-
公开(公告)号：US07737367B2
公开(公告)日：2010-06-15
申请号：US11338771
申请日：2006-01-25
申请人： Masayoshi Koyama , Yoshitake Hayashi , Kazuo Otani
发明人： Masayoshi Koyama , Yoshitake Hayashi , Kazuo Otani
CPC分类号： H05K3/4614 , H05K3/0035 , H05K3/20 , H05K3/4069 , H05K3/4652 , H05K3/4658 , H05K2201/0376 , H05K2201/0394 , H05K2201/0969 , H05K2203/0278 , H05K2203/0554 , H05K2203/1453 , Y10T29/49165
摘要： Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.
摘要翻译： 当在可拆卸的载体上形成布线图案时，预先形成具有与通孔相同直径的孔。 具有布线图案的载体被接合在绝缘材料上，并且使用布线图案中的孔作为激光掩模从载体的侧面照射激光束，以在绝缘材料中形成通孔。 通孔和载体中的孔然后用导电浆料填充。 通过载体中与通孔的位置匹配的孔，导体层中的焊盘相对于通孔精确定位。 由此制造的多层电路板具有较低的电连接电阻和优异的安装性能，并具有改进的性能。 也可以实现其制造方法。
-
2.发明申请Method for manufacturing component built-in module, and component built-in module 失效组件内置模块的制造方法和组件内置模块公开(公告)号：US20070119617A1
公开(公告)日：2007-05-31
申请号：US10573717
申请日：2004-09-27
申请人： Yoshitake Hayashi , Masayoshi Koyama , Satoru Yuhaku , Kazuo Otani , Susumu Matsuoka , Seiichi Nakatani
发明人： Yoshitake Hayashi , Masayoshi Koyama , Satoru Yuhaku , Kazuo Otani , Susumu Matsuoka , Seiichi Nakatani
IPC分类号： H05K1/16
CPC分类号： H01L23/5389 , H01L21/4857 , H01L23/49833 , H01L23/5385 , H01L25/0657 , H01L2225/06517 , H01L2225/06541 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06582 , H01L2924/0002 , H05K1/186 , H05K1/187 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K3/462 , H05K2201/10378 , H05K2203/0191 , Y10T29/49165 , H01L2924/00
摘要： A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.
摘要翻译： 本发明的组件内置模块包括：第一布线图案; 安装在所述第一布线图案上的电子部件; 第二布线图案; 电气绝缘片，其中内置有电气部件，电绝缘片设置在第一布线图案和第二布线图案之间; 以及形成在穿过所述电绝缘片的通孔中的通孔导体，所述通孔导体电连接所述第一布线图案和所述第二布线图案。 通孔导体的侧面在通孔导体的轴线方向上形成连续的线。 因此，可以提供具有优异的电连接可靠性的组件内置模块。
-
公开(公告)号：US20060191715A1
公开(公告)日：2006-08-31
申请号：US11338771
申请日：2006-01-25
申请人： Masayoshi Koyama , Yoshitake Hayashi , Kazuo Otani
发明人： Masayoshi Koyama , Yoshitake Hayashi , Kazuo Otani
CPC分类号： H05K3/4614 , H05K3/0035 , H05K3/20 , H05K3/4069 , H05K3/4652 , H05K3/4658 , H05K2201/0376 , H05K2201/0394 , H05K2201/0969 , H05K2203/0278 , H05K2203/0554 , H05K2203/1453 , Y10T29/49165
摘要： Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.
摘要翻译： 当在可拆卸的载体上形成布线图案时，预先形成具有与通孔相同直径的孔。 具有布线图案的载体被接合在绝缘材料上，并且使用布线图案中的孔作为激光掩模从载体的侧面照射激光束，以在绝缘材料中形成通孔。 通孔和载体中的孔然后用导电浆料填充。 通过载体中与通孔的位置匹配的孔，导体层中的焊盘相对于通孔精确定位。 由此制造的多层电路板具有较低的电连接电阻和优异的安装性能，并具有改进的性能。 也可以实现其制造方法。
-
4.发明授权Method for manufacturing component built-in module, and component built-in module 失效组件内置模块的制造方法和组件内置模块公开(公告)号：US07488895B2
公开(公告)日：2009-02-10
申请号：US10573717
申请日：2004-09-27
申请人： Yoshitake Hayashi , Masayoshi Koyama , Satoru Yuhaku , Kazuo Otani , Susumu Matsuoka , Yasushi Taniguchi , Seiichi Nakatani
发明人： Yoshitake Hayashi , Masayoshi Koyama , Satoru Yuhaku , Kazuo Otani , Susumu Matsuoka , Yasushi Taniguchi , Seiichi Nakatani
IPC分类号： H05K1/03
CPC分类号： H01L23/5389 , H01L21/4857 , H01L23/49833 , H01L23/5385 , H01L25/0657 , H01L2225/06517 , H01L2225/06541 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06582 , H01L2924/0002 , H05K1/186 , H05K1/187 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K3/462 , H05K2201/10378 , H05K2203/0191 , Y10T29/49165 , H01L2924/00
摘要： A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.
