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公开(公告)号：US12119278B2
公开(公告)日：2024-10-15
申请号：US18219941
申请日：2023-07-10
Applicant: Nippon Electric Glass Co., Ltd.
Inventor： Hiroki Katayama
IPC: H01L23/15 , B24B37/07 , B32B17/06 , C03C3/091 , C03C3/093 , C03C19/00 , H01L21/56 , H01L23/00 , H01L23/12
CPC classification number: H01L23/15 , B24B37/07 , B32B17/06 , C03C3/091 , C03C3/093 , C03C19/00 , H01L21/56 , H01L21/561 , H01L21/568 , H01L23/12 , H01L24/19 , H01L24/96 , B32B2307/538 , B32B2457/14 , H01L2224/04105 , H01L2224/12105 , H01L2924/3511
Abstract: Devised are a supporting substrate capable of contributing to an increase in density of a semiconductor package and a laminate using the supporting substrate. A supporting glass substrate of the present invention includes a polished surface on a surface thereof and has a total thickness variation of less than 2.0 μm.
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公开(公告)号：US12090601B2
公开(公告)日：2024-09-17
申请号：US17711239
申请日：2022-04-01
Applicant: Samsung Display Co., Ltd.
Inventor： Junggun Nam , Seungik Kang , Seungbae Kang , Pungseok Kim , Heesung Yang , Keunwoo Lee , Woojin Cho , Byoungkwon Choo
CPC classification number: B24B37/07 , B32B38/0012 , B24B37/20 , B32B2038/0064 , B32B2457/20
Abstract: An apparatus for manufacturing a display device includes a moving part including a belt that circulates, a roller that circulates the belt, and at least one meandering prevention portion that moves in a first direction parallel to a direction of a rotation shaft of the roller and prevents meandering of the belt, and a polishing head disposed corresponding to the moving part, the polishing head polishing a surface of a base material disposed on a first surface of the belt. A part of the at least one meandering prevention portion faces a second surface of the belt, the second surface being a side surface of the belt.
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公开(公告)号：US11931855B2
公开(公告)日：2024-03-19
申请号：US16885753
申请日：2020-05-28
Applicant: Applied Materials, Inc.
Inventor： Han-Wen Chen , Steven Verhaverbeke , Tapash Chakraborty , Prayudi Lianto , Prerna Sonthalia Goradia , Giback Park , Chintan Buch , Pin Gian Gan , Alex Hung
CPC classification number: B24B37/042 , B24B21/04 , B24B37/14 , B24B37/07
Abstract: Embodiments of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates. More specifically, embodiments of the present disclosure relate to planarization of surfaces on substrates for advanced packaging applications, such as surfaces of polymeric material layers. In one implementation, the method includes mechanically grinding a substrate surface against a polishing surface in the presence of a grinding slurry during a first polishing process to remove a portion of a material formed on the substrate; and then chemically mechanically polishing the substrate surface against the polishing surface in the presence of a polishing slurry during a second polishing process to reduce any roughness or unevenness caused by the first polishing process.
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公开(公告)号：US09757839B2
公开(公告)日：2017-09-12
申请号：US15386647
申请日：2016-12-21
Applicant: SUNSEA TELECOMMUNICATIONS CO., LTD.
Inventor： Qiyue Wang , Xinjun Chen , Qingqing Hu
CPC classification number: B24B37/07 , B24B19/226 , B24B37/30 , B24B37/34
Abstract: A grinder for grinding an end face of a fiber includes a housing, a fiber fixing module, a base, a transmission shaft, and a grinding pad. The housing includes an annular rack wheel with an internal engaging teeth. The fiber fixing module is positioned on a top of the housing. The base is positioned at a bottom of the housing and includes an eccentric connection portion. An end of the transmission shaft is connected to the connection portion. The transmission shaft is sleeved with an annular pinion having external engaging teeth engaging with the internal engaging teeth. The grinding pad is connected to another end of the transmission shaft and revolves around the rotation axis of the base and rotates around its own rotation axis together with the transmission shaft and matches an end face of a to-be-ground fiber penetrating the fiber fixing module.
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公开(公告)号：US09403255B2
公开(公告)日：2016-08-02
申请号：US13905763
申请日：2013-05-30
Applicant: Ebara Corporation
Inventor： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki
CPC classification number: B24B37/005 , B24B7/228 , B24B37/042 , B24B37/07 , B24B37/32 , B24B49/16
Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder.
Abstract translation: 抛光装置通过使基板与抛光表面滑动接触来抛光基板。 抛光装置包括：基板保持器，其具有被配置为将基板压靠在抛光表面上的基板保持表面;保持环，其联接到基板保持表面并且构造成围绕基板，其中保持环与抛光接触 所述保持环被构造成可以独立于所述基板保持表面倾斜; 旋转机构，其构造成使所述衬底保持器围绕其自身的轴线旋转; 以及至少一个局部负载施加机构，其被构造成沿与所述抛光表面垂直的方向在所述保持环的一部分上施加局部负载，所述至少一个局部负载施加机构被布置成不依照所述衬底移动 持有人
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公开(公告)号：US20240139906A1
公开(公告)日：2024-05-02
申请号：US18494632
申请日：2023-10-25
Applicant: Applied Materials, Inc.
