公开(公告)号：US20240359288A1

公开(公告)日：2024-10-31

申请号：US18771492

申请日：2024-07-12

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： ChunHung CHEN ,  Jung-Yu LI ,  Sheng-Chen WANG ,  Shih-Sian HUANG

IPC: B24B37/26 ,  B24B37/005 ,  B24B37/10 ,  B24B37/22 ,  B24B37/24 ,  B24B49/12 ,  B24B53/017

CPC classification number: B24B37/26 ,  B24B37/005 ,  B24B37/10 ,  B24B37/22 ,  B24B37/24 ,  B24B49/12 ,  B24B53/017

Abstract: A method of using a polishing pad includes applying a slurry in a first region of the polishing pad. The method further includes spreading the slurry across the first region of the polishing pad at a first rate. The method further includes spreading the slurry across a second region at a second rate different from the first rate, wherein the second region is farther from a center of the polishing pad than the first region. The method further includes spreading the slurry across a third region at a third rate different from the second rate, wherein the second region is between the third region and the first region.

公开(公告)号：US20240351162A1

公开(公告)日：2024-10-24

申请号：US18302349

申请日：2023-04-18

Applicant: GlobalFoundries U.S. Inc.

Inventor： Vivekanand Kalaparthi ,  Keyden Costin

IPC: B24B49/12 ,  B24B7/22

CPC classification number: B24B49/12 ,  B24B7/228

Abstract: A system for imaging a substrate, including a single electromagnetic radiation (EMR) emitter at a first side of the substrate. The system further includes a diffuser between the single EMR emitter and the substrate, the electromagnetic radiation from the single EMR emitter passing through the diffuser to a surface of the substrate. The system includes a photodetector at a second side of the substrate, the photodetector configured to capture reflected electromagnetic radiation from the surface of the substrate. The system further includes a computing device configured to render a single image of substantially an entirety of the surface of the substrate from the captured reflected electromagnetic radiation. The single EMR emitter and the photodetector are at an angle relative to the surface of the substrate that is not one of parallel and perpendicular.

公开(公告)号：US20240326196A1

公开(公告)日：2024-10-03

申请号：US18611535

申请日：2024-03-20

Applicant: EBARA CORPORATION

Inventor： Yuko SHIMIZU

IPC: B24B49/04 ,  B24B49/10 ,  B24B49/12

CPC classification number: B24B49/04 ,  B24B49/105 ,  B24B49/12

Abstract: A polishing endpoint detecting method capable of accurately detecting a polishing endpoint of a substrate is disclosed. The polishing endpoint detecting method includes: polishing a substrate W; creating a film-thickness profile of the substrate by used of a film-thickness sensor 7 mounted to a polishing table 2; dividing the film-thickness profile into a plurality of measurement zones and selecting a monitoring zone from the plurality of measurement zones for determining a polishing endpoint of the substrate; determining whether or not the monitoring zone is changed to another measurement zone based on changes in the film-thickness profile obtained from start to end of polishing of the substrate; and determining a polishing endpoint of the substrate based on the signals in the monitoring zone.

公开(公告)号：US20240308024A1

公开(公告)日：2024-09-19

申请号：US18311900

申请日：2023-05-04

Applicant: National Taiwan University of Science and Technology

Inventor： Chyi-Yeu Lin

IPC: B24B49/12 ,  B24B37/005 ,  B24B37/34 ,  B60S3/06

CPC classification number: B24B49/12 ,  B24B37/005 ,  B24B37/34 ,  B60S3/06

Abstract: A vehicle waxing system and a vehicle waxing method. The vehicle waxing system includes one or more waxing movement mechanisms and a controller. Each of the waxing movement mechanisms is provided with a waxing device and configured to move the waxing device of disposition to perform a waxing operation. The controller is coupled to the waxing movement mechanism. The controller is configured to determine a waxing area of a vehicle according to vehicle external outline information and waxing portion information, and determine the movement trajectory of the waxing operation performed on the waxing area by the waxing device disposed by the waxing movement mechanism. Therefore, an autonomous waxing operation may be achieved.

公开(公告)号：US20240217061A1

公开(公告)日：2024-07-04

申请号：US18044862

申请日：2021-09-15

Applicant: National University Corporation Nagaoka University of Technology ,  Sanoh Industrial Co., Ltd.

Inventor： Hideo Aida ,  Natsuko Omiya

IPC: B24B49/12 ,  G01N23/2254

CPC classification number: B24B49/12 ,  G01N23/2254 ,  G01N2223/611

Abstract: Provided are a polishing state analysis prediction program, a storage, a cathodeluminescence device, and a polishing state analysis prediction method. The polishing state analysis prediction program to predict a future polishing state of a polishing-target substrate to be polished based on a cathodeluminescence image of the polishing-target substrate, the image being obtained by a cathodeluminescence method, the program, when executed by a computer, causing the computer to perform: calculating average light emission intensity data or average luminance data from the cathodeluminescence image of each predetermined time after start of polishing the substrate; and plotting the average light emission intensity data or the average luminance data, and deriving a formula representing a fitting curve resulted from the plotting by using a predetermined function.

