公开(公告)号：US20250010419A1

公开(公告)日：2025-01-09

申请号：US18348467

申请日：2023-07-07

Applicant: TEN SHEEG MACHINERY CO., LTD.

Inventor： JASON YEH

IPC: B24B3/36 ,  B24B49/10

Abstract: A knife detecting and sharpening system can be installed in a machine base of a splitting machine and adjacent to a band knife, which is an annular loop and is driven by two knife-driving wheels, and adjacent to a wheel shaft of one of the two knife-driving wheels. The system is controlled by a computer of the splitting machine and comprises a resistance detector, connected to the wheel shaft and electrically connected to the computer, and an electric sharpening device, which is mounted inside the machine base and is controlled by the computer to sharpen the band knife's blade, to be withdrawn from the band knife, and to automatically clean dust generated during sharpening the blade. The resistance detector detects a resistance during sharpening and transmits it to the computer, which can control the electric sharpening device operating a sharpening mode or a stop-sharpening mode based on the resistance.

公开(公告)号：US12179310B2

公开(公告)日：2024-12-31

申请号：US17410099

申请日：2021-08-24

Applicant: EBARA CORPORATION

Inventor： Atsushi Abe ,  Taro Takahashi ,  Hiroaki Shibue ,  Shinpei Tokunaga ,  Katsuhide Watanabe

IPC: G01B7/06 ,  B24B49/10 ,  B24B37/013

Abstract: An eddy current sensor has an exciting coil and a detection coil. A holding circuit holds reference data indicating a characteristic of an output signal output from the detection coil at a reference state and outputs the reference data at a state other than the reference state. A pseudo signal generating circuit generates and outputs a balance coil pseudo signal corresponding to the output signal output from the detection coil at the reference state from the reference data output from the holding circuit. A bridge circuit, at the state other than the reference state, receives the output signal output from the detection coil and the balance coil pseudo signal and outputs a bridge output signal corresponding to a difference between the output signal and the balance coil pseudo signal as a bridge output signal.

公开(公告)号：US20240408720A1

公开(公告)日：2024-12-12

申请号：US18262819

申请日：2022-02-04

Applicant: NTN Corporation

Inventor： Yuuki KADONO

IPC: B24B49/00 ,  B24B49/10 ,  B24B51/00

Abstract: A grinding apparatus includes: a grinding member driving unit having a motor that rotates a grinding member; a table driving unit that brings the grinding member into contact with a workpiece by moving the grinding member and the workpiece relative to each other; an AE sensor that detects an acoustic emission generated when the grinding member and the workpiece are brought into contact with each other; and a controller that controls a cut-in speed of the grinding member into the workpiece by controlling the table driving unit. The controller controls the cut-in speed using an output of the AE sensor and a motor current of the grinding member driving unit.

公开(公告)号：US20240293910A1

公开(公告)日：2024-09-05

申请号：US18663315

申请日：2024-05-14

Applicant: Black & Decker Inc.

Inventor： Zollie W. PRIVETT, JR. ,  Craig A. OKTAVEC ,  David J. SMITH ,  Matthew J. VELDERMAN ,  Colin C. CROSBY ,  Pradeep PANT ,  Kyle J. CHRISTOPHERSEN ,  Daniel F. NACE ,  James H. STILES, III ,  Floyd E. MORELAND, IV

IPC: B24B23/02 ,  B24B47/10 ,  B24B47/12 ,  B24B49/10 ,  B25F5/00 ,  B25F5/02 ,  H02K5/10 ,  H02K5/16 ,  H02K5/22 ,  H02K7/116 ,  H02K7/14 ,  H02K9/06 ,  H02K11/215 ,  H02K11/33

CPC classification number: B24B23/02 ,  B24B23/028 ,  B24B47/10 ,  B24B47/12 ,  B24B49/10 ,  B25F5/008 ,  B25F5/02 ,  H02K5/10 ,  H02K7/145 ,  H02K11/215 ,  H02K11/33 ,  H02K5/161 ,  H02K5/225 ,  H02K7/116 ,  H02K9/06

Abstract: A power tool comprising: a housing including a motor case and a handle portion extending along a longitudinal axis of the housing from the motor case; an electric motor having a drive shaft and mounted within the motor case; a partitioning wall extending radially between the motor case and the handle portion and forming a bearing pocket therein; a rear bearing mounted on the drive shaft and received into the bearing pocket to support the drive shaft relative to the housing; two elongate walls extending rearwardly from the partitioning wall along two sides of the handle portion; a power control module supported by the two elongate walls within the handle portion, the power control module including a circuit board having a motor drive circuit configured to drive the electric motor; and at least one cover secured to the two elongate walls to cover the circuit board.

公开(公告)号：US12076831B2

公开(公告)日：2024-09-03

申请号：US18308878

申请日：2023-04-28

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Chen Wei ,  Jheng-Si Su ,  Shih-Ho Lin ,  Jen-Chieh Lai ,  Chun-Chieh Chan

IPC: B24B37/005 ,  B24B37/04 ,  B24B37/20 ,  B24B37/32 ,  B24B49/10 ,  B24B49/16 ,  B24B49/18 ,  B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/321

CPC classification number: B24B37/20 ,  B24B37/005 ,  B24B37/04 ,  B24B37/32 ,  B24B49/10 ,  B24B49/16 ,  B24B49/18 ,  B24B53/001 ,  B24B53/017 ,  H01L21/3212

Abstract: A chemical mechanical polishing (CMP) apparatus is provided, including a polishing pad and a polishing head. The polishing pad has a polishing surface. The polishing head is configured to hold a wafer in contact with the polishing surface during the polishing process. The polishing head includes a retaining ring, at least one fluid channel, and a vacuum pump. The retaining ring is arranged along the periphery of the polishing head and configured to retain the wafer. The at least one fluid channel is provided inside the polishing head, wherein the retaining ring includes a bottom surface facing the polishing surface and a plurality of holes in fluid communication with the bottom surface and the at least one fluid channel. The vacuum pump is fluidly coupled to the at least one fluid channel.

