公开(公告)号：US07155820B2

公开(公告)日：2007-01-02

申请号：US10695302

申请日：2003-10-27

申请人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

发明人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

IPC分类号： H01K3/10 ,  H01R12/04

CPC分类号： H05K3/4069 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole with a conductor, peeling mold-releasing films, compressing the dielectric substrate and forming metal foils. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity.

摘要翻译： 本发明提供一种制造印刷电路板的方法，其包括制备电介质基板，电介质基板的涂层表面，用导体填充通孔，剥离脱模膜，压缩电介质基板和形成金属箔。 电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。 此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。

公开(公告)号：US06753483B2

公开(公告)日：2004-06-22

申请号：US09879385

申请日：2001-06-12

申请人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

发明人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

IPC分类号： H01R1204

CPC分类号： H05K3/4069 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

摘要翻译： 本发明提供了一种印刷电路板，其包括具有沿厚度方向形成的通孔的电介质基板，并且包含导电填料的导体填充在通孔中。 电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。 此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。 本发明还提供一种制造这种印刷电路板的方法。

公开(公告)号：US20080185178A1

公开(公告)日：2008-08-07

申请号：US12011725

申请日：2008-01-29

申请人： Rikiya Okimoto ,  Yoji Ueda ,  Satoru Tomekawa ,  Tousaku Nishiyama ,  Shozo Ochi

发明人： Rikiya Okimoto ,  Yoji Ueda ,  Satoru Tomekawa ,  Tousaku Nishiyama ,  Shozo Ochi

IPC分类号： H05K1/11

CPC分类号： H01L23/49838 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/113 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A circuit board of the present invention, includes: an electrical insulating layer including at least one layer of electrical insulating base; and a conductive portion formed in a via hole provided in the electrical insulating base. A land for mounting only is disposed on at least one surface of the electrical insulating base that is arranged at an outermost layer. According to a method for manufacturing a circuit board of the present invention, includes the steps of: forming a via hole in an electrical insulating base; filling the via hole with a conductive paste; laminating a metal foil or a releasing sheet on the electrical insulating base, and placing a jig for pressing above and below the lamination, followed by hot-pressing so as to apply heat and pressure thereto, so as to form a conductive portion made of the conductive paste in the via hole; and forming a land for mounting only on at least one surface of the electrical insulating base that is arranged at an outermost layer. Thereby, a circuit board can be provided, having a land for mounting formed with a narrow pitch.

摘要翻译： 本发明的电路板包括：电绝缘层，其包括至少一层电绝缘基底; 以及形成在设置在电绝缘基底中的通孔中的导电部分。 仅用于安装的地面设置在布置在最外层的电绝缘基底的至少一个表面上。 根据本发明的电路基板的制造方法，其特征在于，包括以下步骤：在电绝缘基体中形成通孔; 用导电膏填充通孔; 在电绝缘基底上层叠金属箔或脱模片，并且在层压体的上下配置压入夹具，然后进行热压，以对其进行加热和加压，从而形成由 导电膏在通孔中; 并且形成用于仅安装在布置在最外层的电绝缘基底的至少一个表面上的平台。 由此，可以提供具有窄间距形成的用于安装的台面的电路板。

公开(公告)号：US20050124197A1

公开(公告)日：2005-06-09

申请号：US11003680

申请日：2004-12-03

申请人： Rikiya Okimoto ,  Yoji Ueda ,  Satoru Tomekawa ,  Tousaku Nishiyama ,  Shozo Ochi

发明人： Rikiya Okimoto ,  Yoji Ueda ,  Satoru Tomekawa ,  Tousaku Nishiyama ,  Shozo Ochi

IPC分类号： H01L23/498 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H01R13/62

CPC分类号： H01L23/49838 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/113 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A circuit board of the present invention, includes: an electrical insulating layer including at least one layer of electrical insulating base; and a conductive portion formed in a via hole provided in the electrical insulating base. A land for mounting only is disposed on at least one surface of the electrical insulating base that is arranged at an outermost layer. According to a method for manufacturing a circuit board of the present invention, includes the steps of: forming a via hole in an electrical insulating base; filling the via hole with a conductive paste; laminating a metal foil or a releasing sheet on the electrical insulating base, and placing a jig for pressing above and below the lamination, followed by hot-pressing so as to apply heat and pressure thereto, so as to form a conductive portion made of the conductive paste in the via hole; and forming a land for mounting only on at least one surface of the electrical insulating base that is arranged at an outermost layer. Thereby, a circuit board can be provided, having a land for mounting formed with a narrow pitch.

