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    Polishing method and apparatus
    2.
    发明授权
    Polishing method and apparatus 有权

    公开(公告)号：US10478938B2

    公开(公告)日：2019-11-19

    申请号：US15434736

    申请日：2017-02-16

    Applicant: Ebara Corporation

    Inventor： Tsuneo Torikoshi

    IPC: B24B37/04 ,  B24B49/00 ,  B24B37/005 ,  B24B53/017 ,  B24B37/34 ,  B24B53/007 ,  B24B49/18 ,  B24B37/013 ,  B24B27/00

    Abstract: A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.

    Polishing pad conditioning system including suction
    4.
    发明授权
    Polishing pad conditioning system including suction 有权
    抛光垫调节系统包括抽吸

    公开(公告)号：US09375825B2

    公开(公告)日：2016-06-28

    申请号：US14266543

    申请日：2014-04-30

    Applicant: Applied Materials, Inc.

    Inventor： Lizhong Sun ,  Byung-Sung Leo Kwak

    IPC: B24B53/017 ,  B24B55/06 ,  B24B53/007

    CPC classification number: B24B53/017 ,  B24B53/007 ,  B24B55/06

    Abstract: A system for use in substrate polishing includes a conditioner system for conditioning a surface of a polishing pad and a vacuum system having a vacuum port. The conditioner system includes a conditioner head constructed to receive an abrasive conditioner component. The vacuum system is configured to apply suction through the vacuum port to the surface of the polishing pad in a direction away from the surface to remove material on the surface.

    Abstract translation: 用于基板抛光的系统包括用于调节抛光垫表面的调节系统和具有真空端口的真空系统。 调节器系统包括构造成接收研磨调理器部件的调节头。 真空系统构造成通过真空端口沿着远离表面的方向将吸力施加到抛光垫的表面以去除表面上的材料。

    SYSTEM AND METHOD FOR IN-SITU HEAD RINSE
    6.
    发明申请
    SYSTEM AND METHOD FOR IN-SITU HEAD RINSE 审中-公开
    用于现场头部冲洗的系统和方法

    公开(公告)号：US20080003931A1

    公开(公告)日：2008-01-03

    申请号：US11562811

    申请日：2006-11-22

    Applicant: Antoine Manens ,  Alain Duboust ,  Paul Butterfield ,  Yan Wang ,  Shi-Ping Wang ,  Zhihong Wang ,  Andrew Nagengast ,  Wei-Yung Hsu ,  Liang-Yuh Chen

    Inventor： Antoine Manens ,  Alain Duboust ,  Paul Butterfield ,  Yan Wang ,  Shi-Ping Wang ,  Zhihong Wang ,  Andrew Nagengast ,  Wei-Yung Hsu ,  Liang-Yuh Chen

    IPC: B24B53/007

    CPC classification number: B24B37/30 ,  B24B55/00 ,  H01L21/67219

    Abstract: A carrier head and a method of cleaning the carrier head are disclosed. The carrier head may have one or more openings through a sidewall that extend into a cavity within the carrier head using a fluid passage. The openings may each have a lip. The lip may have a chamfered edge. Additionally, a fluid passage may slope generally downward from the openings to the cavity. The chamfered lips and the sloped fluid passage reduce back splashing and help ensure that sufficient rinsing fluid reaches the cavity to rinse polishing fluid and particles from the carrier head. The present invention relates to carrier heads for polishing or planarizing semiconductor substrates by chemical mechanical polishing (CMP) or electrochemical mechanical polishing (ECMP). The cavities in the carrier head are cleaned by rinsing fluid (i.e., liquid or gas) from inside the cavity towards a substrate receiving side of the carrier head.

    Abstract translation: 公开了载体头和清洁载体头的方法。 载体头部可以具有穿过侧壁的一个或多个开口，该侧壁使用流体通道延伸到载体头部内的空腔中。 开口可以各自具有唇缘。 唇缘可以具有倒角边缘。 此外，流体通道可以从开口大致向下倾斜到空腔。 倒角的唇缘和倾斜的流体通道减少了飞溅，并有助于确保足够的冲洗流体到达腔体以从载体头部漂洗抛光液和颗粒。 本发明涉及用于通过化学机械抛光（CMP）或电化学机械抛光（ECMP）对半导体衬底进行抛光或平面化的载体头。 载体头部中的空腔通过从空腔内部朝向承载头的基板接收侧的冲洗流体（即，液体或气体）来清洁。

