PROGRAMMING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

    公开(公告)号:US20230162798A1

    公开(公告)日:2023-05-25

    申请号:US18090444

    申请日:2022-12-28

    IPC分类号: G11C16/10 G11C16/08 G11C16/28

    摘要: A programming method and a semiconductor device are provided. The semiconductor device includes a memory string that includes a plurality of first memory cells and a first dummy cell stacked in sequence, and each first memory cell is connected to a respective word line, and a gate of the first dummy cell is connected to a first dummy word line. The method includes: in a programming phase, applying a first pass voltage to a word line corresponding to a first unprogrammed memory cell, wherein the first unprogrammed memory cell is an unprogrammed memory cell of the plurality of first memory cells separated from a to-be-programmed memory cell by a first preset number of first memory cells; and after applying the first pass voltage to the word line corresponding to the first unprogrammed memory cell, applying a programming voltage to the word line corresponding to the to-be-programmed memory cell.

    Three-dimensional memory device programming with reduced disturbance

    公开(公告)号:US11423995B2

    公开(公告)日:2022-08-23

    申请号:US17186456

    申请日:2021-02-26

    摘要: A 3D memory device may include a first set of memory layers, a second set of memory layers above the first set of memory layers, and a first dummy memory layer between the first and second memory layers. The 3D memory device may include a plurality of NAND memory strings each extending through the first and second set of memory layers and the first dummy memory layer. The 3D memory device may include a word line (WL) driving circuit that, when programming one of the first set of memory layers, may be configured to apply a second pre-charge voltage to the first dummy memory layer during the pre-charge period. The second pre-charge voltage may overlap with the first pre-charge voltage and ramp down prior to the first pre-charge voltage.

    THREE-DIMENSIONAL MEMORY DEVICE PROGRAMMING WITH REDUCED THRESHOLD VOLTAGE SHIFT

    公开(公告)号:US20220215883A1

    公开(公告)日:2022-07-07

    申请号:US17186429

    申请日:2021-02-26

    摘要: A three-dimensional (3D) memory device may include a first set of memory layers, a second set of memory layers above the first set of memory layers, and a first dummy memory layer between the first and second sets of memory layers. The 3D memory device may further include a peripheral circuit that includes a word line (WL) driving circuit configured to when programming a first memory layer of the first set of memory layers, apply a first pre- charge voltage to the first dummy memory layer during a pre-charge period associated with the first memory layer, and when programming a second memory layer of the first set of memory layers located above the first memory layer, apply a second pre-charge voltage to the first dummy memory layer during a pre-charge period associated with the second memory layer. The first pre-charge voltage may be larger than the second pre-charge voltage.

    THREE-DIMENSIONAL MEMORY DEVICE PROGRAMMING WITH REDUCED DISTURBANCE

    公开(公告)号:US20220215888A1

    公开(公告)日:2022-07-07

    申请号:US17186456

    申请日:2021-02-26

    摘要: A 3D memory device may include a first set of memory layers, a second set of memory layers above the first set of memory layers, and a first dummy memory layer between the first and second memory layers. The 3D memory device may include a plurality of NAND memory strings each extending through the first and second set of memory layers and the first dummy memory layer. The 3D memory device may include a word line (WL) driving circuit that, when programming one of the first set of memory layers, may be configured to apply a second pre-charge voltage to the first dummy memory layer during the pre-charge period. The second pre-charge voltage may overlap with the first pre-charge voltage and ramp down prior to the first pre-charge voltage.

    Three-dimensional memory and control method thereof

    公开(公告)号:US11864379B2

    公开(公告)日:2024-01-02

    申请号:US17568639

    申请日:2022-01-04

    摘要: The present disclosure relates to a three-dimensional memory (3D) and a control method thereof. The 3D memory includes a first deck and a second deck which are stacked in a vertical direction of a substrate. The first deck and the second deck each includes a plurality of memory string. Each memory string includes a plurality of memory cells. The plurality of memory cells includes a first portion and a second portion. A diameter of channel structure corresponding to the first portion of memory cells is smaller than that of channel structure corresponding to the second portion of memory cells. The method includes performing a read operation for selected memory cells that are in at least one of the first deck or the second deck; and applying a pass voltage to non-selected memory cells other than the selected memory cells in the first deck and the second deck. A first pass voltage is lower than a second pass voltage. The first pass voltage is applied to first non-selected memory cells in the first portion, and the second pass voltage is applied to second non-selected memory cells in the second portion.

    THREE-DIMENSIONAL MEMORY DEVICE PROGRAMMING WITH REDUCED DISTURBANCE

    公开(公告)号:US20220359022A1

    公开(公告)日:2022-11-10

    申请号:US17871472

    申请日:2022-07-22

    摘要: A 3D memory device may include a first set of memory layers, a second set of memory layers above the first set of memory layers, and a first dummy memory layer between the first and second memory layers. The 3D memory device may include a plurality of NAND memory strings each extending through the first and second set of memory layers and the first dummy memory layer. The 3D memory device may include a word line (WL) driving circuit that, when programming one of the first set of memory layers, may be configured to apply a second pre-charge voltage to the first dummy memory layer during the pre-charge period. The second pre-charge voltage may overlap with the first pre-charge voltage and ramp down prior to the first pre-charge voltage.