公开(公告)号：US12011800B2

公开(公告)日：2024-06-18

申请号：US17850228

申请日：2022-06-27

Applicant: Bruker Nano Inc.

Inventor： Vladimir Gulkov ,  Nikolay Yeremin

IPC: B24B37/013 ,  B24B37/04 ,  B24B37/10 ,  B24B37/30 ,  B24B49/00 ,  B24B49/10

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B37/046 ,  B24B37/107 ,  B24B37/30 ,  B24B49/006 ,  B24B49/10

Abstract: Shortcomings associated with insufficient control of a conventional CMP-process are obviated by providing an CMP-apparatus configured to complement a constant force (to which a workpiece that is being polished is conventionally exposed) with a time-alternating force and/or means for measuring an electrical characteristic of the CMP-process. The time-alternating force is applied with the use of a system component that is electrically isolated from the workpiece and that is disposed in the carrier-chick in which the workpiece is affixed for CMP-process, while the electrical characteristic is measured with the use of a judiciously-configured reservoir in which the used fluid is collected. The use of such CMP-apparatus.

公开(公告)号：US11679467B2

公开(公告)日：2023-06-20

申请号：US17405933

申请日：2021-08-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Hsi Huang ,  Huang-Chu Ko

IPC: B24B37/015 ,  B24B49/14 ,  B24B57/02 ,  B24B37/04 ,  B24B37/10 ,  B24B55/02 ,  B24B37/30

CPC classification number: B24B37/015 ,  B24B37/042 ,  B24B37/107 ,  B24B49/14 ,  B24B55/02 ,  B24B57/02 ,  B24B37/30

Abstract: An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.

公开(公告)号：US20190009385A1

公开(公告)日：2019-01-10

申请号：US16025515

申请日：2018-07-02

Applicant: EBARA CORPORATION

Inventor： Yasumasa HIROO ,  Keita YAGI

IPC: B24B53/017 ,  B24B37/005

CPC classification number: B24B53/017 ,  B24B37/005 ,  B24B37/013 ,  B24B37/107 ,  B24B49/105 ,  B24B49/12

Abstract: A polishing apparatus comprises a dresser that can adjust swing speed in the scanning areas set on a polishing member along a swing direction, a height detection section that measures a surface height of the polishing member in a plurality of monitoring areas set on the polishing member along the swing direction of the dresser, a dress model matrix creation section that creates a dress model matrix defined from a plurality of monitoring areas, scanning areas and a dress model, an evaluation index creation section that calculates a height profile predicted value using the dress model, the swing speed in each scanning area or a staying time and sets evaluation index based on a difference from a target value of height profile of the polishing member and a moving speed calculation section that calculates the swing speed in each scanning area of the dresser based on the evaluation index.

公开(公告)号：US10058975B2

公开(公告)日：2018-08-28

申请号：US15410512

申请日：2017-01-19

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown

IPC: B24B37/015 ,  B24B49/14 ,  B24B55/02 ,  B24B37/34 ,  B24C1/00

CPC classification number: B24B37/015 ,  B24B37/107 ,  B24B37/34 ,  B24B49/14 ,  B24B53/017 ,  B24B55/02 ,  B24C1/003

Abstract: Implementations of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates, including an apparatus for in-situ temperature control during polishing, and methods of using the same. More specifically, implementations of the present disclosure relate to in-situ temperature control with a condensed gas during a chemical-mechanical polishing (CMP) process. In one implementation, the method comprises polishing one or more substrates against a polishing surface in the presence of a polishing fluid during a polishing process to remove a portion of a material formed on the one or more substrates. A temperature of the polishing surface is monitored during the polishing process. Carbon dioxide snow is delivered to the polishing surface in response to the monitored temperature to maintain the temperature of the polishing surface at a target value during the polishing process.

公开(公告)号：US09764446B2

公开(公告)日：2017-09-19

申请号：US14682477

申请日：2015-04-09

Applicant: EBARA CORPORATION

Inventor： Hideo Aizawa ,  Tadakazu Sone ,  Masao Umemoto ,  Ryuichi Kosuge

IPC: B24B57/02 ,  B24B37/10

CPC classification number: B24B57/02 ,  B24B37/10 ,  B24B37/107

Abstract: The invention suppresses generation of noises attributable to rotation of a rotary joint. A rotary joint includes a rotating body that rotates on a rotating axis A, a housing disposed so as to surround the rotating body, and at least one bearing disposed between the rotating body and the housing and adapted to support rotation of the rotating body. The rotary joint supplies fluids through fluid connection ports formed in the housing and fluid passages formed inside the rotating body to a polishing table having attached thereto a polishing pad for polishing a substrate or a holding portion that is adapted to hold the substrate while pressing the substrate against the polishing pad. At least one elastic member is interposed at least either between the rotating body and the at least one bearing or between the housing and the at least one bearing.

公开(公告)号：US20170252889A1

公开(公告)日：2017-09-07

申请号：US15599919

申请日：2017-05-19

Applicant: EBARA CORPORATION

Inventor： Katsuhide WATANABE ,  Masakazu IHARA

IPC: B24B37/005 ,  B24B49/16 ,  B24B37/10 ,  B24B49/18

CPC classification number: B24B37/005 ,  B24B37/107 ,  B24B49/16 ,  B24B49/18

Abstract: A polishing apparatus includes a table rotating motor configured to rotate a polishing table about its own axis, a top ring rotating motor configured to rotate a top ring about its own axis, a dresser configured to dress a polishing pad, and a pad-height measuring device configured to measure a height of the polishing pad. The polishing apparatus also includes a diagnostic device configured to calculate an amount of wear of the polishing pad from the height of the polishing pad and to determine the end of a life of the polishing pad based on the amount of the wear of the polishing pad, the torque or current of the table rotating motor, and the torque or current of the top ring rotating motor.