摘要翻译： 本发明的组件内置模块包括：第一布线图案; 安装在所述第一布线图案上的电子部件; 第二布线图案; 电气绝缘片，其中内置有电气部件，电绝缘片设置在第一布线图案和第二布线图案之间; 以及形成在穿过所述电绝缘片的通孔中的通孔导体，所述通孔导体电连接所述第一布线图案和所述第二布线图案。 通孔导体的侧面在通孔导体的轴线方向上形成连续的线。 因此，可以提供具有优异的电连接可靠性的组件内置模块。
-
5.发明授权Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body 失效用于制造半导体安装体的方法和用于制造半导体安装体的装置公开(公告)号：US06613180B2
公开(公告)日：2003-09-02
申请号：US10114089
申请日：2002-04-01
申请人： Yoshitaka Sunagawa , Yoshitake Hayashi , Masayoshi Koyama , Yoshihiro Tomura , Toshiyuki Kojima , Osamu Shibata , Ryuichi Saito
发明人： Yoshitaka Sunagawa , Yoshitake Hayashi , Masayoshi Koyama , Yoshihiro Tomura , Toshiyuki Kojima , Osamu Shibata , Ryuichi Saito
IPC分类号： B32B3100
CPC分类号： H01L21/67132 , H01L21/50 , H01L21/563 , H01L24/75 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/75315 , H01L2224/7598 , H01L2924/00013 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/3025 , Y10T156/1089 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012
摘要： A method for fabricating a semiconductor-mounting body having at least one semiconductor device mounted on a substrate and a sealing resin set in the gap between the substrate and the semiconductor device, has a first step of setting a flexibly deformable sheet on a face of the semiconductor device not facing the substrate; and a second step of generating an air-pressure difference between the side where the semiconductor device is not present and the side where the semiconductor device is present on the basis of the sheet so that the air pressure at the side where the semiconductor device is not present becomes higher than the side where the semiconductor device is present and pressurizing the semiconductor device by the sheet after the first step.
摘要翻译： 一种制造半导体安装体的方法，其具有安装在基板上的至少一个半导体器件和设置在基板和半导体器件之间的间隙中的密封树脂，具有将柔性可变形薄片设置在半导体的表面上的第一步骤 设备不面向基板; 以及基于片材在半导体器件不存在的一侧和存在半导体器件的一侧之间产生气压差的第二步骤，使得半导体器件不存在的一侧的空气压力 变得高于存在半导体器件的一侧并且在第一步骤之后通过片材对半导体器件加压。
-
6.发明授权Head unit, droplet discharging apparatus, droplet discharging system, information processing apparatus, information processing method, status information notifying method, status information updating method, faulty position detecting method, and programs 失效头单元，液滴喷射装置，液滴喷射系统，信息处理装置，信息处理方法，状态信息通知方法，状态信息更新方法，故障位置检测方法和程序公开(公告)号：US08111426B2
公开(公告)日：2012-02-07
申请号：US11940774
申请日：2007-11-15
IPC分类号： H04N1/40
CPC分类号： B41J29/393
摘要： The present invention provides a droplet discharging apparatus including a discharge head for deflectively discharging droplets through one discharge port at a plurality of pixel areas in adaptive fashion. The discharge head is controlled to discharge droplets at an object. A storage unit stores status information about the discharge head. A communication unit communicates with an information processing apparatus located outside so as to transmit the status information to the information processing apparatus.
