公开(公告)号：US12033865B2

公开(公告)日：2024-07-09

申请号：US18198337

申请日：2023-05-17

申请人： Applied Materials, Inc.

发明人： Jeonghoon Oh ,  Steven M. Zuniga ,  Andrew J. Nagengast ,  Samuel Chu-Chiang Hsu ,  Gautam Shashank Dandavate

IPC分类号： H01L21/321 ,  B24B37/04 ,  B24B37/32 ,  B24B41/06 ,  B24B37/10 ,  H01L21/304 ,  H01L21/306

CPC分类号： H01L21/3212 ,  B24B37/04 ,  B24B37/32 ,  B24B41/06 ,  B24B37/10 ,  H01L21/304 ,  H01L21/30625

摘要： A retaining ring comprises a generally annular body. The body comprises a top surface, a bottom surface, an outer surface connected to the top surface at an outer top perimeter and the bottom surface at an outer bottom perimeter, and an inner surface connected to the top surface at an inner top perimeter and the bottom surface at an inner bottom perimeter. The inner surface comprises seven or more planar facets. Adjacent planar facets are connected at corners. The inner bottom perimeter comprises straight edges of the planar facets connected at the corners.

公开(公告)号：US20230373062A1

公开(公告)日：2023-11-23

申请号：US17750426

申请日：2022-05-23

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Yu-Chen Wei ,  Feng-Inn Wu ,  You-Shiang Lin ,  Jiun Ru Huang ,  Jyun-Jie Wu

IPC分类号： B24B53/017 ,  B24B37/04 ,  B24B37/10 ,  B24B57/02

CPC分类号： B24B53/017 ,  B24B37/044 ,  B24B37/10 ,  B24B57/02

摘要： A chemical mechanical polishing (CMP) apparatus includes a polishing pad located on a top surface of a platen configured to rotate around a vertical axis passing through the platen, a wafer carrier configured to hold a substrate and facing the polishing pad, and an integrated slurry mixer-dispenser including at least two inlet ports configured to receive a respective slurry component, configured to generate slurry by mixing at least two slurry components provided through the at least two inlet ports, and including a dispensation port configured to dispense the slurry over the polishing pad.

公开(公告)号：US20230278160A1

公开(公告)日：2023-09-07

申请号：US18317003

申请日：2023-05-12

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Chih-Yuan YANG ,  Huai-Tei YANG ,  Yu-Chen WEI ,  Szu-Cheng WANG ,  Li-Hsiang CHAO ,  Jen-Chieh LAI ,  Shih-Ho LIN

IPC分类号： B24B37/32 ,  B24B37/10 ,  H01L21/8234 ,  H01L21/304 ,  H01L29/66 ,  H01L29/78 ,  H01L21/321

CPC分类号： B24B37/32 ,  B24B37/10 ,  H01L21/823437 ,  H01L21/823431 ,  H01L21/304 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/7851 ,  H01L21/3212

摘要： A method of using a polishing system includes securing a wafer in a carrier head, the carrier head including a housing enclosing the wafer, in which the housing includes a retainer ring recess and a retainer ring positioned in the retainer ring recess, the retainer ring surrounding the wafer, in which the retainer ring includes a main body portion and a bottom portion connected to the main body portion, and a bottom surface of the bottom portion includes at least one first engraved region and a first non-engraved region adjacent to the first engraved region; pressing the wafer against a polishing pad; and moving the carrier head or the polishing pad relative to the other.

公开(公告)号：US20230274929A1

公开(公告)日：2023-08-31

申请号：US18312073

申请日：2023-05-04

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chih-I PENG ,  Hsiu-Ming YEH ,  Yi-Chang LIU

IPC分类号： H01L21/02 ,  H01L21/306 ,  B24B37/10 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L21/02057 ,  H01L21/30625 ,  B24B37/10 ,  H01L21/67051 ,  H01L21/67748 ,  H01L21/67173 ,  H01L21/67219 ,  H01L21/02074 ,  H01L21/67259

摘要： A method for processing a semiconductor wafer is provided. The method includes polishing the semiconductor wafer with a chemical mechanical polishing (CMP) tool. The method includes transferring the polished semiconductor wafer to an interface tool from the CMP tool. The method includes discharging a mist spray over the polished semiconductor wafer in the interface tool. The method includes transferring the semiconductor wafer form the interface tool to a cleaning tool for a cleaning process.

公开(公告)号：US11724357B2

公开(公告)日：2023-08-15

申请号：US17985778

申请日：2022-11-11

申请人： Applied Materials, Inc.

发明人： Steven M. Zuniga ,  Jay Gurusamy ,  Andrew J. Nagengast

IPC分类号： B24B37/10 ,  B24B37/32 ,  B24B41/06

CPC分类号： B24B37/32 ,  B24B37/10 ,  B24B41/067

摘要： A carrier head includes a base assembly, a substrate mounting surface connected to the base assembly, a plurality of segments disposed circumferentially around the substrate mounting surface to provide a collet retaining ring to surround a substrate mounted on the substrate mounting surface, and an outer ring that is vertically movable relative to the plurality of segments. An inner surface of the collet retaining ring is configured to engage a substrate, and the collect retaining ring and outer ring are configured such that vertical motion of the outer ring controls motion of the collet retaining ring between a clamping and unclamping position.