公开(公告)号：US12057354B2

公开(公告)日：2024-08-06

申请号：US18200244

申请日：2023-05-22

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Kiran Lall Shrestha ,  Doyle E. Bennett ,  David Maxwell Gage ,  Benjamin Cherian ,  Jun Qian ,  Harry Q. Lee

IPC: H01L21/66 ,  B24B37/013 ,  B24B49/10 ,  G06F17/15 ,  G06N3/08 ,  H01L21/304 ,  H01L21/321

CPC classification number: H01L22/14 ,  B24B37/013 ,  B24B49/105 ,  G06F17/15 ,  G06N3/08 ,  H01L21/304 ,  H01L21/3212 ,  H01L22/12 ,  H01L22/26

Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.

公开(公告)号：US12042902B2

公开(公告)日：2024-07-23

申请号：US17455959

申请日：2021-11-22

Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.

Inventor： Zhengxian Zhang

IPC: B24B49/10 ,  B24B1/00 ,  G01L1/26 ,  G01L5/00 ,  H01L21/67

CPC classification number: B24B49/10 ,  B24B1/00 ,  G01L1/26 ,  G01L5/0076 ,  H01L21/67092 ,  H01L21/67253

Abstract: Force measurement system is provided. It includes: a grinding arm and a stressed layer, the stressed layer being configured to bear a force from the grinding arm; a base and a plurality of elastic bodies, the elastic bodies being fixed between the stressed layer and the base; a deformation sensor, configured to detect deformation of the elastic bodies; and an analysis device, configured to obtain the force on the stressed layer according to a detection result of the deformation sensor and an elastic constant of the elastic body.

公开(公告)号：US20240157501A1

公开(公告)日：2024-05-16

申请号：US18417743

申请日：2024-01-19

Applicant: ATM Qness GmbH

Inventor： Michael Kley ,  Matthias Höfer

IPC: B24B31/06 ,  B24B31/073 ,  B24B31/12 ,  B24B49/10 ,  B24B49/16

CPC classification number: B24B31/062 ,  B24B31/06 ,  B24B31/073 ,  B24B31/12 ,  B24B49/10 ,  B24B49/16

Abstract: The present disclosure relates to a vibration polishing device, comprising:



a vibration drive for generating an oscillating vibration for polishing samples;
a polishing disc which is connected to and can be driven by the vibration drive; and
a polishing bowl which is designed to receive a polishing medium and the samples to be polished and is coupled to the polishing disc;
wherein the coupling between the polishing bowl and the polishing disc is accomplished by a quick-type coupling for transferring the oscillating vibrations from the polishing disc to the polishing bowl when the vibration polishing device is in operation and thereby to move the sample to be polished in the polishing bowl.

公开(公告)号：US11926014B2

公开(公告)日：2024-03-12

申请号：US16330436

申请日：2017-09-05

Applicant: ATM Qness GmbH

Inventor： Michael Kley ,  Matthias Höfer

IPC: B24B31/00 ,  B24B31/06 ,  B24B31/073 ,  B24B31/12 ,  B24B49/10 ,  B24B49/16

CPC classification number: B24B31/062 ,  B24B31/06 ,  B24B31/073 ,  B24B31/12 ,  B24B49/10 ,  B24B49/16

Abstract: The present disclosure relates to a vibration polishing device, comprising:



a vibration drive for generating an oscillating vibration for polishing samples;
polishing disc which is connected to and can be driven by the vibration drive; and
polishing bowl which is designed to receive a polishing medium and the samples to be polished and is coupled to the polishing disc;
wherein the coupling between the polishing bowl and the polishing disc is accomplished by a quick-type coupling for transferring the oscillating vibrations from the polishing disc to the polishing bowl when the vibration polishing device is in operation and thereby to move the sample to be polished in the polishing bowl.

公开(公告)号：US20240066663A1

公开(公告)日：2024-02-29

申请号：US18347797

申请日：2023-07-06

Applicant: Nanjing Chervon Industry Co., Ltd.

Inventor： Zhen Xu

IPC: B24B49/10 ,  B24B7/18 ,  B24B47/12 ,  H02P27/08

CPC classification number: B24B49/10 ,  B24B7/184 ,  B24B47/12 ,  H02P27/085

Abstract: A power tool includes an electric motor including multi-phase windings; and a control circuit for controlling the electric motor to rotate. The control circuit includes a driver circuit including multiple switching elements having multiple driving states to drive the electric motor to rotate; a parameter detection module for detecting an electrical parameter of the control circuit; and a controller for outputting a pulse-width modulation (PWM) control signal to control the driver circuit to change the multiple driving states. The controller is configured to change the absolute value of the variation of a duty cycle of the PWM control signal according to the electrical parameter to control a steady-state error of the electric motor running in a constant speed to be within a preset range.