公开(公告)号：US20230381918A1

公开(公告)日：2023-11-30

申请号：US18446842

申请日：2023-08-09

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Hsi Huang ,  Chia-Lin Hsueh ,  Huang-Chu Ko

IPC分类号： B24B49/00 ,  B24B37/005 ,  B24B37/04 ,  B24B49/12 ,  B24B49/10 ,  B24B37/20

CPC分类号： B24B49/006 ,  B24B37/005 ,  B24B37/042 ,  B24B49/12 ,  B24B49/003 ,  B24B49/10 ,  B24B37/20

摘要： The present disclosure describes an apparatus and a method to detect a polishing pad profile during a polish process and adjust the polishing process based on the detected profile. The apparatus can include a polishing pad configured to polishing a substrate, a substrate carrier configured to hold the substrate against the polishing pad, and a detection module configured to detect a profile of the polishing pad. The detection module can include a probe configured to measure a thickness of one or more areas on the polishing pad, and a beam configured to support the probe, where the probe can be further configured to move along the beam.

公开(公告)号：US12103133B2

公开(公告)日：2024-10-01

申请号：US18198727

申请日：2023-05-17

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Hsi Huang ,  Huang-Chu Ko

IPC分类号： B24B37/015 ,  B24B37/04 ,  B24B37/10 ,  B24B49/14 ,  B24B55/02 ,  B24B57/02 ,  B24B37/30

CPC分类号： B24B37/015 ,  B24B37/042 ,  B24B37/107 ,  B24B49/14 ,  B24B55/02 ,  B24B57/02 ,  B24B37/30

摘要： An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.

公开(公告)号：US11679467B2

公开(公告)日：2023-06-20

申请号：US17405933

申请日：2021-08-18

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Hsi Huang ,  Huang-Chu Ko

IPC分类号： B24B37/015 ,  B24B49/14 ,  B24B57/02 ,  B24B37/04 ,  B24B37/10 ,  B24B55/02 ,  B24B37/30

CPC分类号： B24B37/015 ,  B24B37/042 ,  B24B37/107 ,  B24B49/14 ,  B24B55/02 ,  B24B57/02 ,  B24B37/30

摘要： An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.

公开(公告)号：US11103970B2

公开(公告)日：2021-08-31

申请号：US15901796

申请日：2018-02-21

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Hsi Huang ,  Huang-Chu Ko

IPC分类号： B24B37/015 ,  B24B49/14 ,  B24B57/02 ,  B24B37/04 ,  B24B37/10 ,  B24B55/02 ,  B24B37/30

摘要： An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.

公开(公告)号：US20190054590A1

公开(公告)日：2019-02-21

申请号：US15901796

申请日：2018-02-21

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Hsi Huang ,  Huang-Chu Ko

IPC分类号： B24B37/015 ,  B24B37/04 ,  B24B57/02

摘要： An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.