公开(公告)号：US11731233B2

公开(公告)日：2023-08-22

申请号：US16677288

申请日：2019-11-07

Applicant: EBARA CORPORATION

Inventor： Taro Takahashi ,  Hiroaki Shibue ,  Shinpei Tokunaga

IPC: B24B37/013 ,  B24B49/10

CPC classification number: B24B37/013 ,  B24B49/105

Abstract: An eddy current detection device configured to form a stronger magnetic field in a polishing target and a polishing apparatus employing the same eddy current detection device are provided. An eddy current detection device that can be disposed near a semiconductor wafer on which a conductive film is formed includes a plurality of eddy current sensors. The plurality of eddy current sensors are disposed near to one another. Each of the plurality of eddy current sensors includes a pot core, an exciting coil disposed in the pot core and configured to form an eddy current in the conductive film, and a detection coil disposed in the pot core and configured to detect the eddy current formed in the conductive film.

公开(公告)号：US12179310B2

公开(公告)日：2024-12-31

申请号：US17410099

申请日：2021-08-24

Applicant: EBARA CORPORATION

Inventor： Atsushi Abe ,  Taro Takahashi ,  Hiroaki Shibue ,  Shinpei Tokunaga ,  Katsuhide Watanabe

IPC: G01B7/06 ,  B24B49/10 ,  B24B37/013

Abstract: An eddy current sensor has an exciting coil and a detection coil. A holding circuit holds reference data indicating a characteristic of an output signal output from the detection coil at a reference state and outputs the reference data at a state other than the reference state. A pseudo signal generating circuit generates and outputs a balance coil pseudo signal corresponding to the output signal output from the detection coil at the reference state from the reference data output from the holding circuit. A bridge circuit, at the state other than the reference state, receives the output signal output from the detection coil and the balance coil pseudo signal and outputs a bridge output signal corresponding to a difference between the output signal and the balance coil pseudo signal as a bridge output signal.

公开(公告)号：US12083646B2

公开(公告)日：2024-09-10

申请号：US17573134

申请日：2022-01-11

Applicant: EBARA CORPORATION

Inventor： Hiroaki Shibue ,  Taro Takahashi ,  Toshiki Miyakawa

IPC: B24B37/013 ,  B24B37/04

CPC classification number: B24B37/013 ,  B24B37/042

Abstract: A polishing apparatus capable of acquiring accurate film thickness distribution information is disclosed. The polishing apparatus includes a polishing table, a plurality of film thickness sensors, and a controller. The controller analyzes film thickness distribution information of a substrate while identifying a notch position of the substrate based on the measured film thickness information, and outputs visualization information of the film thickness distribution with the notch position as a reference position.

公开(公告)号：US12123714B2

公开(公告)日：2024-10-22

申请号：US18504301

申请日：2023-11-08

Applicant: EBARA CORPORATION

Inventor： Hiroto Yamada ,  Taro Takahashi ,  Hiroaki Shibue ,  Atsushi Abe ,  Shinpei Tokunaga

IPC: G01B7/06 ,  H01L21/67

CPC classification number: G01B7/105 ,  H01L21/67253

Abstract: An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.

公开(公告)号：US11852472B2

公开(公告)日：2023-12-26

申请号：US17122301

申请日：2020-12-15

Applicant: EBARA CORPORATION

Inventor： Hiroto Yamada ,  Taro Takahashi ,  Hiroaki Shibue ,  Atsushi Abe ,  Shinpei Tokunaga

IPC: G01B7/06 ,  H01L21/67

CPC classification number: G01B7/105 ,  H01L21/67253

Abstract: An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.

公开(公告)号：US20220412715A1

公开(公告)日：2022-12-29

申请号：US17839350

申请日：2022-06-13

Applicant: EBARA CORPORATION

Inventor： Hiroto Yamada ,  Taro Takahashi ,  Hiroaki Shibue

IPC: G01B7/06 ,  B24B37/005

Abstract: There is provided a detection signal processing circuit and a detection signal processing method for an eddy current sensor that are less easily influenced by a change in ambient environment than conventional technologies. A detection signal processing apparatus includes a converter configured to convert a first analog signal output by a detection coil into a first digital signal, a converter configured to convert a second analog signal output by a dummy coil into a second digital signal, and a detector which is a digital signal processing circuit configured to detect the first digital signal and the second digital signal.

