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    Multilayer circuit board and manufacturing method thereof
    2.
    发明授权
    Multilayer circuit board and manufacturing method thereof 失效
    多层电路板及其制造方法

    公开(公告)号：US07737367B2

    公开(公告)日：2010-06-15

    申请号：US11338771

    申请日：2006-01-25

    申请人： Masayoshi Koyama ,  Yoshitake Hayashi ,  Kazuo Otani

    发明人： Masayoshi Koyama ,  Yoshitake Hayashi ,  Kazuo Otani

    IPC分类号： H01R12/04 ,  H05K1/11

    CPC分类号： H05K3/4614 ,  H05K3/0035 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2203/0278 ,  H05K2203/0554 ,  H05K2203/1453 ,  Y10T29/49165

    摘要： Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.

    摘要翻译： 当在可拆卸的载体上形成布线图案时，预先形成具有与通孔相同直径的孔。 具有布线图案的载体被接合在绝缘材料上，并且使用布线图案中的孔作为激光掩模从载体的侧面照射激光束，以在绝缘材料中形成通孔。 通孔和载体中的孔然后用导电浆料填充。 通过载体中与通孔的位置匹配的孔，导体层中的焊盘相对于通孔精确定位。 由此制造的多层电路板具有较低的电连接电阻和优异的安装性能，并具有改进的性能。 也可以实现其制造方法。

    Multilayer circuit board and manufacturing method thereof
    4.
    发明申请
    Multilayer circuit board and manufacturing method thereof 失效
    多层电路板及其制造方法

    公开(公告)号：US20060191715A1

    公开(公告)日：2006-08-31

    申请号：US11338771

    申请日：2006-01-25

    申请人： Masayoshi Koyama ,  Yoshitake Hayashi ,  Kazuo Otani

    发明人： Masayoshi Koyama ,  Yoshitake Hayashi ,  Kazuo Otani

    IPC分类号： H05K1/11 ,  H05K3/40

    CPC分类号： H05K3/4614 ,  H05K3/0035 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2203/0278 ,  H05K2203/0554 ,  H05K2203/1453 ,  Y10T29/49165

    摘要： Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.

    摘要翻译： 当在可拆卸的载体上形成布线图案时，预先形成具有与通孔相同直径的孔。 具有布线图案的载体被接合在绝缘材料上，并且使用布线图案中的孔作为激光掩模从载体的侧面照射激光束，以在绝缘材料中形成通孔。 通孔和载体中的孔然后用导电浆料填充。 通过载体中与通孔的位置匹配的孔，导体层中的焊盘相对于通孔精确定位。 由此制造的多层电路板具有较低的电连接电阻和优异的安装性能，并具有改进的性能。 也可以实现其制造方法。

    COMPONENT BUILT-IN MODULE, AND MANUFACTURING METHOD FOR COMPONENT BUILT-IN MODULE
    5.
    发明申请
    COMPONENT BUILT-IN MODULE, AND MANUFACTURING METHOD FOR COMPONENT BUILT-IN MODULE 有权
    组件内置模块和组件内置模块的制造方法

    公开(公告)号：US20120293965A1

    公开(公告)日：2012-11-22

    申请号：US13472591

    申请日：2012-05-16

    申请人： Shozo OCHI ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

    发明人： Shozo OCHI ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

    IPC分类号： H05K7/00 ,  H05K13/04

    CPC分类号： H01L21/56 ,  H01L21/4857 ,  H01L23/3107 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4638 ,  H05K3/4697 ,  H01L2924/00

    摘要： A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

    摘要翻译： 一种组件内置模块的制造方法，包括：在包括树脂的片材构件中形成填充有导电浆料的通孔，其中将构建电子部件的空腔和调节空间; 并且进行热压机，使片材与其上安装有电子部件的基板抵接，其中调节空间被形成为在热压机过程中通孔周围的树脂的流动矢量， 被引导到电子部件，被热冲压时的通孔附近的树脂的流动矢量抵消，该朝向调节空间。

    Package configuration of solar cell elements
    7.
    发明授权
    Package configuration of solar cell elements 失效
    太阳能电池元件的封装配置

    公开(公告)号：US4633032A

    公开(公告)日：1986-12-30

    申请号：US701192

    申请日：1985-02-13

    申请人： Hikofumi Oido ,  Yoshitake Hayashi ,  Minoru Yamamoto

    发明人： Hikofumi Oido ,  Yoshitake Hayashi ,  Minoru Yamamoto

    IPC分类号： H01L31/04 ,  H01L31/02 ,  H01L31/042 ,  H01L31/048 ,  H01L31/18 ,  H01L31/00

    CPC分类号： H01L31/048 ,  H01L31/1828 ,  Y02E10/543

    摘要： A package configuration of a solar cell has a glass substrate having a solar cell element formed on the surface opposite to the light-receiving surface thereof, a backplate disposed across an empty space from the surface of the glass substrate opposite to the light receiving surface thereof, a frame connecting the glass substrate and the backplate to each other along the peripheries thereof, a sealing resin layer sealed inside the peripheries of the backplate and the frame so as to isolate the empty space from the atmosphere, a layer of desiccant disposed inside the backplate so as to adsorb moisture penetrating into the empty space, and conductor wires for externally collecting electric energy generated by the solar cell element.

    摘要翻译： 太阳能电池的封装结构具有在与其受光面相反的表面上形成有太阳能电池元件的玻璃基板，从玻璃基板的与其受光面相反的表面的空白空间配置的背板 ，将玻璃基板和背板沿着其周边彼此连接的框架，密封树脂层，密封在背板和框架的周边内部，以将空间与大气隔离，设置在内部的干燥剂层 背板，以吸附渗透到空间的水分，以及用于外部收集由太阳能电池元件产生的电能的导线。

    Component built-in module, and manufacturing method for component built-in module
    8.
    发明授权
    Component built-in module, and manufacturing method for component built-in module 有权
    组件内置模块，以及组件内置模块的制造方法

    公开(公告)号：US08745859B2

    公开(公告)日：2014-06-10

    申请号：US13472591

    申请日：2012-05-16

    申请人： Shozo Ochi ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

    发明人： Shozo Ochi ,  Yoshitake Hayashi ,  Kazuo Ohtani ,  Yosuke Maeba

    IPC分类号： H05K1/02

    CPC分类号： H01L21/56 ,  H01L21/4857 ,  H01L23/3107 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4638 ,  H05K3/4697 ,  H01L2924/00

    摘要： A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

    摘要翻译： 一种组件内置模块的制造方法，包括：在包括树脂的片材构件中形成填充有导电浆料的通孔，其中将构建电子部件的空腔和调节空间; 并且进行热压机，使片材与其上安装有电子部件的基板抵接，其中调节空间被形成为在热压机过程中通孔周围的树脂的流动矢量， 被引导到电子部件，被热冲压时的通孔附近的树脂的流动矢量抵消，该朝向调节空间。