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1.发明授权Use of zeta potential during chemical mechanical polishing for end point detection 失效化学机械抛光期间使用ζ电位进行终点检测公开(公告)号：US06325706B1
公开(公告)日：2001-12-04
申请号：US09182570
申请日：1998-10-29
IPC分类号： B24B2100
CPC分类号： B24B37/013 , B24B21/08 , B24B49/16 , G01N1/32 , H01L21/3212 , H01L21/76807
摘要： A technique for utilizing a sensor to monitor fluid pressure from a fluid bearing located under a polishing pad to detect a polishing end point. A sensor is located at the leading edge of a fluid bearing of a linear polisher, which is utilized to perform chemical-mechanical polishing on a semiconductor wafer. The sensor monitors the fluid pressure to detect a change in the fluid pressure during polishing, which change corresponds to a change in the shear force when the polishing transitions from one material layer to the next. In order to ensure that there is a noticeable difference in the shear force variation at the polishing end point, a slurry having a particular pH level is selected. The pH level ensures that the zeta potential changes noticeably from one material to the next, so as to induce a change in the shear force, which is detected by a change in the fluid pressure.
摘要翻译： 一种利用传感器来监测来自位于抛光垫下方的流体轴承的流体压力以检测抛光终点的技术。 传感器位于线性抛光机的流体轴承的前缘，用于在半导体晶片上执行化学机械抛光。 传感器监测流体压力以检测抛光期间的流体压力的变化，该变化对应于当抛光从一个材料层转移到下一个材料层时的剪切力的变化。 为了确保在抛光终点处的剪切力变化存在显着的差异，选择具有特定pH值的浆料。 pH值确保ζ电位从一种材料明显变化到另一种材料，从而引起由流体压力变化所检测的剪切力的变化。
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2.发明授权Apparatus and method for performing end point detection on a linear planarization tool 失效在线性平面化工具上进行端点检测的装置和方法公开(公告)号：US06186865B1
公开(公告)日：2001-02-13
申请号：US09182532
申请日：1998-10-29
IPC分类号： B24B722
CPC分类号： B24B37/013 , B24B21/08 , B24B49/16
摘要： A technique for utilizing a sensor to monitor fluid pressure from a fluid bearing located under a polishing pad to detect a polishing end point. A sensor is located at the leading edge of a fluid bearing of a linear polisher, which is utilized to perform chemical-mechanical polishing on a semiconductor wafer. The sensor monitors the fluid pressure to detect a change in the fluid pressure during polishing, which change corresponds to a change in the shear force when the polishing transitions from one material layer to the next.
摘要翻译： 一种利用传感器来监测来自位于抛光垫下方的流体轴承的流体压力以检测抛光终点的技术。 传感器位于线性抛光机的流体轴承的前缘，用于在半导体晶片上执行化学机械抛光。 传感器监测流体压力以检测抛光期间流体压力的变化，该变化对应于当抛光从一个材料层转移到下一个材料层时的剪切力的变化。
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公开(公告)号：US20130157549A1
公开(公告)日：2013-06-20
申请号：US13768314
申请日：2013-02-15
IPC分类号： B24B37/32
摘要： A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain molecule produced from poly-paraphenylene terephthalamide.
摘要翻译： 一种用于化学机械抛光的载体头，其具有基部，连接到基部的安装组件具有用于接触基底的表面和固定到基部的保持环。 保持环可以包括全氟烷氧基，聚醚酮酮，聚苯并咪唑，半结晶热塑性聚酯或由聚对苯二甲酰对苯二胺生产的长分子链分子。
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公开(公告)号：US08021215B2
公开(公告)日：2011-09-20
申请号：US12698009
申请日：2010-02-01
IPC分类号： B24B41/06
摘要： A carrier head that has a housing, a base assembly, a retaining ring, a carrier ring, and a flexible membrane is described. The base assembly is vertically movable relative to the housing. The retaining ring is connected to and vertically movable relative to the base assembly and has a lower surface configured to contact a polishing pad and an inner surface configured to circumferentially surround the edge of a substrate to retain the substrate. The carrier ring is connected to and vertically fixed relative to the base assembly, circumferentially surrounds the retaining ring to prevent lateral motion of the retaining ring, and has a bottom surface configured to contact a polishing pad.
摘要翻译： 描述了具有壳体，基座组件，保持环，载体环和柔性膜的承载头。 基座组件相对于外壳可垂直移动。 保持环相对于基座组件连接并且可垂直移动，并且具有被配置为接触抛光垫的下表面和被配置为周向围绕衬底的边缘以保持衬底的内表面。 承载环相对于基座组件连接并且垂直固定，周向地包围保持环以防止保持环的横向运动，并且具有构造成接触抛光垫的底表面。
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公开(公告)号：US20110143521A1
公开(公告)日：2011-06-16
申请号：US12636490
申请日：2009-12-11
申请人： Steven M. Zuniga , Derek G. Aqui , Andrew J. Nagengast , Keenan Leon Guerrero , Harish K. Bolla , Aditya Agarwal
发明人： Steven M. Zuniga , Derek G. Aqui , Andrew J. Nagengast , Keenan Leon Guerrero , Harish K. Bolla , Aditya Agarwal
IPC分类号： H01L21/30 , H01L21/677
CPC分类号： H01L21/68728 , H01L21/67766 , H01L21/67781
摘要： A system for simultaneously treating multiple workpieces is configured with treatment sites, configured to hold respective workpieces, fixed on a rotatable base. Treatment stations are equipped with respective active components operable simultaneously to treat respective workpieces identically on respective aligned treatment sites. For loading and unloading the treatment sites are rotated through distinct loading and unloading stations of the treatment stations which allow loading of a second batch while a first batch is being unloaded.