摘要翻译： 本发明的电路板包括：电绝缘层，其包括至少一层电绝缘基底; 以及形成在设置在电绝缘基底中的通孔中的导电部分。 仅用于安装的地面设置在布置在最外层的电绝缘基底的至少一个表面上。 根据本发明的电路基板的制造方法，其特征在于，包括以下步骤：在电绝缘基体中形成通孔; 用导电膏填充通孔; 在电绝缘基底上层叠金属箔或脱模片，并且在层压体的上下配置压入夹具，然后进行热压，以对其进行加热和加压，从而形成由 导电膏在通孔中; 并且形成用于仅安装在布置在最外层的电绝缘基底的至少一个表面上的平台。 由此，可以提供具有窄间距形成的用于安装的台面的电路板。

公开(公告)号：US06459046B1

公开(公告)日：2002-10-01

申请号：US09919319

申请日：2001-07-31

申请人： Shozo Ochi ,  Fumio Echigo ,  Yoji Ueda

发明人： Shozo Ochi ,  Fumio Echigo ,  Yoji Ueda

IPC分类号： H05K103

CPC分类号： H05K3/4069 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/12028 ,  Y10T428/12528

摘要： A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor. By adjusting the thickness of the resin layers formed on both sides of the resin holder such as a glass cloth, it is possible to ensure high reliability when electrically connecting circuit boards using an electrically conductive paste as the electrical conductor.

公开(公告)号：US06799369B2

公开(公告)日：2004-10-05

申请号：US10224031

申请日：2002-08-19

申请人： Shozo Ochi ,  Fumio Echigo ,  Yoji Ueda

发明人： Shozo Ochi ,  Fumio Echigo ,  Yoji Ueda

IPC分类号： H01K310

CPC分类号： H05K3/4069 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/12028 ,  Y10T428/12528

摘要： A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor. By adjusting the thickness of the resin layers formed on both sides of the resin holder such as a glass cloth, it is possible to ensure high reliability when electrically connecting circuit boards using an electrically conductive paste as the electrical conductor.

摘要翻译： 本发明的印刷电路板由电绝缘基材形成，所述电绝缘基材具有沿着所述电绝缘基材的厚度方向形成并且填充有电导体的通孔; 电绝缘基材包括通过用树脂浸渍保持器形成的芯层和形成在芯层两侧的树脂层; 以及在所述电绝缘基材的两面形成为规定图案并通过所述电导体彼此电连接的布线层。 布线层嵌入至少一个树脂层中。 两侧的树脂层的厚度不同，树脂层的薄层的厚度等于或小于电导体中所含的导电填料的平均粒径。 通过调节玻璃布等树脂保持架的两侧形成的树脂层的厚度，可以确保使用导电性糊料作为导电体的电路基板电连接时的高可靠性。

公开(公告)号：US20090032285A1

公开(公告)日：2009-02-05

申请号：US11814698

申请日：2005-01-27

申请人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

发明人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

IPC分类号： H05K3/46 ,  H05K1/14 ,  H05K1/00

CPC分类号： H05K1/024 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0355 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/1461 ,  Y10T428/24843

摘要： A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.

