander tool is coupled to the base such that the sander tools is translatable along a second axis and rotatable about the first axis.

公开(公告)号：US12053853B2

公开(公告)日：2024-08-06

申请号：US16088521

申请日：2017-03-29

Applicant: Gehring Technologies GmbH

Inventor： Klaus Litty ,  Andreas Wagner ,  Manuel Waiblinger ,  Andreas Wiens ,  Niko Schamne ,  Markus Petraschek

IPC: B24B33/02 ,  B24B33/08 ,  B24B49/04

CPC classification number: B24B33/025 ,  B24B33/087 ,  B24B33/088 ,  B24B49/04

Abstract: A method for honing a rotationally symmetric, non-cylindrical bore includes the steps of limiting the stroke of a honing tool between upper and lower reversal points, continoulsy detecting the actual diameter of the bore at all points along its length between the upper and lower reversal points, continuously comparing the actual diameter of the bore to a specified target diameters for at least one of the upper or lower reversal points, continuously limiting the stroke to regions of the bore in which the actual diameter is smaller than the target diameter, continuously limiting the stroke to regions of the bore in which the actual diameter is smaller than the target diameter, and reducing the stroke of the honing tool step-by-step based on the detected actual values of the diameter of the bore, so that it only the regions of the bore that are machined in which the actual diameter of the bore is smaller than the target diameter corresponding to the detected actual values of the diameter.

公开(公告)号：US20240217060A1

公开(公告)日：2024-07-04

申请号：US18395191

申请日：2023-12-22

Applicant: EBARA CORPORATION

Inventor： Masashi KABASAWA ,  Keita YAGI ,  Yoichi SHIOKAWA ,  Toshimitsu SASAKI ,  Kohei EGAWA

IPC: B24B49/03 ,  B24B49/04

CPC classification number: B24B49/03 ,  B24B49/04

Abstract: A substrate polishing device includes a height detection unit configured to measure a surface height of a polishing member, and a cutting rate calculation unit configured to calculate a cutting rate of the polishing member based on the surface height. The cutting rate calculation unit corrects the current cutting rate based on the cutting rate calculated in the past when the calculated current cutting rate falls outside a search range.

公开(公告)号：US11787010B2

公开(公告)日：2023-10-17

申请号：US17381242

申请日：2021-07-21

Applicant: Karl Heesemann Maschinenfabrik GmbH & Co. KG

Inventor： Christoph Giese

IPC: B24B49/12 ,  B24B1/00 ,  B24B49/04 ,  G06T7/00

CPC classification number: B24B49/12 ,  B24B1/00 ,  B24B49/04 ,  G06T7/001

Abstract: Grinding a surface of a workpieces is accomplished with a grinding machine having at least two grinding units. First, a target structure of the surface to be achieved is provided. Then, using predetermined grinding parameters, a first of the two grinding units is used to grind the surface of the structure. Then, the surface of the actual structure is captured and compared to the target structure. Based on the comparison, the grinding parameters are adjusted and the surface is then ground, using the adjusted parameters, with the second of the two grinding units.

公开(公告)号：US20230311270A1

公开(公告)日：2023-10-05

申请号：US18178108

申请日：2023-03-03

Applicant: Kioxia Corporation

Inventor： Kazufumi NOMURA

IPC: B24B41/06 ,  B24B49/04 ,  B24B51/00

CPC classification number: B24B41/068 ,  B24B49/04 ,  B24B51/00

Abstract: A production apparatus includes: a rotating body configured to rotate a grindstone to cut a first surface of an object; a holding unit configured to contact a second surface of the object; and a displacement unit configured to displace at least a portion of the second surface of the object in a rotation axis direction of the rotating body.

公开(公告)号：US11728172B2

公开(公告)日：2023-08-15

申请号：US16863632

申请日：2020-04-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Yuan-Hsuan Chen ,  Kei-Wei Chen ,  Ying-Lang Wang ,  Kuo-Hsiu Wei

IPC: B24B49/05 ,  H01L21/306 ,  H01L21/304 ,  B24B49/04 ,  B24B37/005 ,  B24B49/00 ,  B24B37/04 ,  H01L21/66

CPC classification number: H01L21/30625 ,  B24B37/005 ,  B24B37/04 ,  B24B49/00 ,  B24B49/04 ,  B24B49/05 ,  H01L21/304 ,  H01L22/12 ,  H01L22/20

Abstract: An apparatus includes a first metrology tool configured to measure an initial thickness of a wafer. The apparatus includes a controller connected to the first metrology tool and configured to calculate a polishing time based on a material removal rate, a predetermined thickness and the initial thickness of the wafer. The apparatus includes a polishing tool connected to the controller and configured to polish the wafer for a first duration equal to the polishing time. The apparatus includes a second metrology tool connected to the controller and configured to measure a polished thickness. The controller is configured for receiving the initial thickness from the first metrology tool and the polished thickness from the second metrology tool, updating the material removal rate based on the predetermined thickness, the polishing time and the polished thickness, and calculating an etching time for etching the polished wafer using the polished thickness.

公开(公告)号：US20230127250A1

公开(公告)日：2023-04-27

申请号：US18047398

申请日：2022-10-18

Applicant: Karl Heesemann Maschinenfabrik GmbH & Co. KG

Inventor： Christoph Giese

IPC: B24B41/06 ,  B24B51/00 ,  B24B7/06 ,  B24B49/04 ,  B24B41/00

Abstract: A workpiece fixing device for fixing a workpiece by vacuum for machining thereof includes a support device on which the workpiece can be laid for fixing, and at least one vacuum chamber which is formed starting from the support device. The workpiece fixing device has a first fixing region and a second fixing region different from the first fixing region. The support device has a first support channel profile in the first fixing region and a second support channel profile different from the first support channel profile in the second fixing region.