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    Component built-in module, and manufacturing method for component built-in module
    1.
    发明授权
    Component built-in module, and manufacturing method for component built-in module 有权
    组件内置模块，以及组件内置模块的制造方法

    公开(公告)号：US08745859B2

    公开(公告)日：2014-06-10

    申请号：US13472591

    申请日：2012-05-16

    申请人： Shozo Ochi ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

    发明人： Shozo Ochi ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

    IPC分类号： H05K1/02

    CPC分类号： H01L21/56 ,  H01L21/4857 ,  H01L23/3107 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4638 ,  H05K3/4697 ,  H01L2924/00

    摘要： A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

    摘要翻译： 一种组件内置模块的制造方法，包括：在包括树脂的片材构件中形成填充有导电浆料的通孔，其中将构建电子部件的空腔和调节空间; 并且进行热压机，使片材与其上安装有电子部件的基板抵接，其中调节空间被形成为在热压机过程中通孔周围的树脂的流动矢量， 被引导到电子部件，被热冲压时的通孔附近的树脂的流动矢量抵消，该朝向调节空间。

    STORAGE MEDIUM WITH BUILT-IN ANTENNA
    3.
    发明申请
    STORAGE MEDIUM WITH BUILT-IN ANTENNA 失效
    存储天线与内置天线

    公开(公告)号：US20100052996A1

    公开(公告)日：2010-03-04

    申请号：US11993734

    申请日：2006-07-10

    申请人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi

    发明人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi

    IPC分类号： H01Q7/06 ,  H01Q1/24

    CPC分类号： H05K1/16 ,  G06K19/07732 ,  G06K19/07767 ,  H01Q1/2275 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/147 ,  H05K1/181 ,  H05K2201/056 ,  H05K2201/10674

    摘要： A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element.

    摘要翻译： 具有内置天线的存储介质包括其上放置有半导体元件的电路板，夹持半导体元件和电路板的第一和第二磁性层以及设置在第一和第二磁性层上的第一和第二天线线圈。 第一和第二天线线圈并联连接在柔性片上。 第一和第二天线线圈分别在第一和第二磁性层的侧面折叠并电连接到半导体元件。

    Printed circuit board and method for producing the same
    4.
    发明授权
    Printed circuit board and method for producing the same 有权

    公开(公告)号：US06459046B1

    公开(公告)日：2002-10-01

    申请号：US09919319

    申请日：2001-07-31

    申请人： Shozo Ochi ,  Fumio Echigo ,  Yoji Ueda

    发明人： Shozo Ochi ,  Fumio Echigo ,  Yoji Ueda

    IPC分类号： H05K103

    CPC分类号： H05K3/4069 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/12028 ,  Y10T428/12528

    摘要： A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor. By adjusting the thickness of the resin layers formed on both sides of the resin holder such as a glass cloth, it is possible to ensure high reliability when electrically connecting circuit boards using an electrically conductive paste as the electrical conductor.

    Printed circuit board and method of manufacturing the same
    7.
    发明授权
    Printed circuit board and method of manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US06753483B2

    公开(公告)日：2004-06-22

    申请号：US09879385

    申请日：2001-06-12

    申请人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

    发明人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

    IPC分类号： H01R1204

    CPC分类号： H05K3/4069 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

    摘要： The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

    摘要翻译： 本发明提供了一种印刷电路板，其包括具有沿厚度方向形成的通孔的电介质基板，并且包含导电填料的导体填充在通孔中。 电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。 此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。 本发明还提供一种制造这种印刷电路板的方法。

    SEMICONDUCTOR MEMORY MODULE INCORPORATING ANTENNA
    9.
    发明申请
    SEMICONDUCTOR MEMORY MODULE INCORPORATING ANTENNA 失效
    半导体存储器模块天线

    公开(公告)号：US20090040734A1

    公开(公告)日：2009-02-12

    申请号：US12280456

    申请日：2007-03-28

    申请人： Shozo Ochi ,  Hidenobu Nishikawa ,  Hiroshi Sakurai

    发明人： Shozo Ochi ,  Hidenobu Nishikawa ,  Hiroshi Sakurai

    IPC分类号： H01Q7/00 ,  H05K1/03

    CPC分类号： G06K19/0723 ,  G06K19/07732 ,  G06K19/07749 ,  H01Q1/2208 ,  H05K1/0306 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/117 ,  H05K1/144 ,  H05K1/16 ,  H05K2201/086 ,  H05K2201/09309

    摘要： The semiconductor memory module incorporating antenna includes a wiring board (11) having a connection terminal (17) connected with a control semiconductor element (16) and arranged at a position exposed to the surface of an outer case (15), and a terminal electrode (18) for antenna connection connected with the control semiconductor element (16) and arranged in the outer case (15); a semiconductor storage element (12) mounted on one side of the wiring board (11); and a loop-like antenna (13) and an antenna terminal electrode (20) formed on the other side of the wiring board (11) along the outer peripheral thereof, the wiring board (11) includes at least one magnetic body layer (14) and the terminal electrode (18) for antenna connection is connected with the antenna terminal electrode (20).

    摘要翻译： 具有天线的半导体存储器模块包括具有连接端子（17）的布线板（11），该连接端子（17）与控制半导体元件（16）连接并布置在暴露于外壳（15）的表面的位置处，以及端子电极 （18），用于与控制半导体元件（16）连接并布置在外壳（15）中的天线连接; 安装在所述布线板（11）一侧的半导体存储元件（12）。 以及沿其外周形成在布线板（11）的另一侧的环状天线（13）和天线端子电极（20），布线基板（11）包括至少一个磁性体层（14） ）和用于天线连接的端子电极（18）与天线端子电极（20）连接。

    MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER CIRCUIT SUBSTRATE
    10.
    发明申请
    MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER CIRCUIT SUBSTRATE 审中-公开
    多层电路基板制造方法及多层电路基板

    公开(公告)号：US20090032285A1

    公开(公告)日：2009-02-05

    申请号：US11814698

    申请日：2005-01-27

    申请人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

    发明人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

    IPC分类号： H05K3/46 ,  H05K1/14 ,  H05K1/00

    CPC分类号： H05K1/024 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0355 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/1461 ,  Y10T428/24843

    摘要： A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.

    摘要翻译： 一种制造多层电路板的方法包括以下步骤：通过在具有接地链路的双面电路板和在其两个表面上图案化的信号布线的至少一个表面层压预定厚度的预浸料来制造层压体 ; 并且对层压体施加热和压力，并且完成在双面电路板和预浸料坯之间的边界处将信号布线放置在预浸料坯内部的层状结构，其中预定厚度的预浸料片材用于完成 使得双面电路板的预浸料坯的厚度小于与双面电路板不相对的一侧上的预浸料坯的表面与布置在预浸料坯内部的信号线之间的距离。