摘要翻译： 一种制造多层电路板的方法包括以下步骤：通过在具有接地链路的双面电路板和在其两个表面上图案化的信号布线的至少一个表面层压预定厚度的预浸料来制造层压体 ; 并且对层压体施加热和压力，并且完成在双面电路板和预浸料坯之间的边界处将信号布线放置在预浸料坯内部的层状结构，其中预定厚度的预浸料片材用于完成 使得双面电路板的预浸料坯的厚度小于与双面电路板不相对的一侧上的预浸料坯的表面与布置在预浸料坯内部的信号线之间的距离。

公开(公告)号：US07775446B2

公开(公告)日：2010-08-17

申请号：US12160541

申请日：2007-02-26

申请人： Shozo Ochi ,  Osamu Uchida ,  Shigeaki Sakatani ,  Daisuke Sakurai ,  Masato Mori ,  Hiroshi Sakurai ,  Hidenobu Nishikawa

发明人： Shozo Ochi ,  Osamu Uchida ,  Shigeaki Sakatani ,  Daisuke Sakurai ,  Masato Mori ,  Hiroshi Sakurai ,  Hidenobu Nishikawa

IPC分类号： G06K19/06 ,  H01Q1/00 ,  H01Q1/36

CPC分类号： H01Q1/22 ,  G06K19/07732 ,  G06K19/07749 ,  H01Q7/06 ,  H05K1/0218 ,  H05K1/144 ,  H05K1/148 ,  H05K1/16 ,  H05K2201/043 ,  H05K2201/086 ,  Y10T29/4913

摘要： Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrode formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.

摘要翻译： 卡类型信息装置包括具有安装在布线板的第一面上的电子部件的布线图案和天线连接电极的布线板，天线板天线阵列与天线端子电极形成在天线板的第一面上，磁性材料放置 在布线板和天线板之间，用于将天线连接电极耦合到天线端子电极的柔性布线板和用于容纳布线板，天线板，磁性材料和柔性布线板的壳体。 接线板和天线板由同一个绝缘母板制成。

公开(公告)号：US20100052996A1

公开(公告)日：2010-03-04

申请号：US11993734

申请日：2006-07-10

申请人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi

发明人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi

IPC分类号： H01Q7/06 ,  H01Q1/24

CPC分类号： H05K1/16 ,  G06K19/07732 ,  G06K19/07767 ,  H01Q1/2275 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/147 ,  H05K1/181 ,  H05K2201/056 ,  H05K2201/10674

摘要： A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element.

摘要翻译： 具有内置天线的存储介质包括其上放置有半导体元件的电路板，夹持半导体元件和电路板的第一和第二磁性层以及设置在第一和第二磁性层上的第一和第二天线线圈。 第一和第二天线线圈并联连接在柔性片上。 第一和第二天线线圈分别在第一和第二磁性层的侧面折叠并电连接到半导体元件。

公开(公告)号：US08025237B2

公开(公告)日：2011-09-27

申请号：US12161185

申请日：2006-11-08

申请人： Shozo Ochi ,  Norihito Tsukahara ,  Yutaka Nakamura ,  Hirohisa Tanaka

发明人： Shozo Ochi ,  Norihito Tsukahara ,  Yutaka Nakamura ,  Hirohisa Tanaka

IPC分类号： G06K19/06

CPC分类号： H01Q1/36 ,  G06K19/07732 ,  G06K19/07749 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/15192 ,  H01L2924/3025 ,  H01Q1/2275 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q7/06 ,  H01Q9/27 ,  H01Q21/0025 ,  H05K1/16 ,  H05K2201/086 ,  H01L2224/0401

摘要： An antenna built-in module which incorporates an antenna, is thin and excellent in antenna characteristics, a card type information device and a method for manufacturing the same are provided. A wiring board (110) which has a wiring pattern (120) and in which an electronic component is mounted on at least one surface thereof, a magnetic substance (160) embedded in the other surface of the wiring board (110), an antenna pattern (170) provided on the magnetic substance (160), the wiring pattern (120) of the wiring board (110) and the antenna terminal electrode of the antenna pattern (170) are connected by a conductive via (200).

摘要翻译： 一种内置天线的天线内置模块，其天线特性薄型化，卡型信息装置及其制造方法。 一种布线板（110），其具有布线图案（120），并且其电子部件安装在其至少一个表面上，嵌入在所述布线板（110）的另一个表面中的磁性物质（160），天线 设置在磁性物质（160）上的图案（170），布线板（110）的布线图案（120）和天线图案（170）的天线端子电极通过导电通孔（200）连接。