摘要:
An electronic component is mounted on a surface layer of a multilayer substrate constituting a wiring substrate, and a signal wire of the surface layer is electrically connected to the electronic component. A conductor pad for contact with an inspection probe is composed of a via and a solder filled in an internal opening portion thereof. The via has a laser-processed taper-shaped hole with a metal-plated inner peripheral surface and connects the inter-layer connection between the signal wire of the surface layer and a signal wire of the inner layer. The solder is filled in the opening portion of the via by filling, heating and melting solder material therein. Since the peripheral edge portion is solidified first at the time of the cooling and the solidification, the middle part is recessed compared to the peripheral edge portion. This ensures a reliable contact of the inspection probe.
摘要:
A flexible circuit board, a circuit board assembly, and an electronic device are provided. The flexible circuit board includes at least a flexible dielectric layer and a first connection metal layer. The flexible dielectric layer includes a through hole extending along a thickness direction of the flexible dielectric layer. The through hole includes a middle basic hole and outer auxiliary holes. Two or more outer auxiliary holes are distributed and arranged along a circumferential direction of the middle basic hole. The middle basic hole is in communication with the two or more outer auxiliary holes. The first connection metal layer is arranged on an inner wall of the through hole and is connected to the flexible dielectric layer. The first connection metal layer includes a middle channel extending along a thickness direction.
摘要:
A substrate on which an electronic component is soldered, includes an electronic component, a through hole positioned on the substrate and passing through the substrate, a solder that joins the through hole and a terminal of the electronic component inserted in the through hole, a pattern formed on a first surface of the substrate, the first surface facing a second surface on which the electronic component is placed, a first resist superimposed on the pattern, an exposed portion of which the pattern is exposed from the first resist around the through hole, and a second resist superimposed on the pattern and arranged between the through hole and the exposed portion.
摘要:
A circuit board includes a substrate defining a plurality of ground attaching holes and a plurality of first through-holes. The substrate includes a first surface and a side edge. Wherein, a plurality of parallel and spaced first conductive paths is formed on the first surface around each ground attaching hole. A first arcuate conductive portion is formed at each end of each first conductive path. An angle between each first conductive path and the side edge is 45° or 135°. The first through-holes respectively extend through the first arcuate conductive portions and electrically couple with the first conductive paths.
摘要:
An apparatus includes a printed circuit board. The printed circuit board includes at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The printed circuit board includes a second dielectric layer on top of the at least one conductive layer. The printed circuit board includes a thermal pad on top of the second dielectric layer. The printed circuit board is fabricated by forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The printed circuit board is fabricated by backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.
摘要:
In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion of a solder ball's surface is melted when the connection is formed on one structure and/or when the connection is being attached to another structure. In some embodiments, non-solder balls are joined by an intermediate solder ball (140i). A solder connection may be surrounded by a solder locking layer (1210) and may be recessed in a hole (1230) in that layer. Other features are also provided.
摘要:
A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The printed wiring board has a through hole conductor formed in a through hole penetrating the printed wiring board corresponding to the heat transfer pattern, and thermally connected to the heat transfer pattern. The heat transfer pattern has a plurality of connecting lands exposed so as to be connectable to the heat sink of the electronic component by solder while being divided by a solder resist. The plurality of the connecting lands include lands adjacent to the through holes, and lands not adjacent to the through holes. The heat dissipation of the electronic component is enhanced while enhancing the connectability of the heat transfer pattern with the heat sink of the electronic component, at being mounted.
摘要:
The instant disclosure relates to a connector including a wiring layer, a dielectric layer, a conductive structure, a first protective layer and at least one cantilever structure. The dielectric layer is disposed on the wiring layer, wherein the dielectric layer has at least one via hole to partially expose the wiring layer. The conductive structure is disposed on the inner wall of the at least one via hole of the dielectric layer and electrically connected to the wiring layer. The first protective layer is disposed on the dielectric layer. The cantilever structure is disposed between the first protective layer and the dielectric layer, wherein the at least one cantilever structure is electrically connected to the wiring layer via the conductive structure.
摘要:
A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The printed wiring board has a through hole conductor formed in a through hole penetrating the printed wiring board corresponding to the heat transfer pattern, and thermally connected to the heat transfer pattern. The heat transfer pattern has a plurality of connecting lands exposed so as to be connectable to the heat sink of the electronic component by solder while being divided by a solder resist. The plurality of the connecting lands include lands adjacent to the through holes, and lands not adjacent to the through holes. The heat dissipation of the electronic component is enhanced while enhancing the connectability of the heat transfer pattern with the heat sink of the electronic component, at being mounted.
摘要:
The disclosure relates to a component carrier or printed circuit board for electronic components. According to embodiments, a component carrier may include a first contact face for a contact to a first component, a second contact face for a contact to a second component as well as a conductor track that electrically couples the first and the second contact face. The conductor track may include a conductor recess along the conductor track extending through the printed circuit board. An electric conductor may be arranged in the conductor recess extending over the entire course thereof and electrically coupled to the conductor track.