Abstract:
A lawn chemical application system is disclosed. The system comprises a dispenser having a lower chamber, an upper chamber, an upstream opening, and a downstream opening. The dispenser may be formed by a tee connector and a cylinder secured to an upper opening of the tee connector. Powered valves are operably connected to the upstream and downstream openings of the dispenser. The powered valves may be wired to open and close simultaneously. A lower portion of the upper chamber may be disposed below an upper portion of the lower chamber and above a lower portion of the lower chamber, leaving the lower portion of the lower chamber unobstructed over substantially its entire length. The lower portion of the upper chamber may have a plurality of openings to provide for adequate mixing of water with the chemicals stored in the upper chamber. In operation, soluble matter or other chemicals are placed in the upper chamber of the dispenser, and the two valves are opened simultaneously. Water flows through the first powered valve and into the dispenser, where the water is mixed with soluble matter or other chemicals stored in the upper chamber of the tee. The solution or mixture then passes from the dispenser, through the second powered valve, to one or more sprinkler heads of the irrigation system. When the application is finished, the valves are closed simultaneously.
Abstract:
A lawn chemical application system is disclosed. The system comprises a dispenser having a lower chamber, an upper chamber, an upstream opening, and a downstream opening. The dispenser may be formed by a tee connector and a cylinder secured to an upper opening of the tee connector. Powered valves are operably connected to the upstream and downstream openings of the dispenser. The powered valves may be wired to open and close simultaneously. A lower portion of the upper chamber may be disposed below an upper portion of the lower chamber and above a lower portion of the lower chamber, leaving the lower portion of the lower chamber unobstructed over substantially its entire length. The lower portion of the upper chamber may have a plurality of openings to provide for adequate mixing of water with the chemicals stored in the upper chamber. In operation, soluble matter or other chemicals are placed in the upper chamber of the dispenser, and the two valves are opened simultaneously. Water flows through the first powered valve and into the dispenser, where the water is mixed with soluble matter or other chemicals stored in the upper chamber of the tee. The solution or mixture then passes from the dispenser, through the second powered valve, to one or more sprinkler heads of the irrigation system. When the application is finished, the valves are closed simultaneously.
Abstract:
This application discloses a hard disk drive and a disk employing Discrete Tracks each including a land with a groove at a first depth with sectors of each track separated by servo pattern wedges with a variable second land and a variable second groove possessing widths and a second depth for the grooves differing from the first widths and depth of the groove of the sectors. The second depth optimizes the stability of the flying height of a slider over both sectors and servo pattern wedges, removing the possibility of added vibrational modes adversely affecting the slider's normal operations of reading, writing and flying above the disk surface. This also discloses the disks and their manufacture of disk surfaces with these sector zones and servo pattern wedges.
Abstract:
A method for performing and an apparatus to perform chemical mechanical polishing on a semiconductor wafer are disclosed. The apparatus includes a wafer holder, a polishing member, and a movable table. The movable table is in contact with and is supporting the polishing member. The polishing member includes a polishing pad, a backing layer, and a stiffening layer positioned between the backing layer and the polishing pad. The polishing pad has a polishing surface that is oriented to receive a semiconductor wafer held by the wafer holder. The polishing surface is configured to chemically mechanically polish the semiconductor wafer. The method includes holding a semiconductor wafer, moving a polishing member, and bringing a surface of the semiconductor wafer into contact with the polishing member. The polishing member includes a polishing pad, a backing layer, and a stiffening layer positioned between the polishing pad and the backing layer.
Abstract:
A technique for utilizing a sensor to monitor fluid pressure from a fluid bearing located under a polishing pad to detect a polishing end point. A sensor is located at the leading edge of a fluid bearing of a linear polisher, which is utilized to perform chemical-mechanical polishing on a semiconductor wafer. The sensor monitors the fluid pressure to detect a change in the fluid pressure during polishing, which change corresponds to a change in the shear force when the polishing transitions from one material layer to the next.
Abstract:
This application discloses a hard disk drive and a control circuit that are configured to determine touchdown by determining the SAGC for a track, removing the repeatable component of the SAGC to create the non-repeatable component and determining an indication of clearance irregularity and/or touch down when the standard deviation of the non-repeatable component spikes. These operations may create a defect map and/or a Flying height On Demand (FOD) control table in or for the hard disk drive as products of operating the hard disk drive.
Abstract:
This application discloses a hard disk drive, a head stack assembly, a head gimbal assembly, each including a slider with a deposited end including at least one means for retaining lubricant that tends to accumulate on the deposited end.
Abstract:
A method for maintaining a servo signal. The method includes monitoring a shock event value. The shock event value is generated by a shock sensor. The shock sensor is operably coupled with a disk drive. The disk drive is configured with an actuator arm having a suspension and slider coupled thereto. The method further includes detecting a variation in the shock event value associated with the slider. The method also includes switching from a conductive link to the slider to another conductive link to another slider, the another slider is coupled with another actuator arm in the disk drive.
Abstract:
A bearing system having variably grooved radial and thrust bearing with reduced groove angle near bearing entry is described. In an embodiment, the bearing system includes a housing. The bearing system also includes a shaft centrally located in the housing. The bearing system additionally includes a rotor portion that is adapted to be rotated about the shaft and contained within the housing. The bearing further includes a variably angled groove disposed on an internal surface of the bearing system. The variably angled groove reduces ingestion of air in the bearing system during operation of the bearing system.