公开(公告)号：US12027382B2

公开(公告)日：2024-07-02

申请号：US17541540

申请日：2021-12-03

申请人： Applied Materials, Inc.

发明人： Brian K. Kirkpatrick ,  Ekaterina A. Mikhaylichenko ,  Brian J. Brown

IPC分类号： H01L21/67 ,  B08B3/02 ,  B24B37/00 ,  H01L21/306

CPC分类号： H01L21/67051 ,  B08B3/024 ,  B08B3/02 ,  B24B37/00 ,  H01L21/30625

摘要： Cleaning chambers may include a substrate support having a substrate seating position. The cleaning chambers may include a plurality of fluid nozzles facing the substrate support. Each fluid nozzle of the plurality of fluid nozzles may define a fluid port characterized by a leading edge and a trailing edge. Each fluid nozzle of the plurality of fluid nozzles may be angled relative to the substrate seating position of the substrate support to produce an interior angle of greater than or about 90° at an intersection location across the substrate seating position for a fluid delivered from each fluid nozzle at the leading edge of the fluid port.

公开(公告)号：US20240017376A1

公开(公告)日：2024-01-18

申请号：US18352446

申请日：2023-07-14

申请人： Applied Materials, Inc.

发明人： Brian J. Brown ,  Chirantha Rodrigo ,  Ekaterina A. Mikhaylichenko ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Dominic J. Benvegnu ,  Lakshmanan Karuppiah

IPC分类号： B24B49/04 ,  B24B57/02 ,  B24B37/013 ,  B24B37/26

CPC分类号： B24B49/045 ,  B24B57/02 ,  B24B37/013 ,  B24B37/26

摘要： A chemical mechanical polishing system includes a support configured to hold a substrate face-up, a polishing article having a polishing surface smaller than an exposed surface of the substrate, a port for dispensing a polishing liquid, one or more actuators to bring the polishing surface into contact with a first portion of the exposed surface of the substrate and to generate relative motion between the substrate and the polishing pad and optically transmissive polymer window, an in-situ optical monitoring system, and a controller configured to receive a signal from the optical in-situ monitoring system and to modifying a polishing parameter based on the signal. The optical monitoring system includes a light source and a detector, the in-situ optical monitoring system configured to direct a light beam from above the support to impinge a non-overlapping second portion of the exposed surface of the substrate.

公开(公告)号：US20230356355A1

公开(公告)日：2023-11-09

申请号：US17735674

申请日：2022-05-03

申请人： Applied Materials, Inc.

发明人： Jeonghoon Oh ,  Brian J. Brown ,  Huanbo Zhang ,  Andrew Nagengast ,  Steven M. Zuniga ,  Ekaterina A. Mikhaylichenko ,  Eric L. Lau ,  Jay Gurusamy ,  David J. Lischka

IPC分类号： B24B37/32 ,  B24B37/04

CPC分类号： B24B37/32 ,  B24B37/042

摘要： Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that is sized and shaped to circumferentially surround a peripheral edge of a substrate positioned against the substrate mounting surface. The inner ring may be characterized by a first surface that faces the carrier body and a second surface opposite the first surface. The carrier heads may include at least one downforce control actuator disposed above the first surface of the inner ring at a discrete position about a circumference of the inner ring.

公开(公告)号：US12051599B2

公开(公告)日：2024-07-30

申请号：US18198174

申请日：2023-05-16

申请人： Applied Materials, Inc.