公开(公告)号：US20190193237A1

公开(公告)日：2019-06-27

申请号：US16226441

申请日：2018-12-19

申请人： EBARA CORPORATION

发明人： Yasuyuki MOTOSHIMA

IPC分类号： B24B37/015 ,  B24B37/04 ,  B24B37/10 ,  B24B37/34 ,  B24B55/02

CPC分类号： B24B37/015 ,  B24B37/042 ,  B24B37/10 ,  B24B37/34 ,  B24B55/02

摘要： A pad temperature adjustment apparatus for adjusting the temperature of a polishing pad of a polishing apparatus, including: a heat conduction part for conducting heat between the heat conduction part and the polishing pad; an arm that extends from the heat conduction part, wherein a distal end of the arm is formed in a tapered shape; an arm mount for installing the arm, wherein an arm guide having a tapered groove shape corresponding to the shape of the arm is formed in the arm mount; and a falling prevention member for preventing the arm from falling out of the arm guide.

公开(公告)号：US20190157071A1

公开(公告)日：2019-05-23

申请号：US15964632

申请日：2018-04-27

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chih-I PENG ,  Hsiu-Ming YEH ,  Yi-Chang LIU

IPC分类号： H01L21/02 ,  H01L21/306 ,  H01L21/677 ,  H01L21/67 ,  B24B37/10

CPC分类号： H01L21/02057 ,  B24B37/10 ,  H01L21/02074 ,  H01L21/30625 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67219 ,  H01L21/67259 ,  H01L21/67748

摘要： A method for processing a semiconductor wafer is provided. The method includes transferring the semiconductor wafer from an interface tool to a Chemical Mechanical Polishing (CMP) tool. The method further includes polishing the semiconductor wafer with the CMP tool. The method also includes transferring the semiconductor wafer back to the interface tool from the CMP tool. In addition, the method includes converting a mixture to a mist spray and discharging the mist spray over the semiconductor wafer in the interface tool after the semiconductor wafer is polished by the CMP tool.

公开(公告)号：US09969048B2

公开(公告)日：2018-05-15

申请号：US14808252

申请日：2015-07-24

申请人： EBARA CORPORATION

发明人： Itsuki Kobata ,  Yoichi Kobayashi ,  Katsutoshi Ono ,  Masaki Kinoshita ,  Toshifumi Kimba

IPC分类号： B24B49/12 ,  B24B37/013 ,  B24B37/10 ,  B24B37/26 ,  H01L21/67 ,  H01L21/687 ,  B24B37/04 ,  B24B37/005 ,  H01L21/3105 ,  H01L21/66

CPC分类号： B24B37/26 ,  B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B37/10 ,  B24B49/12 ,  H01L21/31053 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/68721 ,  H01L22/26

摘要： A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

公开(公告)号：US09956663B2

公开(公告)日：2018-05-01

申请号：US15506431

申请日：2015-05-13

申请人： SUMCO CORPORATION

发明人： Kazuaki Kozasa ,  Katsuhisa Sugimori ,  Syunya Kobuchi

IPC分类号： B24B37/24 ,  B24B37/10 ,  H01L21/306

CPC分类号： B24B37/24 ,  B24B37/044 ,  B24B37/10 ,  H01L21/02024 ,  H01L21/30625

摘要： A method of a polishing a wafer includes: a first polishing step of polishing a surface of the wafer while supplying a rough polishing liquid onto a polishing surface of a rough polishing cloth; subsequent to the first polishing step, a protection film formation step of supplying a protection film formation solution containing a water-soluble polymer to the rough polishing cloth after being used in the first polishing step and bringing the protection film formation solution into contact with the polished surface of the wafer to form a protection film on the polished surface; and a second polishing step of polishing the surface of the wafer where the protection film is formed while supplying a finish polishing liquid to a polishing surface of a finish polishing cloth different from the rough polishing cloth.

公开(公告)号：US20180015508A1

公开(公告)日：2018-01-18

申请号：US15647829

申请日：2017-07-12

申请人： EBARA CORPORATION

发明人： Yu ISHII ,  Masayuki NAKANISHI ,  Keisuke UCHIYAMA

IPC分类号： B08B1/04 ,  H01L21/304 ,  H01L21/67 ,  H01L21/687

CPC分类号： B08B1/04 ,  B24B7/228 ,  B24B27/033 ,  B24B37/013 ,  B24B37/042 ,  B24B37/10 ,  B24B37/107 ,  B24B37/30 ,  B24B41/067 ,  B24B49/08 ,  B24D7/06 ,  H01L21/304 ,  H01L21/67051 ,  H01L21/68728 ,  H01L21/6875

摘要： An apparatus which can polish an entirety of a surface of a substrate, such as a wafer, is disclosed. The apparatus includes a substrate holder configured to hold a substrate and rotate the substrate; and a polishing head configured to rub a polishing tool against a first surface of the substrate to polish the first surface. The substrate holder includes a plurality of rollers which can contact a periphery of the substrate. The plurality of rollers are rotatable about their respective own axes.