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    MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER CIRCUIT SUBSTRATE
    1.
    发明申请
    MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER CIRCUIT SUBSTRATE 审中-公开
    多层电路基板制造方法及多层电路基板

    公开(公告)号：US20090032285A1

    公开(公告)日：2009-02-05

    申请号：US11814698

    申请日：2005-01-27

    申请人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

    发明人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

    IPC分类号： H05K3/46 ,  H05K1/14 ,  H05K1/00

    CPC分类号： H05K1/024 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0355 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/1461 ,  Y10T428/24843

    摘要： A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.

    摘要翻译： 一种制造多层电路板的方法包括以下步骤：通过在具有接地链路的双面电路板和在其两个表面上图案化的信号布线的至少一个表面层压预定厚度的预浸料来制造层压体 ; 并且对层压体施加热和压力，并且完成在双面电路板和预浸料坯之间的边界处将信号布线放置在预浸料坯内部的层状结构，其中预定厚度的预浸料片材用于完成 使得双面电路板的预浸料坯的厚度小于与双面电路板不相对的一侧上的预浸料坯的表面与布置在预浸料坯内部的信号线之间的距离。

    Method of producing a circuit board
    3.
    发明授权
    Method of producing a circuit board 失效
    电路板的制造方法

    公开(公告)号：US06691409B2

    公开(公告)日：2004-02-17

    申请号：US10280964

    申请日：2002-10-25

    申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

    发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

    IPC分类号： H01K300

    CPC分类号： H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

    摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

    摘要翻译： 电路板被构造成在布线层之间包括不少于两个布线层，用于电绝缘的绝缘体层和在绝缘体层的厚度方向上设置在绝缘体层中的内通孔导电构件， 用于布线层之间的电连接。 绝缘体层由包含有机树脂和热膨胀系数小于有机树脂的材料的复合材料制成，并且包括以所述顺序层压的表面部分，芯部分和表面部分， 表面部分具有高含量的有机树脂，芯部分的有机树脂含量低。 所述布线层具有与所述内通孔导电部件连接的台面部，所述接合部嵌入以与所述芯部大体接触，所述内通孔导电部件的厚度基本上 等于芯部的厚度。 根据该结构，将金属箔的一部分嵌入到绝缘体层中以与芯层接触。 因此，能够提供能够选择性地压缩导电材料的部分的电路基板，由此能够确保层之间的稳定的连接。

    Die for forming honeycomb structure, and method of manufacturing the same
    4.
    发明申请
    Die for forming honeycomb structure, and method of manufacturing the same 失效
    用于形成蜂窝结构的模具及其制造方法

    公开(公告)号：US20060018988A1

    公开(公告)日：2006-01-26

    申请号：US11174657

    申请日：2005-07-06

    申请人： Hiroshi Kuwahara ,  Susumu Matsuoka ,  Takao Saito

    发明人： Hiroshi Kuwahara ,  Susumu Matsuoka ,  Takao Saito

    IPC分类号： A01J21/02 ,  B23P9/00 ,  B23P25/00

    CPC分类号： B23P15/243 ,  B28B3/269 ,  B28B7/346 ,  C23C16/26 ,  C23C16/32 ,  Y10T29/49861 ,  Y10T29/49885

    摘要： There is disclosed a die 1 for forming a honeycomb structure comprises: a plate-like die substrate 2 having at least two surfaces 8, 9, in which back holes 3 for introducing a green material are formed in one surface 8, and slits 4 communicating with back holes 3 are formed in the other surface 9; an underlayer 5 disposed on the substrate 2 so as to coat at least a part of a portion constituting the back hole 3 and the slit 4; an intermediate layer 6 disposed so as to coat at least a part of the underlayer 5 and constituted of tungsten carbide particles whose average particle diameter is 5 μm or less and containing W3C as a main component; and a surface layer 7 disposed so as to coat at least a part of the intermediate layer 6 and constituted of diamond and/or diamond-like carbon.

