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    Multilayer circuit board and manufacturing method thereof
    1.
    发明授权
    Multilayer circuit board and manufacturing method thereof 失效
    多层电路板及其制造方法

    公开(公告)号：US07737367B2

    公开(公告)日：2010-06-15

    申请号：US11338771

    申请日：2006-01-25

    申请人： Masayoshi Koyama ,  Yoshitake Hayashi ,  Kazuo Otani

    发明人： Masayoshi Koyama ,  Yoshitake Hayashi ,  Kazuo Otani

    IPC分类号： H01R12/04 ,  H05K1/11

    CPC分类号： H05K3/4614 ,  H05K3/0035 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2203/0278 ,  H05K2203/0554 ,  H05K2203/1453 ,  Y10T29/49165

    摘要： Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.

    摘要翻译： 当在可拆卸的载体上形成布线图案时，预先形成具有与通孔相同直径的孔。 具有布线图案的载体被接合在绝缘材料上，并且使用布线图案中的孔作为激光掩模从载体的侧面照射激光束，以在绝缘材料中形成通孔。 通孔和载体中的孔然后用导电浆料填充。 通过载体中与通孔的位置匹配的孔，导体层中的焊盘相对于通孔精确定位。 由此制造的多层电路板具有较低的电连接电阻和优异的安装性能，并具有改进的性能。 也可以实现其制造方法。

    Multilayer circuit board and manufacturing method thereof
    3.
    发明申请
    Multilayer circuit board and manufacturing method thereof 失效
    多层电路板及其制造方法

    公开(公告)号：US20060191715A1

    公开(公告)日：2006-08-31

    申请号：US11338771

    申请日：2006-01-25

    申请人： Masayoshi Koyama ,  Yoshitake Hayashi ,  Kazuo Otani

    发明人： Masayoshi Koyama ,  Yoshitake Hayashi ,  Kazuo Otani

    IPC分类号： H05K1/11 ,  H05K3/40

    CPC分类号： H05K3/4614 ,  H05K3/0035 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2203/0278 ,  H05K2203/0554 ,  H05K2203/1453 ,  Y10T29/49165

    摘要： Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.

    摘要翻译： 当在可拆卸的载体上形成布线图案时，预先形成具有与通孔相同直径的孔。 具有布线图案的载体被接合在绝缘材料上，并且使用布线图案中的孔作为激光掩模从载体的侧面照射激光束，以在绝缘材料中形成通孔。 通孔和载体中的孔然后用导电浆料填充。 通过载体中与通孔的位置匹配的孔，导体层中的焊盘相对于通孔精确定位。 由此制造的多层电路板具有较低的电连接电阻和优异的安装性能，并具有改进的性能。 也可以实现其制造方法。

    Component built-in module, and manufacturing method for component built-in module
    5.
    发明授权
    Component built-in module, and manufacturing method for component built-in module 有权
    组件内置模块，以及组件内置模块的制造方法

    公开(公告)号：US08745859B2

    公开(公告)日：2014-06-10

    申请号：US13472591

    申请日：2012-05-16

    申请人： Shozo Ochi ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

    发明人： Shozo Ochi ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

    IPC分类号： H05K1/02

    CPC分类号： H01L21/56 ,  H01L21/4857 ,  H01L23/3107 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4638 ,  H05K3/4697 ,  H01L2924/00

    摘要： A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

    摘要翻译： 一种组件内置模块的制造方法，包括：在包括树脂的片材构件中形成填充有导电浆料的通孔，其中将构建电子部件的空腔和调节空间; 并且进行热压机，使片材与其上安装有电子部件的基板抵接，其中调节空间被形成为在热压机过程中通孔周围的树脂的流动矢量， 被引导到电子部件，被热冲压时的通孔附近的树脂的流动矢量抵消，该朝向调节空间。

    Cyclically driven gyro and adjusting system therefor
    8.
    发明授权
    Cyclically driven gyro and adjusting system therefor 失效
    循环驱动陀螺仪及其调节系统

    公开(公告)号：US4791815A

    公开(公告)日：1988-12-20

    申请号：US33761

    申请日：1987-04-03

    申请人： Hiroshi Yamaguchi ,  Suzushi Kimura ,  Yoshitake Hayashi

    发明人： Hiroshi Yamaguchi ,  Suzushi Kimura ,  Yoshitake Hayashi

    IPC分类号： G01C19/5607 ,  G01P9/04 ,  G01P21/00

    CPC分类号： G01C19/5607

    摘要： A gyro which realizes a small error response to a disturbance inertia such as vibration, impact, etc. and an adjusting system thereof has a pair of mass elements which are cyclically driven symmetrically. A pair of sensors independently detect forces produced in response to an input angular rate and generate a pair of detection outputs. An adjustable adder synthesizes components proportional to the disturbance inertia contained in the detection outputs with an optimum addition ratio so that they are mutually completely cancelled and generates a synthesized output. A signal processing circuit processes the synthesized output to generate an output proportional to the input angular rate. The adjusting system applies to the gyro in an operating condition a disturbance vibration in the vicinity of the drive frequency of the gyro. By adjusting the addition ratio of the adjustable adder in a manner so as to make the response at this time a minimum, the best characteristic can be obtained.

    摘要翻译： 实现对诸如振动，冲击等的扰动惯性的小误差响应的陀螺仪及其调节系统具有对称地循环驱动的一对质量元件。 一对传感器独立地检测响应于输入角速率产生的力并产生一对检测输出。 可调加法器以最佳相加比率合成与检测输出中包含的干扰惯性成比例的分量，使得它们相互完全消除，并产生合成输出。 信号处理电路处理合成输出以产生与输入角速率成比例的输出。 调节系统在陀螺仪的驱动频率附近的操作状态下适用于陀螺仪的干扰振动。 通过以这种方式调整可调加法器的相加比例使得此时的响应最小化，可以获得最佳特性。

    COMPONENT BUILT-IN MODULE, AND MANUFACTURING METHOD FOR COMPONENT BUILT-IN MODULE
    9.
    发明申请
    COMPONENT BUILT-IN MODULE, AND MANUFACTURING METHOD FOR COMPONENT BUILT-IN MODULE 有权
    组件内置模块和组件内置模块的制造方法

    公开(公告)号：US20120293965A1

    公开(公告)日：2012-11-22

    申请号：US13472591

    申请日：2012-05-16

    申请人： Shozo OCHI ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

    发明人： Shozo OCHI ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

    IPC分类号： H05K7/00 ,  H05K13/04

    CPC分类号： H01L21/56 ,  H01L21/4857 ,  H01L23/3107 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4638 ,  H05K3/4697 ,  H01L2924/00

    摘要： A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

    摘要翻译： 一种组件内置模块的制造方法，包括：在包括树脂的片材构件中形成填充有导电浆料的通孔，其中将构建电子部件的空腔和调节空间; 并且进行热压机，使片材与其上安装有电子部件的基板抵接，其中调节空间被形成为在热压机过程中通孔周围的树脂的流动矢量， 被引导到电子部件，被热冲压时的通孔附近的树脂的流动矢量抵消，该朝向调节空间。