公开(公告)号：US09437507B2

公开(公告)日：2016-09-06

申请号：US14656429

申请日：2015-03-12

Applicant: EBARA CORPORATION

Inventor： Akira Nakamura ,  Hiroaki Shibue ,  Yasumasa Hiroo ,  Hiroshi Ota ,  Taro Takahashi ,  Mitsuo Tada

IPC: B24B49/00 ,  G01B7/06 ,  H01L21/66 ,  B24B37/013 ,  B24B49/10

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/105 ,  G01B7/105 ,  H01L22/14

Abstract: The polishing process includes a first state where an eddy current sensor and a polishing target object do not face each other and a second state where the eddy current sensor and the polishing target object face each other. The method of correcting a film thickness measurement value includes obtaining a first measurement signal (Xout, Yout) output from the eddy current sensor in the first state (step S108), computing a correction value (ΔX, ΔY) on the basis of the obtained first measurement signal and a reference signal (Xsd, Ysd) set in advance, obtaining a second measurement signal (X, Y) output from the eddy current sensor in the second state (step S104), and correcting the obtained second measurement signal on the basis of the computed correction value while the polishing process is being performed (step S105).

Abstract translation: 抛光处理包括涡流传感器和抛光对象物不彼此相对的第一状态以及涡流传感器和抛光对象物体彼此面对的第二状态。 修正膜厚测量值的方法包括获得在第一状态下从涡流传感器输出的第一测量信号（Xout，Yout）（步骤S108），基于获得的值计算校正值（ΔX，ΔY） 第一测量信号和参考信号（Xsd，Ysd），获得在第二状态下从涡电流传感器输出的第二测量信号（X，Y）（步骤S104），并且获得的第二测量信号 在执行抛光处理时计算的校正值的基础（步骤S105）。

公开(公告)号：US11759912B2

公开(公告)日：2023-09-19

申请号：US16230614

申请日：2018-12-21

Applicant: EBARA CORPORATION

Inventor： Taro Takahashi ,  Hiroaki Shibue ,  Katsuhide Watanabe

IPC: B24B49/10 ,  B24B49/12 ,  G01N27/90 ,  B24B37/013 ,  B24B49/16 ,  G01N27/9013

CPC classification number: B24B49/105 ,  B24B37/013 ,  B24B49/12 ,  B24B49/16 ,  G01N27/90 ,  G01N27/9013

Abstract: A magnetic element for strengthening a magnetic field formed in an object and an eddy current sensor using the magnetic field are provided. The eddy current sensor includes a bottom face portion which is a magnetic body, a magnetic core portion provided at the middle of the bottom face portion and a peripheral wall portion provided on the periphery of the bottom face portion. The eddy current sensor further includes an excitation coil disposed on an outer periphery of the magnetic core portion and capable of generating a magnetic field and an excitation coil disposed on an outer periphery of the peripheral wall portion and capable of generating a magnetic field.

公开(公告)号：US20220219283A1

公开(公告)日：2022-07-14

申请号：US17573134

申请日：2022-01-11

Applicant: EBARA CORPORATION

Inventor： Hiroaki Shibue ,  Taro Takahashi ,  Toshiki Miyakawa

IPC: B24B37/013 ,  B24B37/04

Abstract: A polishing apparatus capable of acquiring accurate film thickness distribution information is disclosed. The polishing apparatus includes a polishing table, a plurality of film thickness sensors, and a controller. The controller analyzes film thickness distribution information of a substrate while identifying a notch position of the substrate based on the measured film thickness information, and outputs visualization information of the film thickness distribution with the notch position as a reference position.

公开(公告)号：US20220163484A1

公开(公告)日：2022-05-26

申请号：US17533386

申请日：2021-11-23

Applicant: EBARA CORPORATION

Inventor： Hiroto Yamada ,  Taro Takahashi ,  Hiroaki Shibue

IPC: G01N27/90 ,  G01N27/904

Abstract: An eddy current sensor for detecting an eddy current that can be generated in a wafer includes a magnetic core. The core has a base, a central wall provided on the base in the center of the base in a first direction, and end walls provided on the base at either end portion of the base in the first direction. The eddy current sensor includes exciting coils which are disposed on the end walls and which generates an eddy current in the wafer, and a detecting coil which is disposed on the central wall and which detects the eddy current.