Inventor： Jeonghoon Oh , Steven M. Zuniga , Christopher Heung-Gyun Lee , Ekaterina A. Mikhaylichenko , Ghunbong Cheung , Huanbo Zhang , Jay Gurusamy , David J. Lischka
Abstract: A controller of a chemical mechanical polishing system is configured to cause a carrier head to sweep across a polishing pad in accord with a sweep profile. The controller is also configured to select values for a plurality of control parameters to minimize a difference between a target removal profile and an expected removal profile. The plurality of control parameters include a plurality of dwell time parameters. A relationship between the plurality of control parameters and a removal rate is stored in a data structure representing a first matrix which includes a plurality of columns including a column for each dwell time parameter and a row for each position on the substrate represented in the expected removal profile, and the controller is configured to, as part of selection of the values, calculate the expected removal profile by multiplying the first matrix by a second matrix representing control parameter values.
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公开(公告)号：US11749574B2
公开(公告)日：2023-09-05
申请号：US17388521
申请日：2021-07-29
Applicant: Nippon Electric Glass Co., Ltd.
Inventor： Hiroki Katayama
IPC: H01L23/15 , H01L23/00 , H01L23/12 , H01L21/56 , C03C3/093 , C03C3/091 , B32B17/06 , C03C19/00 , B24B37/07
CPC classification number: H01L23/15 , B24B37/07 , B32B17/06 , C03C3/091 , C03C3/093 , C03C19/00 , H01L21/56 , H01L21/561 , H01L21/568 , H01L23/12 , H01L24/19 , H01L24/96 , B32B2307/538 , B32B2457/14 , H01L2224/04105 , H01L2224/12105 , H01L2924/3511
Abstract: Devised are a supporting substrate capable of contributing to an increase in density of a semiconductor package and a laminate using the supporting substrate. A supporting glass substrate of the present invention includes a polished surface on a surface thereof and has a total thickness variation of less than 2.0 μm.
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公开(公告)号：US20180277380A1
公开(公告)日：2018-09-27
申请号：US15751699
申请日：2017-03-10
Applicant: TOHO ENGINEERING CO., LTD.
Inventor： Tatsutoshi SUZUKI , Eisuke SUZUKI , Daisuke SUZUKI
IPC: H01L21/306 , B24B37/07 , B24B1/04 , B24B37/34 , H01L21/321
CPC classification number: H01L21/30625 , B24B1/00 , B24B1/04 , B24B37/07 , B24B37/34 , B24B41/007 , H01L21/306 , H01L21/32115
Abstract: A planarization processing device for polishing a substrate, e.g., a semiconductor wafer, includes two planarization processing sections (SP1, SP2) that each include a holder (62) for holding a workpiece (W), a drive motor (71) that rotates the holder (62), a support plate (4) holds a pad (5), a linear guide (3) that guides reciprocal movement of the support plate (4) in a direction parallel to the surface of the pad (5), and a drive cylinder (72) that advances the holder (62) or the support plate (4) in a direction that intersects the surface of the workpiece W or the pad (5) to cause the opposing surfaces of the workpiece and the pad (5) to be at least proximal to each other. A primary driver (PD) causes the support plates (4) of the planarization processing sections (SP1, SP2) to reciprocate along the same straight line in opposite phases.
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公开(公告)号：US20130324012A1
公开(公告)日：2013-12-05
申请号：US13905763
申请日：2013-05-30
Applicant: Ebara Corporation
Inventor： Makoto FUKUSHIMA , Hozumi YASUDA , Keisuke NAMIKI , Osamu NABEYA , Shingo TOGASHI , Satoru YAMAKI
IPC: B24B37/005 , B24B7/22 , B24B37/04 , B24B37/07 , B24B37/32
CPC classification number: B24B37/005 , B24B7/228 , B24B37/042 , B24B37/07 , B24B37/32 , B24B49/16
Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder.
Abstract translation: 抛光装置通过使基板与抛光表面滑动接触来抛光基板。 抛光装置包括：基板保持器，其具有被配置为将基板压靠在抛光表面上的基板保持表面;保持环，其联接到基板保持表面并且构造成围绕基板，其中保持环与抛光接触 所述保持环被构造成可以独立于所述基板保持表面倾斜; 旋转机构，其构造成使所述衬底保持器围绕其自身的轴线旋转; 以及至少一个局部负载施加机构，其被构造成沿与所述抛光表面垂直的方向在所述保持环的一部分上施加局部负载，所述至少一个局部负载施加机构被布置成不依照所述衬底移动 持有人
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公开(公告)号：US11850697B2
公开(公告)日：2023-12-26
申请号：US17120857
申请日：2020-12-14
Applicant: Tokyo Electron Limited
Inventor： Osamu Miyahara
IPC: B24B29/00 , B24B37/005 , H01L21/02 , B24B57/02 , B24B37/07
CPC classification number: B24B29/005 , B24B37/005 , B24B37/07 , B24B57/02 , H01L21/02013 , H01L21/02052
Abstract: A substrate processing apparatus includes: a holding part for holding a substrate; a rotating part for rotating the holding part to rotate the substrate together with the holding part; a liquid supply part for supplying a cleaning liquid to a main surface of the substrate; a polishing head for polishing the main surface; a moving part for scanning the polishing head in a radial direction of the substrate while pressing the polishing head against the main surface; and a controller for controlling the rotating part, the liquid supply part, and the moving part. The controller sets a division line that divides the main surface into plural areas in the radial direction, and controls the liquid supply part to supply the cleaning liquid for each area and controls the moving part to scan the polishing head for each area while a subsequent supply of the cleaning liquid is stopped.
