公开(公告)号：US06518514B2

公开(公告)日：2003-02-11

申请号：US09928869

申请日：2001-08-13

申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

IPC分类号： H01R1204

CPC分类号： H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

公开(公告)号：US06691409B2

公开(公告)日：2004-02-17

申请号：US10280964

申请日：2002-10-25

申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

IPC分类号： H01K300

CPC分类号： H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

摘要翻译： 电路板被构造成在布线层之间包括不少于两个布线层，用于电绝缘的绝缘体层和在绝缘体层的厚度方向上设置在绝缘体层中的内通孔导电构件， 用于布线层之间的电连接。 绝缘体层由包含有机树脂和热膨胀系数小于有机树脂的材料的复合材料制成，并且包括以所述顺序层压的表面部分，芯部分和表面部分， 表面部分具有高含量的有机树脂，芯部分的有机树脂含量低。 所述布线层具有与所述内通孔导电部件连接的台面部，所述接合部嵌入以与所述芯部大体接触，所述内通孔导电部件的厚度基本上 等于芯部的厚度。 根据该结构，将金属箔的一部分嵌入到绝缘体层中以与芯层接触。 因此，能够提供能够选择性地压缩导电材料的部分的电路基板，由此能够确保层之间的稳定的连接。

公开(公告)号：US07047629B2

公开(公告)日：2006-05-23

申请号：US10686576

申请日：2003-10-17

申请人： Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

发明人： Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

IPC分类号： H05K3/20

CPC分类号： H05K3/4069 ,  H05K3/282 ,  H05K3/389 ,  H05K3/4614 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49171 ,  Y10T428/24917

摘要： A circuit board manufacturing method including the steps of forming a through hole on an insulator layer and then filling the through hole with a conductive paste; dispersing and forming a protective agent on an adhesion surface of a conductor foil so as to include adhesion surface regions where the protective agent does not exist; sticking the conductor foil to the insulator layer; and abutting a plurality of conductive powders constituting the conductive paste and the conductor foil to each other through the adhesion surface regions by means of heating and pressurizing the insulator layer and conductor foil.

摘要翻译： 一种电路板制造方法，包括以下步骤：在绝缘体层上形成通孔，然后用导电浆料填充所述通孔; 在导体箔的粘合表面上分散形成保护剂，以包括不存在保护剂的粘合表面区域; 将导体箔粘附到绝缘体层上; 并且通过加热和加压绝缘体层和导体箔，通过粘合表面区域将构成导电浆料和导体箔的多个导电粉末彼此邻接。

公开(公告)号：US06713688B2

公开(公告)日：2004-03-30

申请号：US09986453

申请日：2001-11-08

申请人： Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

发明人： Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

IPC分类号： H05K1204

CPC分类号： H05K3/4069 ,  H05K3/282 ,  H05K3/389 ,  H05K3/4614 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49171 ,  Y10T428/24917

摘要： A protective agent 6 for protecting a wiring 1 is dispersed and placed in mottle-like on an interface between a via 3 and a wiring layer 2. Then, each dimension of interface regions 7 where the protective agent 6 does not exist is set to such a size that a plurality of conductive powders 4 constituting the via 3 can abutted on the wiring layer 2. Therefore, the plurality of conductive powders 4 and the wiring layer 2 are abutted each other in each interface region 7 where the protective agent 6 does not exist to electrically connect, thereby stabilizing the connection resistance for a prolonged period of time.

摘要翻译： 用于保护布线1的保护剂6在通孔3和布线层2之间的界面上分散并放置成斑驳状。然后，将不存在保护剂6的界面区域7的每个尺寸设定为 构成通孔3的多个导电粉末4可以与布线层2抵接的尺寸。因此，在保护剂6不是的各界面区域7中，多个导电粉末4和布线层2彼此抵接 存在电连接，从而稳定连接电阻长时间。

公开(公告)号：US07155820B2

公开(公告)日：2007-01-02

申请号：US10695302

申请日：2003-10-27

申请人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

发明人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

IPC分类号： H01K3/10 ,  H01R12/04

CPC分类号： H05K3/4069 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole with a conductor, peeling mold-releasing films, compressing the dielectric substrate and forming metal foils. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity.

摘要翻译： 本发明提供一种制造印刷电路板的方法，其包括制备电介质基板，电介质基板的涂层表面，用导体填充通孔，剥离脱模膜，压缩电介质基板和形成金属箔。 电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。 此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。

公开(公告)号：US06753483B2

公开(公告)日：2004-06-22

申请号：US09879385

申请日：2001-06-12

申请人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

发明人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

IPC分类号： H01R1204

CPC分类号： H05K3/4069 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

摘要翻译： 本发明提供了一种印刷电路板，其包括具有沿厚度方向形成的通孔的电介质基板，并且包含导电填料的导体填充在通孔中。 电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。 此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。 本发明还提供一种制造这种印刷电路板的方法。

公开(公告)号：US06745464B2

公开(公告)日：2004-06-08

申请号：US10401607

申请日：2003-03-31

申请人： Fumio Echigo ,  Hideki Higashitani ,  Daizo Andoh ,  Noritake Fukuda ,  Yasuhiro Nakatani ,  Tadashi Nakamura

发明人： Fumio Echigo ,  Hideki Higashitani ,  Daizo Andoh ,  Noritake Fukuda ,  Yasuhiro Nakatani ,  Tadashi Nakamura

IPC分类号： H01K310

CPC分类号： H05K3/4069 ,  H05K3/0032 ,  H05K3/20 ,  H05K3/386 ,  H05K2201/0112 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49172

摘要： Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.