    摘要翻译： 公开了一种用于形成蜂窝结构的模具1，其包括：板状模具基板2，其具有至少两个表面8,9，其中在一个表面8中形成用于引入生坯的后孔3，以及沟槽4 后孔3形成在另一个表面9中; 设置在基板2上以便涂覆构成后孔3和狭缝4的部分的至少一部分的底层5; 中间层6，其设置为涂覆底层5的至少一部分，由平均粒径为5μm以下并含有W 3 C的碳化钨颗粒构成为主要成分; 以及设置成涂覆中间层6的至少一部分并由金刚石和/或类金刚石碳构成的表面层7。

    Antifreeze composition comprising benzimidazole and triazine
    6.
    发明授权
    Antifreeze composition comprising benzimidazole and triazine 失效
    包含苯并咪唑和三嗪的防冻剂组合物

    公开(公告)号：US07645394B2

    公开(公告)日：2010-01-12

    申请号：US11002892

    申请日：2004-12-03

    申请人： Susumu Matsuoka ,  Isao Shinoda ,  Yasuhiro Kishimoto

    发明人： Susumu Matsuoka ,  Isao Shinoda ,  Yasuhiro Kishimoto

    IPC分类号： C09K5/00

    CPC分类号： C09K5/20 ,  C23F11/10 ,  C23F11/126 ,  C23F11/149

    摘要： The antifreeze of the present invention is including propylene glycol, first material, and second material. The first material is normal aliphatic dicarboxylic acid in which number of carbon atoms is from 10 to 12, salt of the normal aliphatic dicarboxylic acid, or mixture thereof. The second material is benzimidazole compound which has a benzimidazole skeleton, salt of the benzimidazole compound, triazine compound which has a triazine skeleton and has a mercapto group, salt of the triazine compound, or mixture thereof. Such antifreeze has less environment load than antifreeze including ethylene glycol. Furthermore, such antifreeze does not cause metal to corrode more than the antifreeze including ethylene glycol.

    摘要翻译： 本发明的防冻液包括丙二醇，第一材料和第二材料。 第一种材料是正常的脂族二羧酸，其中碳原子数为10至12，正常脂族二羧酸的盐或其混合物。 第二种材料是具有苯并咪唑骨架的苯并咪唑化合物，苯并咪唑化合物的盐，具有三嗪骨架并具有巯基的三嗪化合物，三嗪化合物的盐或其混合物。 这种防冻剂比包括乙二醇在内的防冻剂具有更少的环境负荷。 此外，这种防冻剂不会使包括乙二醇在内的防冻剂发生金属腐蚀。

    Die for molding honeycomb structure and manufacturing method thereof
    8.
    发明申请
    Die for molding honeycomb structure and manufacturing method thereof 有权
    用于成型蜂窝结构的模具及其制造方法

    公开(公告)号：US20100119640A1

    公开(公告)日：2010-05-13

    申请号：US12656057

    申请日：2010-01-14

    申请人： Susumu Matsuoka ,  Seiichi Inoue ,  Haremi Ito ,  Keiji Matsumoto

    发明人： Susumu Matsuoka ,  Seiichi Inoue ,  Haremi Ito ,  Keiji Matsumoto

    IPC分类号： B29C47/30

    CPC分类号： C23C18/1644 ,  B01J35/04 ,  B28B3/26 ,  B28B3/269 ,  B29C47/0028 ,  B29C47/0852 ,  B29C47/12 ,  B29L2031/60 ,  C23C16/045 ,  C23C16/32 ,  C23C18/165

    摘要： A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 μm, wherein the surface layer is made up of tungsten carbide particles which are 5 μm or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.

    摘要翻译： 一种用于挤出成型蜂窝结构的模具，包括：模具基座，设置有陶瓷熔池引入孔和与陶瓷熔池引入孔连通的狭缝; 以及大致限定狭缝的最终宽度的基底层以及形成在模座上的缝隙的最终宽度的表面层，使得狭缝的最终宽度为15〜200 μm，其中表面层由平均粒径为5μm以下且含有W3C为主要成分的碳化钨颗粒构成。 根据本发明，提供了一种用于挤压成形蜂窝结构的模具，其能够抑制挤出成型时引起的挤压成形速度的波动，挤压成形时的挤压成形速度的波动非常小， 在生产率和耐久性方面都是优越的。