公开(公告)号：US09687955B2

公开(公告)日：2017-06-27

申请号：US13227804

申请日：2011-09-08

Applicant: Katsuhide Watanabe ,  Masakazu Ihara

Inventor： Katsuhide Watanabe ,  Masakazu Ihara

IPC: B24B49/10 ,  B24B37/005 ,  B24B37/10 ,  B24B49/16 ,  B24B49/18

CPC classification number: B24B37/005 ,  B24B37/107 ,  B24B49/16 ,  B24B49/18

Abstract: A polishing apparatus includes a table rotating motor configured to rotate a polishing table about its own axis, a top ring rotating motor configured to rotate a top ring about its own axis, a dresser configured to dress a polishing pad, and a pad-height measuring device configured to measure a height of the polishing pad. The polishing apparatus also includes a diagnostic device configured to calculate an amount of wear of the polishing pad from the height of the polishing pad and to determine the end of a life of the polishing pad based on the amount of the wear of the polishing pad, the torque or current of the table rotating motor, and the torque or current of the top ring rotating motor.

公开(公告)号：US09610672B2

公开(公告)日：2017-04-04

申请号：US14470852

申请日：2014-08-27

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon Oh ,  Steven M. Zuniga ,  Andrew Nagengast ,  Samuel Chu-Chiang Hsu ,  Gautam Shashank Dandavate

IPC: H01L21/306 ,  B24B37/10 ,  B24B37/11 ,  B24B37/30

CPC classification number: B24B37/107 ,  B24B37/11 ,  B24B37/30

Abstract: A polishing head for chemical mechanical planarization is provided. The polishing head includes a housing and a flexible membrane secured to the housing. At least a first, second, and third pressurizable chamber are disposed in the housing and each chamber contacts the flexible membrane. A first pressure delivery channel couples to the first chamber. A second pressure delivery channel couples to the third chamber. A first pressure feed line couples the first pressure delivery channel to the second chamber. A second pressure feed line couples the second pressure delivery channel to the second chamber. A first manually movable plug interfaces with the first pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber. A second manually movable plug interfaces with the second pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber.

公开(公告)号：US20150290765A1

公开(公告)日：2015-10-15

申请号：US14644724

申请日：2015-03-11

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yosuke OTSUKA ,  Masako KODERA ,  Yukiteru MATSUI

IPC: B24B53/007 ,  B24B1/00

CPC classification number: B24B53/007 ,  B24B1/00 ,  B24B37/04 ,  B24B37/042 ,  B24B37/044 ,  B24B37/10 ,  B24B37/107 ,  B24B53/017 ,  C11D3/0073 ,  C11D7/265 ,  C11D7/3209 ,  C11D7/3245 ,  C11D7/3281 ,  C11D11/0047 ,  H01L21/02065 ,  H01L21/02074 ,  H01L21/31053 ,  H01L21/3212

Abstract: In a substrate processing method according to an embodiment, a surface of an object to be polished disposed on a substrate is polished on a polishing pad supplied with slurry. After the polishing process using the slurry, the surface of the object to be polished on the polishing pad is polished, while supplying water on the polishing pad where a residue including the slurry or a sludge of the polishing pad adhered. After the polishing process using the water, the surface of the object to be polished is cleaned on the polishing pad by supplying rinse liquid on the polishing pad.

Abstract translation: 在根据实施例的基板处理方法中，将抛光物体的表面设置在基板上，在供给有浆料的抛光垫上进行抛光。 在使用浆料进行抛光处理之后，抛光抛光垫上待抛光物体的表面，同时在抛光垫上提供水，其中包括浆料的残留物或抛光垫的污泥被粘附。 在使用水的抛光处理之后，通过在抛光垫上提供冲洗液体将抛光对象的表面清洁在抛光垫上。

公开(公告)号：US09073169B2

公开(公告)日：2015-07-07

申请号：US13223159

申请日：2011-08-31

Applicant: Kun Xu ,  Ingemar Carlsson ,  Feng Q. Liu ,  David Maxwell Gage ,  You Wang ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Yuchun Wang ,  Pierre Fontarensky ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

Inventor： Kun Xu ,  Ingemar Carlsson ,  Feng Q. Liu ,  David Maxwell Gage ,  You Wang ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Yuchun Wang ,  Pierre Fontarensky ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

IPC: G06F19/00 ,  H01L21/00 ,  B24B49/00 ,  B24B37/005 ,  B24B37/04 ,  B24B37/10 ,  B24B37/30 ,  B24B49/12 ,  G01B11/06

CPC classification number: B24B37/005 ,  B24B37/042 ,  B24B37/107 ,  B24B37/30 ,  B24B49/12 ,  G01B11/0683

Abstract: A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.

Abstract translation: 控制抛光的方法包括在下层或层结构上抛光具有上层的第一衬底。 在抛光期间，用原位监测系统监测基底以产生测量序列。 测量被分组成组，每个组与衬底上的多个区域的不同区域相关联。 对于每个区域，基于来自关联组的测量来确定覆盖层被清除的时间。 基于在抛光衬底期间在至少一个区域中施加的压力，至少一个区域的时间和另一个区域的时间来计算至少一个至少一个区域的调整后的第二抛光压力。 使用至少一个调整的抛光压力来抛光第二基底。