公开(公告)号：US11667007B2

公开(公告)日：2023-06-06

申请号：US16162914

申请日：2018-10-17

Applicant: EBARA CORPORATION

Inventor： Mitsunori Sugiyama ,  Taro Takahashi ,  Yoichi Kobayashi

IPC: B24B37/013 ,  B24B37/12 ,  B24B49/12 ,  B24B57/02 ,  B24B49/08 ,  B24B37/10 ,  B24B37/20 ,  B24B27/00 ,  H01L21/306

CPC classification number: B24B37/013 ,  B24B27/0023 ,  B24B37/105 ,  B24B37/12 ,  B24B37/205 ,  B24B49/08 ,  B24B49/12 ,  B24B57/02 ,  H01L21/30625

Abstract: A polishing table holds a polishing pad. A top ring holds a semiconductor wafer. A swing arm holds the top ring. The swing arm swings around a swing center on the swing arm during polishing. An optical sensor is disposed on the polishing table and measures an optical characteristic changeable in accordance with a variation in film thickness of the semiconductor wafer. A fluid supply control apparatus determines a distance from an axis of rotation to the optical sensor when the semiconductor wafer is rotated by the top ring. An end point detection section detects a polishing end point indicating an end of polishing based on the optical characteristic measured by the optical sensor and the determined distance.

公开(公告)号：US20200298365A1

公开(公告)日：2020-09-24

申请号：US16542631

申请日：2019-08-16

Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

Inventor： Ken Inazumi

IPC: B24B37/07 ,  B24B57/02 ,  B24B29/08 ,  B24B37/005 ,  B24B37/32 ,  B24B37/12 ,  B24B37/20

Abstract: A polishing apparatus according to an embodiment includes a polishing table; a polishing pad provided on the polishing table; a first rotating mechanism configured to rotate the polishing table on a first rotation axis; a substrate holding unit configured to hold a substrate and press the substrate against the polishing pad; a second rotating mechanism configured to rotate the substrate holding unit on a second rotation axis; and a tilting mechanism configured to change an angle between the first rotation axis and the second rotation axis. In the apparatus, the circumferential edge of the substrate is always kept inside the circumferential edge of the polishing pad during polishing of the substrate.

公开(公告)号：US10784113B2

公开(公告)日：2020-09-22

申请号：US15773904

申请日：2016-08-08

Applicant: KCTECH CO., LTD.

Inventor： Kyunam Park

IPC: H01L21/304 ,  H01L21/306 ,  H01L21/67 ,  H01L21/02 ,  C09G1/02 ,  B24B37/12 ,  B24B37/20

Abstract: Provided are a chemical mechanical polishing apparatus and a control method thereof. The chemical mechanical polishing apparatus includes a plurality of polishing platens provided with a polishing pad on an upper surface thereof, and a polishing platen transferring unit for transferring the plurality of polishing platens to different process positions according to a predetermined process sequence. Here, different processes are performed at different process positions.

公开(公告)号：US20050260938A1

公开(公告)日：2005-11-24

申请号：US11192846

申请日：2005-07-28

Applicant: Yuji Okuda ,  Naoyuki Jimbo ,  Kazutaka Majima ,  Masahiro Tsuji ,  Hideki Takagi ,  Shigeharu Ishikawa ,  Hiroyuki Yasuda

Inventor： Yuji Okuda ,  Naoyuki Jimbo ,  Kazutaka Majima ,  Masahiro Tsuji ,  Hideki Takagi ,  Shigeharu Ishikawa ,  Hiroyuki Yasuda

IPC: B24B1/00 ,  B24B37/015 ,  B24B37/12 ,  B24B37/14 ,  B24B37/16 ,  B24B41/047 ,  B24B49/14

CPC classification number: B24B55/02 ,  B24B37/015 ,  B24B37/12 ,  B24B37/14 ,  B24B37/16 ,  B24B41/047

Abstract: A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table includes a plurality of superimposed bases each of which is formed of silicide ceramic or carbide ceramic. The bases are joined together by an adhesive layer. A fluid passage is formed in a joining interface between the bases.