发明人： Brian J. Brown ,  Ekaterina A. Mikhaylichenko ,  Brian K. Kirkpatrick

IPC分类号： H01L21/02 ,  B08B1/12 ,  B08B1/32 ,  B08B3/02 ,  B08B3/04 ,  B08B3/08 ,  B08B3/12 ,  B08B3/14 ,  B08B7/04 ,  B08B13/00 ,  B65G47/90 ,  H01L21/67 ,  H01L21/687

CPC分类号： H01L21/67057 ,  B08B1/12 ,  B08B1/32 ,  B08B3/02 ,  B08B3/022 ,  B08B3/041 ,  B08B3/08 ,  B08B3/12 ,  B08B3/14 ,  B08B7/04 ,  B08B13/00 ,  B65G47/90 ,  H01L21/67051 ,  H01L21/68707 ,  B08B2203/007 ,  H01L21/02074

摘要： A method for removing particulates from a plurality of substrates includes opening a first access port in a top of a first container holding a cleaning fluid bath, inserting a first substrate through the first access port to a first support, closing the first access port, opening a second access port in the top of the first container, inserting a second substrate through the second access port to a second support, closing the second access port, opening the first access port, removing the first substrate through the first access port and delivering the first substrate into a rinsing station, closing the first access port, opening the second access port, removing the second substrate through the second access port and delivering the second substrate into the rinsing station, and closing the second access port.

公开(公告)号：US11682567B2

公开(公告)日：2023-06-20

申请号：US17346116

申请日：2021-06-11

申请人： Applied Materials, Inc.

发明人： Brian J. Brown ,  Ekaterina A. Mikhaylichenko ,  Brian K. Kirkpatrick

IPC分类号： H01L21/67 ,  B08B3/08 ,  B08B1/00 ,  B08B3/12 ,  H01L21/687 ,  B08B1/04 ,  B08B13/00 ,  B08B7/04 ,  B65G47/90 ,  B08B3/02 ,  B08B3/04 ,  B08B3/14 ,  H01L21/02

CPC分类号： H01L21/67057 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02 ,  B08B3/022 ,  B08B3/041 ,  B08B3/08 ,  B08B3/12 ,  B08B3/14 ,  B08B7/04 ,  B08B13/00 ,  B65G47/90 ,  H01L21/67051 ,  H01L21/68707 ,  B08B2203/007 ,  H01L21/02074

摘要： A cleaning system for processing a substrate after polishing includes a sulfuric peroxide mix (SPM) module, at least two cleaning elements, and a plurality of robots. The SPM module includes a sulfuric peroxide mix (SPM) cleaner having a first container to hold a sulfuric peroxide mix liquid and five to twenty first supports to hold five to twenty substrates in the liquid in the first container, and a rinsing station having a second container to hold a rinsing liquid and five to twenty second supports to hold five to twenty substrates in the liquid in the second container. Each of the at least two cleaning elements are configured to process a single substrate at a time. Examples of a cleaning element include a megasonic cleaner, a rotating brush cleaner, a buff pad cleaner, a jet spray cleaner, a chemical spin cleaner, a spin drier, and a marangoni drier.

公开(公告)号：US20220281062A1

公开(公告)日：2022-09-08

申请号：US17684285

申请日：2022-03-01

申请人： Applied Materials, Inc.

发明人： Ekaterina A. Mikhaylichenko ,  Fred C. Redeker ,  Brian J. Brown ,  Chirantha Rodrigo ,  Steven M. Zuniga ,  Jay Gurusamy

IPC分类号： B24B37/04 ,  B24B37/11

摘要： A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.

公开(公告)号：US20230290652A1

公开(公告)日：2023-09-14

申请号：US18198174

申请日：2023-05-16

申请人： Applied Materials, Inc.

发明人： Brian J. Brown ,  Ekaterina A. Mikhaylichenko ,  Brian K. Kirkpatrick

IPC分类号： H01L21/67 ,  B08B3/08 ,  B08B1/00 ,  B08B3/12 ,  H01L21/687 ,  B08B1/04 ,  B08B13/00 ,  B08B7/04 ,  B65G47/90 ,  B08B3/02 ,  B08B3/04 ,  B08B3/14

CPC分类号： H01L21/67057 ,  B08B3/08 ,  B08B1/002 ,  B08B3/12 ,  H01L21/68707 ,  B08B1/04 ,  B08B13/00 ,  B08B7/04 ,  B65G47/90 ,  B08B3/02 ,  B08B3/022 ,  B08B3/041 ,  B08B3/14 ,  H01L21/67051 ,  B08B2203/007 ,  H01L21/02074

