公开(公告)号：US12179310B2

公开(公告)日：2024-12-31

申请号：US17410099

申请日：2021-08-24

Applicant: EBARA CORPORATION

Inventor： Atsushi Abe ,  Taro Takahashi ,  Hiroaki Shibue ,  Shinpei Tokunaga ,  Katsuhide Watanabe

IPC: G01B7/06 ,  B24B49/10 ,  B24B37/013

Abstract: An eddy current sensor has an exciting coil and a detection coil. A holding circuit holds reference data indicating a characteristic of an output signal output from the detection coil at a reference state and outputs the reference data at a state other than the reference state. A pseudo signal generating circuit generates and outputs a balance coil pseudo signal corresponding to the output signal output from the detection coil at the reference state from the reference data output from the holding circuit. A bridge circuit, at the state other than the reference state, receives the output signal output from the detection coil and the balance coil pseudo signal and outputs a bridge output signal corresponding to a difference between the output signal and the balance coil pseudo signal as a bridge output signal.

公开(公告)号：US20200147747A1

公开(公告)日：2020-05-14

申请号：US16677288

申请日：2019-11-07

Applicant: EBARA CORPORATION

Inventor： Taro Takahashi ,  Hiroaki Shibue ,  Shinpei Tokunaga

IPC: B24B37/013 ,  B24B49/10

Abstract: An eddy current detection device configured to form a stronger magnetic field in a polishing target and a polishing apparatus employing the same eddy current detection device are provided. An eddy current detection device that can be disposed near a semiconductor wafer on which a conductive film is formed includes a plurality of eddy current sensors. The plurality of eddy current sensors are disposed near to one another. Each of the plurality of eddy current sensors includes a pot core, an exciting coil disposed in the pot core and configured to form an eddy current in the conductive film, and a detection coil disposed in the pot core and configured to detect the eddy current formed in the conductive film.

公开(公告)号：US11731233B2

公开(公告)日：2023-08-22

申请号：US16677288

申请日：2019-11-07

Applicant: EBARA CORPORATION

Inventor： Taro Takahashi ,  Hiroaki Shibue ,  Shinpei Tokunaga

IPC: B24B37/013 ,  B24B49/10

CPC classification number: B24B37/013 ,  B24B49/105

Abstract: An eddy current detection device configured to form a stronger magnetic field in a polishing target and a polishing apparatus employing the same eddy current detection device are provided. An eddy current detection device that can be disposed near a semiconductor wafer on which a conductive film is formed includes a plurality of eddy current sensors. The plurality of eddy current sensors are disposed near to one another. Each of the plurality of eddy current sensors includes a pot core, an exciting coil disposed in the pot core and configured to form an eddy current in the conductive film, and a detection coil disposed in the pot core and configured to detect the eddy current formed in the conductive film.

公开(公告)号：US12123714B2

公开(公告)日：2024-10-22

申请号：US18504301

申请日：2023-11-08

Applicant: EBARA CORPORATION

Inventor： Hiroto Yamada ,  Taro Takahashi ,  Hiroaki Shibue ,  Atsushi Abe ,  Shinpei Tokunaga

IPC: G01B7/06 ,  H01L21/67

CPC classification number: G01B7/105 ,  H01L21/67253

Abstract: An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.

公开(公告)号：US11852472B2

公开(公告)日：2023-12-26

申请号：US17122301

申请日：2020-12-15

Applicant: EBARA CORPORATION

Inventor： Hiroto Yamada ,  Taro Takahashi ,  Hiroaki Shibue ,  Atsushi Abe ,  Shinpei Tokunaga

IPC: G01B7/06 ,  H01L21/67

CPC classification number: G01B7/105 ,  H01L21/67253

Abstract: An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.

公开(公告)号：US11633828B2

公开(公告)日：2023-04-25

申请号：US16797316

申请日：2020-02-21

Applicant: EBARA CORPORATION

Inventor： Yuta Suzuki ,  Taro Takahashi ,  Akihiko Ogawa ,  Shigeyuki Furuya ,  Yuji Yagi ,  Nobuyuki Takada ,  Shinpei Tokunaga

IPC: B24B37/013 ,  B24B21/04

Abstract: A first and a second substrate polishing apparatus and are provided with a film thickness sensor for measuring a film thickness of layer to be polished and polish the layer by pressing the substrate against a polishing pad. The first substrate polishing apparatus outputs difference between output value of the film thickness sensor when an underlayer is exposed and output value of the film thickness sensor when the substrate is not present, as a first offset value. The second substrate polishing apparatus has a storage unit that stores information of the first offset value, an output correction unit that corrects the output value from the film thickness sensor based on the first offset value, and an end point detection unit that outputs control signal indicating end point of substrate polishing when measured value of the film thickness of the layer calculated based on the corrected output value reaches target value.

公开(公告)号：US20200269380A1

公开(公告)日：2020-08-27

申请号：US16797316

申请日：2020-02-21

Applicant: EBARA CORPORATION

Inventor： Yuta Suzuki ,  Taro Takahashi ,  Akihiko Ogawa ,  Shigeyuki Furuya ,  Yuji Yagi ,  Nobuyuki Takada ,  Shinpei Tokunaga

IPC: B24B37/013 ,  B24B21/04

Abstract: A first and a second substrate polishing apparatus and are provided with a film thickness sensor for measuring a film thickness of layer to be polished and polish the layer by pressing the substrate against a polishing pad. The first substrate polishing apparatus outputs difference between output value of the film thickness sensor when an underlayer is exposed and output value of the film thickness sensor when the substrate is not present, as a first offset value. The second substrate polishing apparatus has a storage unit that stores information of the first offset value, an output correction unit that corrects the output value from the film thickness sensor based on the first offset value, and an end point detection unit that outputs control signal indicating end point of substrate polishing when measured value of the film thickness of the layer calculated based on the corrected output value reaches target value.