Abstract translation: 一种用于晶片抛光装置的桌子，其具有优异的耐热，抗热冲击和抗磨损特性，并且能够在提高晶片的质量的同时增加半导体晶片的直径。 该表包括多个叠加的基底，每个基底由硅化物陶瓷或碳化物陶瓷形成。 基底通过粘合剂层连接在一起。 在基座之间的接合界面中形成流体通道。

公开(公告)号：US6056631A

公开(公告)日：2000-05-02

申请号：US947600

申请日：1997-10-09

Applicant: Thomas M. Brown ,  Peter Austin Burke

Inventor： Thomas M. Brown ,  Peter Austin Burke

IPC: B24B27/00 ,  B24B37/12 ,  B24B7/22

CPC classification number: B24B37/12 ,  B24B27/0076

Abstract: The present disclosure relates to a chemical mechanical polishing apparatus used for polishing wafers. The apparatus includes a polish platen and structure for separating the platen into at least first and second zones such that polishing fluid used in the first zone is prevented from entering the second zone.

Abstract translation: 本公开涉及用于抛光晶片的化学机械抛光装置。 该设备包括抛光台板和结构，用于将压板分离成至少第一和第二区域，使得防止在第一区域中使用的抛光液进入第二区域。

公开(公告)号：US5851135A

公开(公告)日：1998-12-22

申请号：US907389

申请日：1997-08-07

Applicant: Gurtej S. Sandhu ,  Trung Tri Doan

Inventor： Gurtej S. Sandhu ,  Trung Tri Doan

IPC: B23Q15/013 ,  B23Q15/12 ,  B24B13/015 ,  B24B37/013 ,  B24B37/015 ,  B24B37/10 ,  B24B37/12 ,  B24B37/20 ,  B24B49/00 ,  B24B49/02 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12 ,  B24B49/14 ,  B24B57/02 ,  G05B19/404

CPC classification number: B24B37/107 ,  B23Q15/013 ,  B23Q15/12 ,  B24B13/015 ,  B24B37/013 ,  B24B37/015 ,  B24B37/12 ,  B24B37/205 ,  B24B49/003 ,  B24B49/02 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12 ,  B24B57/02 ,  G05B19/404 ,  G05B2219/34403 ,  G05B2219/37398 ,  G05B2219/37602 ,  G05B2219/45026 ,  G05B2219/45199 ,  G05B2219/45232 ,  G05B2219/49052 ,  G05B2219/49057

Abstract: A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.

公开(公告)号：US5842909A

公开(公告)日：1998-12-01

申请号：US15021

申请日：1998-01-28

Applicant: Gurtej S. Sandhu ,  Trung Tri Doan

Inventor： Gurtej S. Sandhu ,  Trung Tri Doan

IPC: B23Q15/013 ,  B23Q15/12 ,  B24B13/015 ,  B24B37/013 ,  B24B37/015 ,  B24B37/10 ,  B24B37/12 ,  B24B37/20 ,  B24B49/00 ,  B24B49/02 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12 ,  B24B49/14 ,  B24B57/02 ,  G05B19/404 ,  B24B29/00

CPC classification number: B24B37/107 ,  B23Q15/013 ,  B23Q15/12 ,  B24B13/015 ,  B24B37/013 ,  B24B37/015 ,  B24B37/12 ,  B24B37/205 ,  B24B49/003 ,  B24B49/02 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12 ,  B24B57/02 ,  G05B19/404 ,  G05B2219/34403 ,  G05B2219/37398 ,  G05B2219/37602 ,  G05B2219/45026 ,  G05B2219/45199 ,  G05B2219/45232 ,  G05B2219/49052 ,  G05B2219/49057

Abstract: A system for polishing a semiconductor wafer, the system comprising a platen subassembly defining a polishing area; a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and means for heating the wafer while the wafer face is being polished.