摘要翻译： 用于同时处理多个工件的系统被配置有处理部位，其被配置为保持固定在可旋转底座上的各个工件。 处理站配备有可同时操作的相应活动部件，以在相应的对准的处理部位上相同地处理相应的工件。 对于装载和卸载，处理站点通过处理站的不同装载和卸载站进行旋转，允许在第一批卸载时加载第二批料。
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公开(公告)号：US07901273B2
公开(公告)日：2011-03-08
申请号：US12698912
申请日：2010-02-02
IPC分类号： B24B21/18
CPC分类号： B24B37/32
摘要： A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. A carrier ring has an annular upper portion and an annular lower portion having a lower surface with a smaller inner diameter than the upper surface of the annular upper portion, wherein the carrier ring circumferentially surrounds a retaining ring and has a lower surface to contact a polishing pad.
摘要翻译： 描述了具有基座组件，保持环组件，载体环和柔性膜的承载头。 承载环具有环形上部和环形下部，其具有比环形上部的上表面更小的内径的下表面，其中承载环周向地包围保持环并且具有接触抛光的下表面 垫。
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公开(公告)号：US08454413B2
公开(公告)日：2013-06-04
申请号：US11614940
申请日：2006-12-21
申请人： Jeonghoon Oh , Tsz-Sin Siu , Hung Chih Chen , Andrew J. Nagengast , Steven M. Zuniga , Thomas B. Brezoczky
发明人： Jeonghoon Oh , Tsz-Sin Siu , Hung Chih Chen , Andrew J. Nagengast , Steven M. Zuniga , Thomas B. Brezoczky
IPC分类号： B24B41/06
CPC分类号： B24B37/30 , B24B41/06 , B29C33/424 , B29C35/02 , B29K2023/00 , B29K2083/00 , B29K2995/0074 , B29L2031/755
摘要： A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.
摘要翻译： 用于载体头部的柔性膜具有大致圆形的主要部分，具有下表面，用于连接到基座组件的环形外部部分和从主体部分在与下表面相对的一侧延伸的环形挡片，用于连接到 基座组件。 翼片的至少一个表面具有表面纹理以防止粘附。
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公开(公告)号：US07727055B2
公开(公告)日：2010-06-01
申请号：US11741692
申请日：2007-04-27
IPC分类号： B24B5/35
CPC分类号： B24B37/30 , Y10T428/24174 , Y10T428/24182
摘要： A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. The flexible membrane has a main portion and an outer annular portion, wherein a junction between the main portion and the outer annular portion comprises a peripheral edge hinge and an annular recess above the hinge along the outer wall of the outer annular portion.
摘要翻译： 描述了具有基座组件，保持环组件，载体环和柔性膜的承载头。 柔性膜具有主要部分和外部环形部分，其中主要部分和外部环形部分之间的接合处包括周边边缘铰链和沿着外部环形部分的外壁的铰链上方的环形凹部。
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公开(公告)号：US20200276686A1
公开(公告)日：2020-09-03
申请号：US16799688
申请日：2020-02-24
IPC分类号： B24B37/32
摘要： A carrier head for chemical mechanical polishing includes a base, an actuator, a substrate mounting surface, and a retainer. The retainer includes an inner section and an outer section connected by a flexure. A bottom of the inner section of the retainer provides an inner portion of a lower surface configured to contact a polishing pad. An inner surface of the inner section extends upwardly from an inner edge of the lower surface to circumferentially surround the substrate mounting surface. The inner section of the retainer is positioned to receive a controllable load from the actuator and is vertically movable relative to the base. A bottom of the outer section of the retainer provides an outer portion of the lower surface. The outer section of the retainer is vertically fixed to the base. The inner section of the retainer is vertically movable relative to the outer section of the retainer.
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公开(公告)号：US20180021918A1
公开(公告)日：2018-01-25
申请号：US15658294
申请日：2017-07-24
申请人： Andrew J. Nagengast , Christopher Heung-Gyun Lee , Thomas Li , Anand N. Iyer , Jie Diao , Huanbo Zhang , Erik S. Rondum , Wei-Cheng Lee , Jeonghoon Oh
发明人： Andrew J. Nagengast , Christopher Heung-Gyun Lee , Thomas Li , Anand N. Iyer , Jie Diao , Huanbo Zhang , Erik S. Rondum , Wei-Cheng Lee , Jeonghoon Oh
IPC分类号： B24B37/32 , H01L21/67 , H01L21/687 , H01L21/306
CPC分类号： B24B37/32 , H01L21/30625 , H01L21/67063 , H01L21/67092 , H01L21/68735
摘要： A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.
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