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公开(公告)号:US11029286B2
公开(公告)日:2021-06-08
申请号:US16467376
申请日:2017-07-03
Applicant: DALIAN UNIVERSITY OF TECHNOLOGY
Inventor: Renke Kang , Zhigang Dong , Xianglong Zhu , Yidan Wang , Xun Zhang , Ping Zhou , Zhenyuan Jia
Abstract: An ultrasonic cutter detection method and device, the method comprises the following steps: preliminary detection: frequency amplitude detection and fall-of-potential detection, if the ultrasonic cutter fails the above two detection solutions in the preliminary detection, repeating the two detections; if the ultrasonic cutter still fails the above two detection solutions, the ultrasonic cutter is judged to be unqualified; and reinspection: free modal detection and pressure modal detection. Using differences of the ultrasonic cutters surface in micro-crack directions that result in different degrees of sensitivity of crack to different ultrasonic vibration modes, combined with the fall-of-potential method and frequency amplitude detection method, a detection rate and a detection velocity of an unqualified ultrasonic cutter can be improved.
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2.
公开(公告)号:US11313783B2
公开(公告)日:2022-04-26
申请号:US16346760
申请日:2017-11-08
Applicant: DALIAN UNIVERSITY OF TECHNOLOGY
Inventor: Ping Zhou , Ning Huang , Renke Kang , Dongming Guo , Ying Yan
IPC: G01N15/10
Abstract: A nanometer cutting depth high-speed single-point scratch test device includes a workbench, an air-bearing turntable, a test piece fixture, a test piece, a Z-direction feeding device, a nano positioning stage, a force sensor and a scratch tool. A micro convex structure with controllable length and height is machined in a position of the test piece to be scratched.
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3.
公开(公告)号:US11945070B2
公开(公告)日:2024-04-02
申请号:US17289718
申请日:2020-04-17
Applicant: DALIAN UNIVERSITY OF TECHNOLOGY
Inventor: Ping Zhou , Zhichao Geng , Ying Yan , Lin Wang , Kai Wang , Dongming Guo
Abstract: A rocker polishing apparatus for full-aperture deterministic polishing of a planar part includes a control system, a substrate, a lifting plate, a polishing module and a measuring module. The polishing module and the measuring module are arranged on the substrate. The lifting plate is arranged between the polishing module and the measuring module. The polishing module includes a rocker mechanism, a polishing pad surface dressing mechanism, a polishing pad surface profile measuring apparatus and a continuous polishing pad mechanism. The apparatus allows the material removal rate distribution of the planar part and the surface profile of the planar part be in the normalized mirror symmetry relationship by controlling the material removal rate distribution on the surface of the planar part, thereby implementing the deterministic polishing of the planar part and ensuring the efficient convergence of the surface profile of the planar part in the polishing process.
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