摘要翻译： 通过施加和干燥包括紫外线吸收剂的树脂清漆304在具有粘合剂层302的基板的两侧上形成可移除掩模膜303，并且通过使用第三谐波YAG固体激光器形成细小通孔306 具有比紫外线范围内的波长相对较短波长的光可以减少通过层压方法形成可去除掩模膜的这种残留应变的效果以及更细孔钻孔 与使用具有较长波长的二氧化碳气体激光器的常规实施例相比可以进行。

公开(公告)号：US06546624B2

公开(公告)日：2003-04-15

申请号：US09734593

申请日：2000-12-13

申请人： Fumio Echigo ,  Hideki Higashitani ,  Daizo Andoh ,  Noritake Fukuda ,  Yasuhiro Nakatani ,  Tadashi Nakamura

发明人： Fumio Echigo ,  Hideki Higashitani ,  Daizo Andoh ,  Noritake Fukuda ,  Yasuhiro Nakatani ,  Tadashi Nakamura

IPC分类号： H01K310

CPC分类号： H05K3/4069 ,  H05K3/0032 ,  H05K3/20 ,  H05K3/386 ,  H05K2201/0112 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49172

摘要： Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.

公开(公告)号：US06734375B2

公开(公告)日：2004-05-11

申请号：US09956205

申请日：2001-09-18

申请人： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

发明人： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

IPC分类号： H05K111

CPC分类号： H05K3/4626 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

摘要： A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a conductive particle and a resin. In the electrically insulating layer, a porous sheet is provided a resin sheet at least one surface, and the porous sheet is not impregnated with a resin at least at a central portion. A through hole penetrating the electrically insulating layer in the direction of the thickness of the electrically insulating layer is filled with a conductive paste including a conductive particle and a resin, and pores that are present inside the porous sheet are filled with laminated resin. The average hole diameter of the pores inside the porous sheet may be smaller than the average particle size of the conductive particle. Thereby, it is possible to make the insulating layer of the circuit board securing the interlayer electrically connection by an inner via hole including a conductive paste to be homogenized and ultra-thin and improve the reliability of the connection of the inner via hole.

摘要翻译： 包括所需数量的电绝缘层和交替层叠的布线层的电路板，以及用于通过压缩和硬化包括导电颗粒和树脂的导电膏来固定布线层之间的电连接的内通孔。 在电绝缘层中，多孔片材至少在一个表面上设置有树脂片，多孔片材至少在中心部分不浸渍树脂。 在电绝缘层的厚度方向贯通电绝缘层的贯通孔填充有包含导电性粒子和树脂的导电性糊剂，并且在多孔质片材内存在的孔填充有层叠树脂。 多孔片内的孔的平均孔径可以小于导电性粒子的平均粒径。 由此，可以使电路基板的绝缘层通过包含导电性糊剂的内部通路孔进行层间电连接，使其均匀化，超薄化，提高内部通孔连接的可靠性。

公开(公告)号：US06916706B2

公开(公告)日：2005-07-12

申请号：US10833817

申请日：2004-04-27

申请人： Fumio Echigo ,  Tadashi Nakamura ,  Daizo Andoh

发明人： Fumio Echigo ,  Tadashi Nakamura ,  Daizo Andoh

IPC分类号： H01L21/02 ,  H05K1/14 ,  H05K1/16 ,  H05K3/40 ,  H05K3/42 ,  H01L21/8242

CPC分类号： H05K1/162 ,  H01L28/60 ,  H05K1/141 ,  H05K3/4069 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09581

摘要： A capacitor sheet includes a laminate sheet, interface-connection feedthrough conductors for electrically connecting faces of the laminate sheet, and capacitor-connection feedthrough conductors. The laminate sheet has at least one laminate which is composed of a power source layer electrode, a grounding layer electrode, and a dielectric layer interposed between the power source layer electrode and the grounding layer electrode. The interface-connection feedthrough conductors are formed in through holes that pass through the dielectric layer, the power source layer electrode, and the grounding layer electrode, and are insulated by insulation walls from the power source layer electrode and the grounding layer electrode provided inside. The capacitor-connection feedthrough conductors are formed in regions where only either the power source layer electrode or the grounding layer electrode is provided, and are connected electrically with either the power source layer electrode or the grounding layer electrode. This configuration makes the electric connection for employing the capacitors and the electric connection between faces of the sheet independent from each other. Thus, it is possible to provide a capacitor sheet in which the adverse effects of inductances of vias are minimized.

摘要翻译： 电容器片包括层压片，用于电连接层压片的表面的接口连接馈通导体和电容器连接馈通导体。 层叠片具有至少一层由电源层电极，接地层电极和插在电源层电极和接地层电极之间的电介质层构成的层叠体。 界面连接馈通导体形成在穿过电介质层，电源层电极和接地层电极的通孔中，并且由设置在内部的电源层电极和接地层电极的绝缘壁绝缘。 电容器连接馈通导体形成在仅设置电源层电极或接地层电极的区域中，并且与电源层电极或接地层电极电连接。 这种构造使得用于采用电容器的电连接和片材的面之间的电连接彼此独立。 因此，可以提供一种电容器片，其中通孔的电感的不利影响被最小化。