公开(公告)号：US12103134B2

公开(公告)日：2024-10-01

申请号：US17440191

申请日：2019-09-04

Applicant: HANGZHOU ZHONGGUI ELECTRONIC TECHNOLOGY CO., LTD

Inventor： Hui Xu ,  Linghan Shen

IPC: B24B37/30 ,  B25B11/00 ,  H01L21/683 ,  H01L21/687

CPC classification number: B24B37/30 ,  B25B11/005 ,  H01L21/683 ,  H01L21/68742

Abstract: Disclosed are a wafer loading bracket, a wafer loading system and a wafer mounting method. The wafer loading bracket, which can lift, and a polishing head including a plurality of pressure medium cavities are used. In a wafer loading process, arc-shaped deformation occurs, under pressure, on an attachment film of the polishing head; a wafer on a wafer-bearing base of the wafer loading bracket is lifted to a loading position, and comes into contact with the attachment film, a pressure medium cavity which is in contact with the attachment film is vacuumized; and the wafer and the attachment film, under vacuum conditions, are attached to the polishing head, and the wafer is transferred to the polishing head to complete loading.

公开(公告)号：US12011800B2

公开(公告)日：2024-06-18

申请号：US17850228

申请日：2022-06-27

Applicant: Bruker Nano Inc.

Inventor： Vladimir Gulkov ,  Nikolay Yeremin

IPC: B24B37/013 ,  B24B37/04 ,  B24B37/10 ,  B24B37/30 ,  B24B49/00 ,  B24B49/10

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B37/046 ,  B24B37/107 ,  B24B37/30 ,  B24B49/006 ,  B24B49/10

Abstract: Shortcomings associated with insufficient control of a conventional CMP-process are obviated by providing an CMP-apparatus configured to complement a constant force (to which a workpiece that is being polished is conventionally exposed) with a time-alternating force and/or means for measuring an electrical characteristic of the CMP-process. The time-alternating force is applied with the use of a system component that is electrically isolated from the workpiece and that is disposed in the carrier-chick in which the workpiece is affixed for CMP-process, while the electrical characteristic is measured with the use of a judiciously-configured reservoir in which the used fluid is collected. The use of such CMP-apparatus.

公开(公告)号：US20240087965A1

公开(公告)日：2024-03-14

申请号：US18511661

申请日：2023-11-16

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Charles C. Garretson ,  Huanbo Zhang ,  Zhize Zhu

IPC: H01L21/66 ,  B24B37/30 ,  B24B49/12 ,  B25J9/16 ,  H01L21/306 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L22/26 ,  B24B37/30 ,  B24B49/12 ,  B25J9/1628 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67253 ,  H01L21/68707 ,  H01L22/20 ,  H01L22/12

Abstract: A method for chemical mechanical polishing includes receiving an angular removal profile for a carrier head and an angular thickness profile of a substrate. Prior to polishing the substrate, a desired angle of the carrier head relative to the substrate is selected for loading the substrate into the carrier head. Selecting the desired angle is performed based on a comparison of the angular removal profile for the carrier head and the angular thickness profile of the substrate to reduce angular non-uniformity in polishing. The carrier head is rotated to receive the substrate at the desired angle, the substrate is transferred to the carrier head and loaded in the carrier head with the carrier head at the desired angle relative to the substrate, and the substrate is polished.

公开(公告)号：US11919126B2

公开(公告)日：2024-03-05

申请号：US17318765

申请日：2021-05-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Lung Lai ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng

IPC: B24B37/30 ,  B24B37/04 ,  H01L21/306 ,  H01L21/67 ,  H01L21/677

CPC classification number: B24B37/30 ,  B24B37/042 ,  H01L21/30625 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67219 ,  H01L21/67253 ,  H01L21/67742

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

公开(公告)号：US20240033878A1

公开(公告)日：2024-02-01

申请号：US17874627

申请日：2022-07-27

Applicant: Applied Materials, Inc.

