公开(公告)号：US20180169820A1

公开(公告)日：2018-06-21

申请号：US15839191

申请日：2017-12-12

申请人： EBARA CORPORATION

发明人： Masayuki NAKANISHI ,  Kenji KODERA ,  Yasuyuki MIYASAWA

IPC分类号： B24B9/06 ,  B24B21/00 ,  H01L21/02 ,  B24B37/07

CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B21/08 ,  B24B31/12 ,  B24B37/07 ,  H01L21/02021

摘要： A polishing apparatus which can keep a width of a polishing tool constant when a peripheral portion of a substrate is polished by the polishing tool is disclosed. The polishing apparatus includes a substrate holder 3 configured to hold a substrate W and to rotate the substrate W and a pressing pad 50 configured to press a polishing tool 23 against a peripheral portion of the substrate W held by the substrate holder 3. The pressing pad 50 includes an elastic member 55 having a pressing surface 55a configured to press the polishing tool 23 against the peripheral portion of the substrate W and a support member 56 configured to support the elastic member 55. The support member 56 has a recess 57 formed in a front surface 56a of the support member 56, the elastic member 55 being capable of entering the recess 57.

公开(公告)号：US20180076043A1

公开(公告)日：2018-03-15

申请号：US15701206

申请日：2017-09-11

申请人： EBARA CORPORATION

发明人： Kenya ITO ,  Masaya SEKI ,  Kenichi KOBAYASHI ,  Michiyoshi YAMASHITA

IPC分类号： H01L21/304 ,  B23K26/08

CPC分类号： H01L21/3043 ,  B23K26/0823 ,  B23K2101/40 ,  B24B9/065 ,  B24B21/002 ,  B24B21/004 ,  B24B21/08 ,  B24B37/00 ,  H01L21/02021 ,  H01L21/304 ,  H01L21/67138

摘要： A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.

公开(公告)号：US20170165805A1

公开(公告)日：2017-06-15

申请号：US15321438

申请日：2015-07-08

申请人： E.M.C. S.r.l.

发明人： Alberto STAGNI

IPC分类号： B24B21/08 ,  B24B27/00

CPC分类号： B24B21/08 ,  B24B27/0015 ,  B24B27/0069 ,  B24B27/0084

摘要： A sanding machine for sanding panels, including a supporting structure, a sanding unit supported by the supporting structure, a surface for supporting and sliding of the panels located beneath the sanding unit and along which the panels are fed in a predetermined feed direction; the sanding unit including a trestle supporting a sanding belt, the trestle including a plurality of rollers having respective axes parallel to the supporting surface, the sanding belt being endless and looped around the rollers, one of the rollers being motorized to move the sanding belt during the sanding of the panels, the sanding unit further including at least one opposing member to force the belt against the panel to be sanded.

公开(公告)号：US20150298281A1

公开(公告)日：2015-10-22

申请号：US14753677

申请日：2015-06-29

申请人： SIA ABRASIVES INDUSTRIES AG

发明人： Sepp BREITENMOSER

IPC分类号： B24B21/08

CPC分类号： B24B21/08

摘要： The present invention relates to lining carrier for a sanding pad lining, in particular for use with a sanding pad for pressing sanding surfaces against workplaces in segment-belt and wide-belt sanding machines. Here, the lining carrier has at least one recess, in particular a groove.

摘要翻译： 本发明涉及一种用于磨砂衬垫的衬里载体，特别是与用于将磨粒表面压紧在分段带和宽带砂光机中的工作场所的砂磨垫一起使用。 这里，衬里载体具有至少一个凹部，特别是凹槽。

公开(公告)号：US20130078894A1

公开(公告)日：2013-03-28

申请号：US13484635

申请日：2012-05-31

申请人： XIAN-CAI ZENG ,  DONG-CHENG LIU ,  CHIN-TSAN HUANG

发明人： XIAN-CAI ZENG ,  DONG-CHENG LIU ,  CHIN-TSAN HUANG

IPC分类号： B24B47/00 ,  B24B21/00

CPC分类号： B24B21/00 ,  B24B21/08 ,  B24B21/20 ,  B24B47/12

摘要： A polishing device includes a reducer, a polishing mechanism, a rotatably driven mechanism, and a sliding driving mechanism. The polishing mechanism is connected to the reducer. The rotatably driven mechanism includes a first driving member and a transmission shaft, the first driving member includes a first main body and an output shaft rotatably connected to first main body, the transmission shaft is fixed to the output shaft. Sliding driving mechanism includes a second driving member, the second driving member includes a second main body and a driving shaft collar connected to the second main body, the second main body is fixed to the first main body. The second main body and driving shaft collar cooperatively define a through hole. The transmission shaft extends through the through hole and is connected to the reducer to enable the polishing mechanism to polish a workpiece. The driving shaft is fixed to the reducer.

摘要翻译： 抛光装置包括减速器，抛光机构，可旋转驱动的机构和滑动驱动机构。 抛光机构与减速机连接。 可旋转驱动的机构包括第一驱动构件和传动轴，第一驱动构件包括可旋转地连接到第一主体的第一主体和输出轴，传动轴固定到输出轴。 滑动驱动机构包括第二驱动构件，第二驱动构件包括第二主体和连接到第二主体的驱动轴环，第二主体固定到第一主体。 第二主体和驱动轴套协调地限定通孔。 传动轴延伸穿过通孔并连接到减速器，以使抛光机构能够抛光工件。 驱动轴固定在减速机上。

