发明申请
- 专利标题: MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER CIRCUIT SUBSTRATE
- 专利标题(中): 多层电路基板制造方法及多层电路基板
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申请号: US11814698申请日: 2005-01-27
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公开(公告)号: US20090032285A1公开(公告)日: 2009-02-05
- 发明人: Yoji Ueda , Susumu Matsuoka , Rikiya Okimoto , Shozo Ochi , Satoru Tomekawa
- 申请人: Yoji Ueda , Susumu Matsuoka , Rikiya Okimoto , Shozo Ochi , Satoru Tomekawa
- 申请人地址: JP Osaka
- 专利权人: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人地址: JP Osaka
- 国际申请: PCT/JP2005/001136 WO 20050127
- 主分类号: H05K3/46
- IPC分类号: H05K3/46 ; H05K1/14 ; H05K1/00
摘要:
A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.
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