Inventor： Eric L. Lau ,  Huanbo Zhang ,  Zhize Zhu ,  Ekaterina A. Mikhaylichenko ,  Christopher HeungGyun Lee ,  Jeonghoon Oh

IPC: B24B37/30 ,  B24B37/04 ,  B24B53/017

CPC classification number: B24B37/30 ,  B24B37/042 ,  B24B53/017

Abstract: Exemplary polishing methods for chemical mechanical polishing may include engaging a substrate with a membrane of a substrate carrier. The methods may include chucking the substrate against a substantially planar surface defined by the substrate carrier. The chucking may reduce a bow in the substrate. The methods may include polishing one or more materials on the substrate for a first period of time. The methods may include disengaging the substrate from the substantially planar surface. The methods may include polishing the one or more materials on the substrate for a second period of time.

公开(公告)号：US11806829B2

公开(公告)日：2023-11-07

申请号：US16906992

申请日：2020-06-19

Applicant: Applied Materials, Inc.

Inventor： Puneet Narendra Jawali ,  Nandan Baradanahalli Kenchappa ,  Jason G. Fung ,  Shiyan Akalanka Jayanath Wewala Gonnagahadeniyage ,  Rajeev Bajaj ,  Adam Wade Manzonie ,  Andrew Scott Lawing

IPC: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24B37/30

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24B37/30

Abstract: Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.

公开(公告)号：US11679467B2

公开(公告)日：2023-06-20

申请号：US17405933

申请日：2021-08-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Hsi Huang ,  Huang-Chu Ko

IPC: B24B37/015 ,  B24B49/14 ,  B24B57/02 ,  B24B37/04 ,  B24B37/10 ,  B24B55/02 ,  B24B37/30

CPC classification number: B24B37/015 ,  B24B37/042 ,  B24B37/107 ,  B24B49/14 ,  B24B55/02 ,  B24B57/02 ,  B24B37/30

Abstract: An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.

公开(公告)号：US20190184519A1

公开(公告)日：2019-06-20

申请号：US16222779

申请日：2018-12-17

Applicant: EBARA CORPORATION

Inventor： Makoto KASHIWAGI ,  Fong-Jie DU ,  Manao HOSHINA

IPC: B24B37/30

CPC classification number: B24B37/30 ,  B24B21/004 ,  B24B21/08 ,  H01L21/304

Abstract: A polishing head having a simple construction and a compact size is disclosed. The polishing head includes: a polishing-tool pressing member for supporting a polishing tool; a movable shaft coupled to the polishing-tool pressing member; a housing which houses the movable shaft therein; and a diaphragm which forms a pressure chamber between an end portion of the movable shaft and the housing, the diaphragm including a central portion in contact with the end portion of the movable shaft, an inner wall portion connecting with the central portion and extending along a side surface of the movable shaft, a folded-back portion connecting with the inner wall portion and having a curved cross section, and an outer wall portion connecting with the folded-back portion and located outside the inner wall portion.

公开(公告)号：US10052739B2

公开(公告)日：2018-08-21

申请号：US13560636

申请日：2012-07-27

Applicant: Manoj A. Gajendra ,  Kiran Giriyapura

Inventor： Manoj A. Gajendra ,  Kiran Giriyapura

IPC: B24B37/32 ,  B24B37/30

CPC classification number: B24B37/30

Abstract: A chemical mechanical polishing head includes a base assembly that includes at least one component formed of a composite plastic having a tensile modulus approximately equal to or greater than aluminum, a retaining ring secured to the base assembly, and a flexible membrane secured to the base assembly to form a pressurizable chamber between the base assembly and an upper surface of the flexible membrane. A lower surface of the flexible membrane provides a substrate mounting surface.

公开(公告)号：US10040166B2

公开(公告)日：2018-08-07

申请号：US14312641

申请日：2014-06-23

Applicant: EBARA CORPORATION

Inventor： Osamu Nabeya ,  Tetsuji Togawa ,  Makoto Fukushima ,  Hozumi Yasuda

IPC: B24B37/32 ,  B24B37/20 ,  B24B37/30 ,  B24B47/22 ,  B24B49/16 ,  B24B37/005 ,  B24B37/10 ,  B24B49/00

CPC classification number: B24B37/20 ,  B24B37/005 ,  B24B37/042 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16 ,  B24B49/18 ,  B24B49/183

Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.