公开(公告)号：US20110287698A1

公开(公告)日：2011-11-24

申请号：US12782023

申请日：2010-05-18

申请人： Thomas E. Karis ,  Ricardo Ruiz

发明人： Thomas E. Karis ,  Ricardo Ruiz

IPC分类号： B24B21/18 ,  B32B5/16 ,  B32B5/00 ,  B32B27/32 ,  B32B27/08

CPC分类号： B24B21/08 ,  B24B21/004 ,  B24B37/14 ,  Y10T428/254 ,  Y10T428/269 ,  Y10T428/31913 ,  Y10T428/31924 ,  Y10T428/31938

摘要： A pad for polishing media disks has an elastomeric body with a Shore A hardness of not greater than 20, and a coating of polystyrene (PS) and a flexible polymer. The elastomeric pad may comprise styrene-isoprene-styrene block copolymers, or a styrene-ethylene-butylene-styrene block copolymer. The pad may be viscoleastic with a particulate composite coating. The pad may be a styrenic block copolymer and the coating is a different type of styrenic block copolymer containing solid particles. The coating may have a binder with a mixture of PS and flexible styrenic block copolymers, and filler particles comprising cross-linked PS/divinylbenzene polymer microspheres.

摘要翻译： 用于抛光介质盘的垫具有肖氏A硬度不大于20的弹性体，以及聚苯乙烯（PS）和柔性聚合物的涂层。 弹性垫可包括苯乙烯 - 异戊二烯 - 苯乙烯嵌段共聚物，或苯乙烯 - 乙烯 - 丁烯 - 苯乙烯嵌段共聚物。 垫可以是具有颗粒状复合涂层的粘弹性。 垫可以是苯乙烯嵌段共聚物，涂层是含有固体颗粒的不同类型的苯乙烯嵌段共聚物。 涂层可以具有PS和柔性苯乙烯嵌段共聚物的混合物的粘合剂，以及包含交联的PS /二乙烯基苯聚合物微球的填料颗粒。

公开(公告)号：US20090227189A1

公开(公告)日：2009-09-10

申请号：US12379983

申请日：2009-03-05

申请人： Kazuaki Maeda ,  Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa

发明人： Kazuaki Maeda ,  Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B9/02 ,  B24B21/00

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/06 ,  B24B21/08 ,  B24B37/04 ,  B24B41/06

摘要： A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

摘要翻译： 抛光装置通过使抛光工具与基板滑动接触来抛光基板的周边。 抛光装置包括：基板保持机构，其构造成保持基板并使基板旋转;抛光机构，其构造成将抛光工具抵靠基板的周边按压以周边抛光;以及周边支撑机构，其构造成支撑 通过流体的衬底的周边。 周边支撑机构构造成从基板的周边的相对侧或同一侧支撑基板的表面。

公开(公告)号：US06607425B1

公开(公告)日：2003-08-19

申请号：US09747845

申请日：2000-12-21

申请人： Rod Kistler ,  John Boyd ,  Alek Owczarz

发明人： Rod Kistler ,  John Boyd ,  Alek Owczarz

IPC分类号： B24B100

CPC分类号： B24B37/16 ,  B24B21/08 ,  B24B37/30

摘要： An invention is disclosed for improved performance in a CMP process using a pressurized membrane as a replacement for a platen air bearing. In one embodiment, a platen for improving performance in CMP applications is disclosed. The platen includes a membrane disposed above the platen, and a plurality of annular bladders disposed below the membrane, wherein the annular bladders are capable of exerting force on the membrane. In this manner, zonal control is provided during the CMP process.

摘要翻译： 公开了一种用于在使用加压膜作为压板空气轴承的替代物的CMP工艺中改善性能的发明。 在一个实施例中，公开了一种用于提高CMP应用中的性能的压板。 压板包括设置在压板上方的膜和设置在膜下方的多个环形气囊，其中环形气囊能够在膜上施加力。 以这种方式，在CMP过程中提供了区域控制。

公开(公告)号：US20030096561A1

公开(公告)日：2003-05-22

申请号：US10295197

申请日：2002-11-15

发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalai Ashjaee ,  Douglas Young

IPC分类号： B24B001/00 ,  B24C001/00

CPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

公开(公告)号：US06325706B1

公开(公告)日：2001-12-04

申请号：US09182570

申请日：1998-10-29

申请人： Wilbur C. Krusell ,  Andrew J. Nagengast ,  Anil K. Pant

发明人： Wilbur C. Krusell ,  Andrew J. Nagengast ,  Anil K. Pant

IPC分类号： B24B2100

CPC分类号： B24B37/013 ,  B24B21/08 ,  B24B49/16 ,  G01N1/32 ,  H01L21/3212 ,  H01L21/76807

摘要： A technique for utilizing a sensor to monitor fluid pressure from a fluid bearing located under a polishing pad to detect a polishing end point. A sensor is located at the leading edge of a fluid bearing of a linear polisher, which is utilized to perform chemical-mechanical polishing on a semiconductor wafer. The sensor monitors the fluid pressure to detect a change in the fluid pressure during polishing, which change corresponds to a change in the shear force when the polishing transitions from one material layer to the next. In order to ensure that there is a noticeable difference in the shear force variation at the polishing end point, a slurry having a particular pH level is selected. The pH level ensures that the zeta potential changes noticeably from one material to the next, so as to induce a change in the shear force, which is detected by a change in the fluid pressure.

摘要翻译： 一种利用传感器来监测来自位于抛光垫下方的流体轴承的流体压力以检测抛光终点的技术。 传感器位于线性抛光机的流体轴承的前缘，用于在半导体晶片上执行化学机械抛光。 传感器监测流体压力以检测抛光期间的流体压力的变化，该变化对应于当抛光从一个材料层转移到下一个材料层时的剪切力的变化。 为了确保在抛光终点处的剪切力变化存在显着的差异，选择具有特定pH值的浆料。 pH值确保ζ电位从一种材料明显变化到另一种材料，从而引起由流体压力变化所检测的剪切力的变化。