    Apparatus for conditioning processing pads
    7.
    发明申请
    Apparatus for conditioning processing pads 有权
    用于调理加工垫的装置

    公开(公告)号：US20050282477A1

    公开(公告)日：2005-12-22

    申请号：US11102052

    申请日：2005-04-08

    Applicant: Paul Butterfield ,  Sen-Hou Ko

    Inventor： Paul Butterfield ,  Sen-Hou Ko

    IPC: B24B1/00 ,  B24B37/04 ,  B24B53/007 ,  B24B53/12

    CPC classification number: B24B53/017 ,  B24B53/12

    Abstract: Embodiments of a flexible pad conditioner for conditioning a processing pad are provided. The pad conditioner includes an arc-shaped member having an abrasive bottom surface configured for conditioning the processing pad. Means are provided to apply a downward force as well as to oscillate the pad conditioner. Further means may be provided to vary the downward force along the length of the pad conditioner. In one embodiment, a plurality of actuators may be coupled to a top surface of the member and adapted to selectively provide an independently controllable force against the member to finely control the conditioning profile.

    Abstract translation: 提供了一种用于调理处理垫的柔性垫调节器的实施例。 垫调节器包括具有用于调理处理垫的研磨底面的弧形构件。 提供装置以施加向下的力以及使垫调节器振荡。 可以提供另外的装置来改变沿衬垫调节器的长度的向下的力。 在一个实施例中，多个致动器可以联接到构件的顶表面并且适于选择性地提供抵靠构件的独立可控的力以精细地控制调节轮廓。

    Pad conditioner of CMP equipment
    8.
    发明授权
    Pad conditioner of CMP equipment 有权
    CMP设备的垫式调节器

    公开(公告)号：US06960114B2

    公开(公告)日：2005-11-01

    申请号：US10766485

    申请日：2004-01-29

    Applicant: Jong-Won Lee

    Inventor： Jong-Won Lee

    IPC: H01L21/304 ,  B24B53/007 ,  B24B53/017 ,  B24B1/00

    CPC classification number: B24B53/017

    Abstract: A pad conditioner of wafer planarization equipment includes a linear driving device for moving a disk holder up and down using a magnetic force. The linear driving device has an electromagnet, a permanent magnet, and a controller. The controller controls the power supplied to the electromagnet such that the electromagnet and permanent magnet produce a force of attraction and/or repulsion used to move the disk holder relative to a polishing pad of the wafer planarization equipment.

    Abstract translation: 晶片平面化设备的衬垫调节器包括用于使用磁力使盘保持器上下移动的线性驱动装置。 线性驱动装置具有电磁体，永磁体和控制器。 控制器控制提供给电磁体的功率，使得电磁体和永磁体产生用于相对于晶片平面化设备的抛光垫移动盘保持器的吸引力和/或排斥力。

    Polishing pad conditioning system
    9.
    发明授权
    Polishing pad conditioning system 失效
    抛光垫调节系统

    公开(公告)号：US06958005B1

    公开(公告)日：2005-10-25

    申请号：US10813294

    申请日：2004-03-30

    Applicant: Robert Charatan

    Inventor： Robert Charatan

    IPC: B24B1/00 ,  B24B37/04 ,  B24B53/007 ,  B24B53/12 ,  B24B57/02

    CPC classification number: B24B53/017 ,  B24B53/12 ,  B24B57/02

    Abstract: A pad conditioning system for conditioning a polishing pad in conjunction with a workpiece polishing operation includes a pad conditioning head coupled with a positioning unit. The pad conditioning head includes a plurality of abrasive particles protruding from a surface of the pad conditioning head. The positioning unit is configured to move the surface into contact with a polishing pad. The pad conditioning system also includes a liquid supply nozzle. The liquid supply nozzle is configured to selectively discharge liquid proximate to the abrasive particles that are in contact with the polishing pad to minimize frictional wear of the abrasive particles.

    Abstract translation: 用于调整抛光垫的工件抛光操作的衬垫调节系统包括与定位单元联接的衬垫调节头。 垫调节头包括从垫调节头的表面突出的多个磨料颗粒。 定位单元构造成使表面移动到与抛光垫接触。 垫调节系统还包括液体供应喷嘴。 液体供应喷嘴构造成选择性地排出与抛光垫接触的磨料颗粒附近的液体，以最小化磨料颗粒的摩擦磨损。

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