摘要： A method for removing particulates from a plurality of substrates includes opening a first access port in a top of a first container holding a cleaning fluid bath, inserting a first substrate through the first access port to a first support, closing the first access port, opening a second access port in the top of the first container, inserting a second substrate through the second access port to a second support, closing the second access port, opening the first access port, removing the first substrate through the first access port and delivering the first substrate into a rinsing station, closing the first access port, opening the second access port, removing the second substrate through the second access port and delivering the second substrate into the rinsing station, and closing the second access port.

公开(公告)号：US20230178388A1

公开(公告)日：2023-06-08

申请号：US17541540

申请日：2021-12-03

申请人： Applied Materials, Inc.

发明人： Brian K. Kirkpatrick ,  Ekaterina A. Mikhaylichenko ,  Brian J. Brown

IPC分类号： H01L21/67 ,  B08B3/02

CPC分类号： H01L21/67051 ,  B08B3/024 ,  H01L21/30625

摘要： Cleaning chambers may include a substrate support having a substrate seating position. The cleaning chambers may include a plurality of fluid nozzles facing the substrate support. Each fluid nozzle of the plurality of fluid nozzles may define a fluid port characterized by a leading edge and a trailing edge. Each fluid nozzle of the plurality of fluid nozzles may be angled relative to the substrate seating position of the substrate support to produce an interior angle of greater than or about 90° at an intersection location across the substrate seating position for a fluid delivered from each fluid nozzle at the leading edge of the fluid port.

公开(公告)号：US20220281061A1

公开(公告)日：2022-09-08

申请号：US17677891

申请日：2022-02-22

申请人： Applied Materials, Inc.

发明人： Ekaterina A. Mikhaylichenko ,  Christopher Heung-Gyun Lee ,  Anand N. Iyer ,  Huyen Tran ,  Patrick A. Higashi

IPC分类号： B24B37/015

摘要： A method for removing material from a substrate includes dispensing an abrasive slurry on a polishing pad, storing an indication of a relative charge on the abrasive agent, contacting a surface of a substrate to the polishing pad in the presence of the slurry, generating relative motion between the substrate and the polishing pad, measuring a removal rate for the substrate, comparing a the measured removal rate to a target removal rate and determining whether to increase or decrease the removal rate based on the comparison, determining whether to increase or decrease a temperature of an interface between the polishing pad and the substrate based on the indication of the relative charge of the abrasive agent and on whether to increase or decrease the removal rate, and controlling a temperature of the interface as determined to modify the removal rate.

公开(公告)号：US20210407825A1

公开(公告)日：2021-12-30

申请号：US17346116

申请日：2021-06-11

申请人： Applied Materials, Inc.

发明人： Brian J. Brown ,  Ekaterina A. Mikhaylichenko ,  Brian K. Kirkpatrick

IPC分类号： H01L21/67 ,  B08B3/08 ,  B08B1/00 ,  B08B3/12 ,  B08B3/02 ,  B08B1/04 ,  B08B13/00 ,  B08B7/04 ,  B65G47/90 ,  H01L21/687

摘要： A cleaning system for processing a substrate after polishing includes a sulfuric peroxide mix (SPM) module, at least two cleaning elements, and a plurality of robots. The SPM module includes a sulfuric peroxide mix (SPM) cleaner having a first container to hold a sulfuric peroxide mix liquid and five to twenty first supports to hold five to twenty substrates in the liquid in the first container, and a rinsing station having a second container to hold a rinsing liquid and five to twenty second supports to hold five to twenty substrates in the liquid in the second container. Each of the at least two cleaning elements are configured to process a single substrate at a time. Examples of a cleaning element include a megasonic cleaner, a rotating brush cleaner, a buff pad cleaner, a jet spray cleaner, a chemical spin cleaner, a spin drier, and a marangoni drier.