WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANUFACTURING SAME

    公开(公告)号:US20240357736A1

    公开(公告)日:2024-10-24

    申请号:US18684457

    申请日:2022-08-15

    IPC分类号: H05K1/02 H05K1/11 H05K3/42

    摘要: An electronic component is mounted on a surface layer of a multilayer substrate constituting a wiring substrate, and a signal wire of the surface layer is electrically connected to the electronic component. A conductor pad for contact with an inspection probe is composed of a via and a solder filled in an internal opening portion thereof. The via has a laser-processed taper-shaped hole with a metal-plated inner peripheral surface and connects the inter-layer connection between the signal wire of the surface layer and a signal wire of the inner layer. The solder is filled in the opening portion of the via by filling, heating and melting solder material therein. Since the peripheral edge portion is solidified first at the time of the cooling and the solidification, the middle part is recessed compared to the peripheral edge portion. This ensures a reliable contact of the inspection probe.

    Flexible Circuit Board, Circuit Board Assembly, and Electronic Device

    公开(公告)号:US20240306300A1

    公开(公告)日:2024-09-12

    申请号:US18000891

    申请日:2022-08-18

    IPC分类号: H05K1/11 H01R12/62

    摘要: A flexible circuit board, a circuit board assembly, and an electronic device are provided. The flexible circuit board includes at least a flexible dielectric layer and a first connection metal layer. The flexible dielectric layer includes a through hole extending along a thickness direction of the flexible dielectric layer. The through hole includes a middle basic hole and outer auxiliary holes. Two or more outer auxiliary holes are distributed and arranged along a circumferential direction of the middle basic hole. The middle basic hole is in communication with the two or more outer auxiliary holes. The first connection metal layer is arranged on an inner wall of the through hole and is connected to the flexible dielectric layer. The first connection metal layer includes a middle channel extending along a thickness direction.

    Circuit board and electronic device utilizing the same
    4.
    发明授权
    Circuit board and electronic device utilizing the same 有权
    电路板和使用它的电子设备

    公开(公告)号:US09578746B2

    公开(公告)日:2017-02-21

    申请号:US14695936

    申请日:2015-04-24

    摘要: A circuit board includes a substrate defining a plurality of ground attaching holes and a plurality of first through-holes. The substrate includes a first surface and a side edge. Wherein, a plurality of parallel and spaced first conductive paths is formed on the first surface around each ground attaching hole. A first arcuate conductive portion is formed at each end of each first conductive path. An angle between each first conductive path and the side edge is 45° or 135°. The first through-holes respectively extend through the first arcuate conductive portions and electrically couple with the first conductive paths.

    摘要翻译: 电路板包括限定多个接地安装孔和多个第一通孔的基板。 基板包括第一表面和侧边缘。 其中,在每个接地连接孔周围的第一表面上形成多个平行和间隔的第一导电路径。 第一弧形导电部分形成在每个第一导电路径的每一端。 每个第一导电路径和侧边缘之间的角度为45°或135°。 第一通孔分别延伸穿过第一弧形导电部分并与第一导电路径电耦合。

    SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCUIT BOARDS
    5.
    发明申请
    SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCUIT BOARDS 有权
    电子封装和印刷电路板之间的焊接失电

    公开(公告)号:US20160338200A1

    公开(公告)日:2016-11-17

    申请号:US15220771

    申请日:2016-07-27

    发明人: Phillip D. Isaacs

    摘要: An apparatus includes a printed circuit board. The printed circuit board includes at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The printed circuit board includes a second dielectric layer on top of the at least one conductive layer. The printed circuit board includes a thermal pad on top of the second dielectric layer. The printed circuit board is fabricated by forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The printed circuit board is fabricated by backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.

    摘要翻译: 一种装置包括印刷电路板。 印刷电路板包括在第一电介质层的顶部上的至少一个导电层,其中至少一个导电层包括接地平面和电源平面中的至少一个。 印刷电路板包括在至少一个导电层的顶部上的第二电介质层。 印刷电路板包括位于第二电介质层顶部的散热焊盘。 通过形成至少一个电镀通孔来制造印刷电路板,用于将热垫电耦合到至少一个导电层。 印刷电路板通过对至少一个电镀通孔进行回钻以除去导电材料的一部分来制造,其中在后钻之后,保留在至少一个电镀通孔中的导电材料电耦合至少一个或多个 一个导电层到散热垫。

    Printed wiring board, printed circuit board, and method for manufacturing printed circuit board
    7.
    发明授权
    Printed wiring board, printed circuit board, and method for manufacturing printed circuit board 有权
    印刷电路板,印刷电路板和印刷电路板的制造方法

    公开(公告)号:US09474166B2

    公开(公告)日:2016-10-18

    申请号:US14103608

    申请日:2013-12-11

    IPC分类号: H05K1/00 H05K3/34 H05K1/02

    摘要: A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The printed wiring board has a through hole conductor formed in a through hole penetrating the printed wiring board corresponding to the heat transfer pattern, and thermally connected to the heat transfer pattern. The heat transfer pattern has a plurality of connecting lands exposed so as to be connectable to the heat sink of the electronic component by solder while being divided by a solder resist. The plurality of the connecting lands include lands adjacent to the through holes, and lands not adjacent to the through holes. The heat dissipation of the electronic component is enhanced while enhancing the connectability of the heat transfer pattern with the heat sink of the electronic component, at being mounted.