摘要翻译： 本发明提供了一种液滴喷射装置，包括一个排出头，用于以适应方式以多个像素区域的一个排出口偏转地排出液滴。 排放头被控制以在物体处排出液滴。 存储单元存储关于排出头的状态信息。 通信单元与位于外部的信息处理装置进行通信，以将状态信息发送到信息处理装置。
-
公开(公告)号：US5622935A
公开(公告)日：1997-04-22
申请号：US335411
申请日：1994-11-03
申请人： Masayoshi Koyama , Mikiko Takahashi , Kazuyuki Doi
发明人： Masayoshi Koyama , Mikiko Takahashi , Kazuyuki Doi
CPC分类号： C07K14/522 , A61K38/00
摘要： Pharmaceutical composition for preventing or treating bone fracture comprising as an active ingredient a platelet factor 4.The present composition can promote differentiation of osteoblasts so that they are effective for prophylaxis and treatment of such diseases requiring bone differentiation and proliferation as bone fracture and the like.
摘要翻译： 用于预防或治疗骨折的药物组合物，其包含作为活性成分的血小板因子4.本发明的组合物可以促进成骨细胞分化，使得它们有效预防和治疗需要骨分化和增殖的这种疾病作为骨折等。
-
公开(公告)号：US5545720A
公开(公告)日：1996-08-13
申请号：US414427
申请日：1995-03-31
申请人： Masayoshi Koyama , Mikiko Takahashi , Kazuyuki Doi
发明人： Masayoshi Koyama , Mikiko Takahashi , Kazuyuki Doi
IPC分类号： A61K38/00 , A61K38/22 , A61P43/00 , C07K1/20 , C07K1/22 , C07K14/47 , C07K14/50 , A61K35/14 , A61K38/16 , A61K38/18 , C07K14/475
摘要： A protein named PHBP-70 having a wound-healing activity which has a molecular weight of about 60-80 KDa by analysis with SDS-PAGE under reducing conditions and can be obtained from the blood of the fetus and neonates of mammals including human beings. The protein PHBP-70 is a novel protein having a fibroblast proliferating activity and thus it is useful as a wound-healing agent.
摘要翻译： 通过在还原条件下通过SDS-PAGE分析，具有伤口愈合活性的具有伤口愈合活性的蛋白质，其分子量为约60-80KDa，并且可以从包括人类在内的哺乳动物的胎儿和新生儿的血液中获得。 蛋白质PHBP-70是具有成纤维细胞增殖活性的新型蛋白质，因此可用作伤口愈合剂。
-
9.发明授权Head unit, droplet discharging apparatus, droplet discharging system, information processing apparatus, information processing method, status information notifying method, status information updating method, faulty position detecting method, and programs 失效头单元，液滴喷射装置，液滴喷射系统，信息处理装置，信息处理方法，状态信息通知方法，状态信息更新方法，故障位置检测方法和程序公开(公告)号：US08081345B2
公开(公告)日：2011-12-20
申请号：US11940787
申请日：2007-11-15
IPC分类号： H04N1/40
CPC分类号： B41J29/393
摘要： The present invention provides a droplet discharging apparatus including a discharge head for deflectively discharging droplets through one discharge port at a plurality of pixel areas in adaptive fashion. The discharge head is controlled to discharge droplets at an object. A storage unit stores status information about the discharge head. A communication unit communicates with an information processing apparatus located outside so as to transmit the status information to the information processing apparatus.
摘要翻译： 本发明提供了一种液滴喷射装置，包括一个排出头，用于以适应方式以多个像素区域的一个排出口偏转地排出液滴。 排放头被控制以在物体处排出液滴。 存储单元存储关于排出头的状态信息。 通信单元与位于外部的信息处理装置进行通信，以将状态信息发送到信息处理装置。
-
公开(公告)号：US07869084B2
公开(公告)日：2011-01-11
申请号：US11940637
申请日：2007-11-15
IPC分类号： H04N1/40
CPC分类号： B41J29/393
摘要： The present invention provides a droplet discharging apparatus including a discharge head for deflectively discharging droplets through one discharge port at a plurality of pixel areas in adaptive fashion. The discharge head is controlled to discharge droplets at an object. A storage unit stores status information about the discharge head. A communication unit communicates with an information processing apparatus located outside so as to transmit the status information to the information processing apparatus.
-
-
-
-
-
-
-
-
-
搜索结果
28 条记录 (耗时 0.024 秒)