Abstract translation: 一种用于抛光半导体晶片的系统，所述系统包括限定抛光区域的压板子组件; 抛光头选择性地支撑半导体晶片并且保持半导体晶片与压板子组件接触的面以抛光晶片表面; 以及用于在晶片表面抛光时加热晶片的装置。

公开(公告)号：US5658183A

公开(公告)日：1997-08-19

申请号：US547944

申请日：1995-10-24

Applicant: Gurtej S. Sandhu ,  Trung Tri Doan

Inventor： Gurtej S. Sandhu ,  Trung Tri Doan

IPC: B23Q15/013 ,  B23Q15/12 ,  B24B13/015 ,  B24B37/013 ,  B24B37/015 ,  B24B37/10 ,  B24B37/12 ,  B24B37/20 ,  B24B49/00 ,  B24B49/02 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12 ,  B24B49/14 ,  B24B57/02 ,  G05B19/404 ,  B24B51/00

CPC classification number: B24B37/107 ,  B23Q15/013 ,  B23Q15/12 ,  B24B13/015 ,  B24B37/013 ,  B24B37/015 ,  B24B37/12 ,  B24B37/205 ,  B24B49/003 ,  B24B49/02 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12 ,  B24B57/02 ,  G05B19/404 ,  G05B2219/34403 ,  G05B2219/37398 ,  G05B2219/37602 ,  G05B2219/45026 ,  G05B2219/45199 ,  G05B2219/45232 ,  G05B2219/49052 ,  G05B2219/49057

Abstract: A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, a slurry supply system delivering a slurry to the polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly; and an optical measurement system measuring film thickness at multiple different locations on the wafer face while the wafer is under a liquid, wherein drying of the wafer is avoided while the measurements are taken.

Abstract translation: 一种用于抛光半导体晶片的系统，所述系统包括用于以抛光速率抛光半导体晶片的表面和抛光均匀性的晶片抛光组件，所述晶片抛光组件包括限定抛光区域的压板子组件，递送 抛光区域的浆料，以及选择性地支撑半导体晶片并保持半导体晶片与压板组件接触的面的研磨头; 以及光学测量系统，当晶片在液体下方时，在晶片表面上的多个不同位置处测量膜厚度，其中在进行测量时避免了晶片的干燥。

公开(公告)号：US5584750A

公开(公告)日：1996-12-17

申请号：US523963

申请日：1995-09-06

Applicant: Masahiro Ishida ,  Shoichi Shin ,  Masafumi Tsunada ,  Yasuhiko Nagakura ,  Toshio Oishi

Inventor： Masahiro Ishida ,  Shoichi Shin ,  Masafumi Tsunada ,  Yasuhiko Nagakura ,  Toshio Oishi

IPC: B24B37/12 ,  H01L21/304 ,  B24B29/00

CPC classification number: B24B37/14

Abstract: The present invention uses a surface plate 8 made of carbon fiber reinforced plastics which is installed on a turntable 4, and an emery cloth 6 is adhered on the surface of the surface plate 8. This surface plate 8 is detachably installed on the turntable 4 by means of key blocks 22 or screws 26. If the turntable 4 is made of carbon fiber reinforced plastics, the entire weight of a polishing machine can be reduced.

Abstract translation: 本发明使用安装在转台4上的由碳纤维增强塑料制成的表面板8，并且在表面板8的表面上粘附有砂布6.该表面板8可拆卸地安装在转盘4上 钥匙块22或螺钉26的装置。如果转盘4由碳纤维增强塑料制成，则能减少抛光机的整体重量。

公开(公告)号：US5022191A

公开(公告)日：1991-06-11

申请号：US434846

申请日：1989-11-13

Applicant: Georges H. G. Broido

Inventor： Georges H. G. Broido

IPC: B24B37/12 ,  B24D7/06 ,  B24D7/14 ,  B24D7/18

CPC classification number: B24B37/12 ,  B24D7/063 ,  Y10S451/905

Abstract: A polishing plate wherein the arcs cut in the soft parts by a circle whose radius is equal to approximately half that of the disk and whose center is at a distance from that of the disk equal to half the radius of the disk have a length between 0.5 and 5 mm.

Abstract translation: 一种抛光板，其中弧形部分切割成半径等于圆盘半径的一半的圆，其中心距盘的距离等于圆盘半径的一半的长度为0.5 和5mm。