    摘要翻译: 在安装有散热器的电子部件的第一表面层上,印刷布线板具有面向电子部件的散热器的传热图案。 印刷电路板具有形成在穿过印刷电路板的通孔中的通孔导体,该通孔对应于传热图案,并且热连接到传热图案。 传热图案具有暴露的多个连接焊盘,以便通过焊料与阻焊剂分隔的电子部件的散热器连接。 多个连接平台包括与通孔相邻的平台,并且不与通孔相邻。 在安装时,增强了电子部件的散热,同时增强了传热图案与电子部件的散热器的连接性。

    Connector
    8.
    发明授权
    Connector 有权
    连接器

    公开(公告)号:US09420690B2

    公开(公告)日:2016-08-16

    申请号:US14720979

    申请日:2015-05-26

    摘要: The instant disclosure relates to a connector including a wiring layer, a dielectric layer, a conductive structure, a first protective layer and at least one cantilever structure. The dielectric layer is disposed on the wiring layer, wherein the dielectric layer has at least one via hole to partially expose the wiring layer. The conductive structure is disposed on the inner wall of the at least one via hole of the dielectric layer and electrically connected to the wiring layer. The first protective layer is disposed on the dielectric layer. The cantilever structure is disposed between the first protective layer and the dielectric layer, wherein the at least one cantilever structure is electrically connected to the wiring layer via the conductive structure.

    摘要翻译: 本公开涉及包括布线层,电介质层,导电结构,第一保护层和至少一个悬臂结构的连接器。 电介质层设置在布线层上,其中介电层具有至少一个通孔以部分地暴露布线层。 导电结构设置在电介质层的至少一个通孔的内壁上并电连接到布线层。 第一保护层设置在电介质层上。 所述悬臂结构设置在所述第一保护层和所述电介质层之间,其中所述至少一个悬臂结构经由所述导电结构电连接到所述布线层。

    PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
    9.
    发明申请
    PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD 有权
    印刷线路板,印刷电路板及制造印刷电路板的方法

    公开(公告)号:US20140174795A1

    公开(公告)日:2014-06-26

    申请号:US14103608

    申请日:2013-12-11

    IPC分类号: H05K1/02 H05K3/34

    摘要: A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The printed wiring board has a through hole conductor formed in a through hole penetrating the printed wiring board corresponding to the heat transfer pattern, and thermally connected to the heat transfer pattern. The heat transfer pattern has a plurality of connecting lands exposed so as to be connectable to the heat sink of the electronic component by solder while being divided by a solder resist. The plurality of the connecting lands include lands adjacent to the through holes, and lands not adjacent to the through holes. The heat dissipation of the electronic component is enhanced while enhancing the connectability of the heat transfer pattern with the heat sink of the electronic component, at being mounted.

    摘要翻译: 在安装有散热器的电子部件的第一表面层上,印刷布线板具有面向电子部件的散热器的传热图案。 印刷电路板具有形成在穿过印刷电路板的通孔中的通孔导体,该通孔对应于传热图案,并且热连接到传热图案。 传热图案具有暴露的多个连接焊盘,以便通过焊料与阻焊剂分隔的电子部件的散热器连接。 多个连接平台包括与通孔相邻的平台,并且不与通孔相邻。 在安装时,增强了电子部件的散热,同时增强了传热图案与电子部件的散热器的连接性。

    Component Carrier, Electric Conductor and Method for Producing a Component Carrier as Well as an Electric Conductor
    10.
    发明申请
    Component Carrier, Electric Conductor and Method for Producing a Component Carrier as Well as an Electric Conductor 审中-公开
    元件载体,电导体及其制造方法以及电导体

    公开(公告)号:US20130175076A1

    公开(公告)日:2013-07-11

    申请号:US13739454

    申请日:2013-01-11

    发明人: Axel Hiller

    IPC分类号: H05K1/11 H05K3/34

    摘要: The disclosure relates to a component carrier or printed circuit board for electronic components. According to embodiments, a component carrier may include a first contact face for a contact to a first component, a second contact face for a contact to a second component as well as a conductor track that electrically couples the first and the second contact face. The conductor track may include a conductor recess along the conductor track extending through the printed circuit board. An electric conductor may be arranged in the conductor recess extending over the entire course thereof and electrically coupled to the conductor track.

    摘要翻译: 本公开涉及用于电子部件的部件载体或印刷电路板。 根据实施例,部件载体可以包括用于与第一部件的接触的第一接触面,用于与第二部件的接触的第二接触面以及电耦合第一和第二接触面的导体轨道。 导体轨道可以包括沿着延伸穿过印刷电路板的导体轨迹的导体凹部。 电导体可以布置在导体凹部中,在其整个过程上延伸并且电耦合到导体轨道。