公开(公告)号：US11945070B2

公开(公告)日：2024-04-02

申请号：US17289718

申请日：2020-04-17

Applicant: DALIAN UNIVERSITY OF TECHNOLOGY

Inventor： Ping Zhou ,  Zhichao Geng ,  Ying Yan ,  Lin Wang ,  Kai Wang ,  Dongming Guo

IPC: B24B1/00 ,  B24B29/02 ,  B24B41/04 ,  B24B49/12 ,  B24B55/06

CPC classification number: B24B1/00 ,  B24B29/02 ,  B24B41/04 ,  B24B49/12 ,  B24B55/06

Abstract: A rocker polishing apparatus for full-aperture deterministic polishing of a planar part includes a control system, a substrate, a lifting plate, a polishing module and a measuring module. The polishing module and the measuring module are arranged on the substrate. The lifting plate is arranged between the polishing module and the measuring module. The polishing module includes a rocker mechanism, a polishing pad surface dressing mechanism, a polishing pad surface profile measuring apparatus and a continuous polishing pad mechanism. The apparatus allows the material removal rate distribution of the planar part and the surface profile of the planar part be in the normalized mirror symmetry relationship by controlling the material removal rate distribution on the surface of the planar part, thereby implementing the deterministic polishing of the planar part and ensuring the efficient convergence of the surface profile of the planar part in the polishing process.

公开(公告)号：US20240102791A1

公开(公告)日：2024-03-28

申请号：US18371357

申请日：2023-09-21

Applicant: EBARA CORPORATION

Inventor： Akira NAKAMURA

IPC: G01B11/06 ,  B24B49/12

CPC classification number: G01B11/0625 ,  B24B49/12

Abstract: A technique of detecting an abnormality in measuring of a film thickness of a workpiece, such as a wafer, is disclosed. A method includes: generating multiple spectra of reflected light from multiple measurement points on a workpiece over a predetermined period of time during polishing of the workpiece; classifying the multiple spectra into a plurality of groups including at least a first group and a second group according to feature of each of the multiple spectra; determining a monitoring index value based on at least the number of spectra included in the first group; and detecting an abnormality in measuring of the film thickness of the at least one workpiece based on comparison of the monitoring index value with a threshold value.

公开(公告)号：US20240087965A1

公开(公告)日：2024-03-14

申请号：US18511661

申请日：2023-11-16

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Charles C. Garretson ,  Huanbo Zhang ,  Zhize Zhu

IPC: H01L21/66 ,  B24B37/30 ,  B24B49/12 ,  B25J9/16 ,  H01L21/306 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L22/26 ,  B24B37/30 ,  B24B49/12 ,  B25J9/1628 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67253 ,  H01L21/68707 ,  H01L22/20 ,  H01L22/12

Abstract: A method for chemical mechanical polishing includes receiving an angular removal profile for a carrier head and an angular thickness profile of a substrate. Prior to polishing the substrate, a desired angle of the carrier head relative to the substrate is selected for loading the substrate into the carrier head. Selecting the desired angle is performed based on a comparison of the angular removal profile for the carrier head and the angular thickness profile of the substrate to reduce angular non-uniformity in polishing. The carrier head is rotated to receive the substrate at the desired angle, the substrate is transferred to the carrier head and loaded in the carrier head with the carrier head at the desired angle relative to the substrate, and the substrate is polished.

公开(公告)号：US11904433B2

公开(公告)日：2024-02-20

申请号：US16641958

申请日：2018-08-11

Applicant: FREEDOM AUTOMATION SOLUTIONS LLP

Inventor： Ivan Nikolayevich Sytenko

IPC: B24B49/12 ,  B24B9/16 ,  B24B49/02 ,  B24B49/16

CPC classification number: B24B49/12 ,  B24B9/161 ,  B24B9/163 ,  B24B9/167 ,  B24B49/02 ,  B24B49/16

Abstract: The present disclosure provides a fully automatic gemstone polishing robot. An aspect of the present disclosure provides an automatic gemstone polishing robot comprising: a gemstone polishing unit, comprising a gemstone holding unit for supporting a gemstone in contact with an abrasive surface, and configured to polish said gemstone in a plurality of iterations based on a feedback signal; an image capturing unit to capture, in one or more of the plurality of iterations, at least one image of the gemstone; and an image processing unit, which when executed by one or more processors, analyzes said at least one image of the gemstone with respect to one or a plurality of gemstone parameters, wherein the image processing unit is further configured to compare the one or a plurality of analyzed gemstone parameters with one or a plurality of pre-determined gemstone parameters to generate the feedback signal to be transmitted to the gemstone polishing unit. Another aspect of the present disclosure relates to a method of polishing a gemstone utilizing the automatic gemstone polishing robot.

公开(公告)号：US20240025012A1

公开(公告)日：2024-01-25

申请号：US18257352

申请日：2021-12-17

Applicant: Marposs Societa' Per Azioni

Inventor： Christian Wurm ,  Alessandro Ruggeri ,  Claudio De Simone ,  Daniele Lanzoni ,  Andrea Turrini

IPC: B24B49/12 ,  B24B49/10 ,  B24B49/00

CPC classification number: B24B49/12 ,  B24B49/10 ,  B24B49/003

Abstract: Monitoring system (12) for a mobile component (3), for example a rotating component, supported by a stationary component (2). The monitoring system (12) comprises: an acoustic sensor (10) which is positioned in the movable component (3) and comprises two terminals (17); a first amplifier (18) which is positioned in the movable component (3) and has two input terminals and two output terminals; a contactless communication unit (14) provided with a first transceiver device (15) positioned in the mobile component (3) and a second transceiver device (16) which faces the first transceiver device (15) and is positioned in the stationary component (2); a first connection line (19) which connects the sensor (10) to the first amplifier (18) e has two electrical leads each of them connecting a terminal (17) of the acoustic sensor (10) to a corresponding input terminal of the first amplifier (18); and a second connection line (20) which connects the first amplifier (18) to the first transceiver device (15) and has two electrical leads each of them connecting an output terminal of the first amplifier (18) to the first transceiver device (15).