PAD CONDITIONING DISK WITH COMPRESSIBLE CIRCUMFERENTIAL LAYER

    公开(公告)号:US20250058429A1

    公开(公告)日:2025-02-20

    申请号:US18717610

    申请日:2022-12-19

    Inventor: Matthew C. Fritz

    Abstract: Pad conditioning disks are described. In particular, pad conditioning disks includes discrete abrasive elements and a circumferential compressible layer are described. When uncompressed, the maximum height of the circumferential compressible layer is greater than the maximum height of the discrete abrasive elements, which may provide more even wafer removal rates for in-situ polishing processes.

    CONDITIONING ASSEMBLY AND DRESSING DEVICE THEREOF

    公开(公告)号:US20250050465A1

    公开(公告)日:2025-02-13

    申请号:US18928212

    申请日:2024-10-28

    Abstract: A conditioning assembly and a dressing device thereof are provided. The dressing device includes a metallic porous structural body, a plurality of abrasive particles, and a brazing filler metal. The plurality of abrasive particles are dispersed and embedded onto the metallic porous structural body, and each of the abrasive particles is partially exposed on the metallic porous structural body. The brazing filler metal fills and penetrates into the metallic porous structural body, and the brazing filler metal bonds with the metallic porous structural body and the plurality of abrasive particles. The materials that constitute the metallic porous structural body and the brazing filler metal have at least one common constituent element.

    Cutting apparatus
    3.
    发明授权

    公开(公告)号:US12220782B2

    公开(公告)日:2025-02-11

    申请号:US17647065

    申请日:2022-01-05

    Abstract: A cutting apparatus includes a cutting unit including a spindle as a rotational shaft and a mount flange for mounting a cutting blade thereon, the mount flange being fixed to a distal end of the spindle, a support unit for supporting a cutting blade housed in a blade case, the support unit including a blade case support for supporting the blade case for housing the cutting blade therein, a changing mechanism for dismounting a cutting blade that has been mounted on the mount flange from the mount flange and mounting the cutting blade that has been supported on the support unit on the mount flange, and a moving mechanism for moving the changing mechanism between a changing position, a blade transfer position, and a retracted position.

    Abrasive articles including conformable coatings and polishing system therefrom

    公开(公告)号:US12043785B2

    公开(公告)日:2024-07-23

    申请号:US16629769

    申请日:2018-07-05

    CPC classification number: C09K3/1436 B24B53/12 B24D11/001

    Abstract: The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophobic coating, methods of making and polishing systems therefrom. The present disclosure provides an abrasive layer, having a hydrophobic exterior surface, including at least one of (i) a plurality of individual diamond particles and (ii) a plurality of engineered features having a conformable diamond layer and; a conformable hydrophobic layer in contact with and at least partially coating at least one of the plurality of individual diamond particles and the conformable diamond layer and, wherein the conformable hydrophobic layer includes diamond like glass and forms the hydrophobic exterior surface and the contact angle of the hydrophobic exterior surface is greater than 110 degrees.

    CONDITIONER DISK, CHEMICAL MECHANICAL POLISHING DEVICE, AND METHOD

    公开(公告)号:US20240025014A1

    公开(公告)日:2024-01-25

    申请号:US18362134

    申请日:2023-07-31

    CPC classification number: B24B53/017 B24B53/12

    Abstract: A pad conditioner for conditioning a polishing surface of a polishing pad includes a conditioning disk, a disk holder, and a disk arm. The conditioning disk includes a substrate plate and at least two abrasive segments. The conditioning disk includes at least one channel by which debris and spent slurry may be evacuated. The abrasive segments are on a surface of the substrate plate, and form at least one channel segment therebetween. Each channel segment extends from about the center of the surface to substantially the outer rim of the substrate plate. The disk holder to which the conditioning disk is mounted includes a through hole. The disk arm to which the conditioning disk is mounted includes an opening in fluid communication with the at least one channel segment via the through hole for evacuating the debris and spent slurry by a vacuum module.

    DRESSING BOARD, USE METHOD OF DRESSING BOARD, AND CUTTING APPARATUS

    公开(公告)号:US20230001536A1

    公开(公告)日:2023-01-05

    申请号:US17943747

    申请日:2022-09-13

    Inventor: Kazuma Sekiya

    Abstract: A dressing board having, on a surface, a two-dimensional code including information relating to properties of the dressing board and a barcode including identification information associated with the information relating to the properties is provided. Furthermore, there is provided a cutting apparatus including a determining part that determines whether or not the properties of the dressing board read out from an information registration part based on the identification information match the kind of dressing board suitable for dressing of a cutting blade.

    HYBRID CMP CONDITIONING HEAD
    7.
    发明申请

    公开(公告)号:US20220410344A1

    公开(公告)日:2022-12-29

    申请号:US17778824

    申请日:2020-11-19

    Inventor: David Earl Slutz

    Abstract: In various implementations, a conditioning head may include a substrate and a plurality of protrusions extending from a surface of the substrate. The plurality of protrusions be arranged on the substrate surface in a plurality of sinusoidal wave patterns. For example, the plurality of protrusions may be arranged in an array of offset sinusoidal wave patterns. In some implementations, a conditioning head may include a macro design in which one or more portions include protrusions and one or more portions do not include protrusions.

    POLISHING SYSTEM AND DRESSING DEVICE THEREOF

    公开(公告)号:US20220379433A1

    公开(公告)日:2022-12-01

    申请号:US17824955

    申请日:2022-05-26

    Abstract: Provided is a dressing device for a carrier. The dressing device comprises a dresser, a swing arm, a base and at least one damper. A first end and a second end of the swing arm are coupled to the dresser and the base, respectively, and the at least one damper is disposed inside the swing arm. Any axial vibration of the dresser or the swing arm during dressing for the carrier can be compensated or attenuated by the damper in an active manner properly, so as to make the surface of the carrier flatter and more uniform, which not only improves a removal rate of material and a polishing result of the surface in the subsequent chemical mechanical planarization process, but also prolongs the service life of the carrier. The present disclosure further relates to a polishing system for dressing the carrier by using the said dressing device.

    Dresser
    10.
    发明授权
    Dresser 有权

    公开(公告)号:US10894305B2

    公开(公告)日:2021-01-19

    申请号:US16624982

    申请日:2019-03-27

    Abstract: A dresser includes: a mount component; and a cutting edge component inserted in the mount component at a base end portion side, wherein the portion of the cutting edge component inserted in the mount component has one or more portions in each of which an area of a cross section is increased from the front end portion side toward the base end portion side in the insertion direction, and a ratio L1/M1 of a length L1 and a maximum value M1 is more than or equal to 2.1, where L1 represents a length of the portion of the cutting edge component inserted in the mount component and M1 represents a maximum value of a diameter of a circle having an area equal to the area of the cross section of the portion of the cutting edge component inserted in the mount component.

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