Method for manufacturing printed circuit board
    1.
    发明授权
    Method for manufacturing printed circuit board 有权
    印刷电路板制造方法

    公开(公告)号:US07155820B2

    公开(公告)日:2007-01-02

    申请号:US10695302

    申请日:2003-10-27

    IPC分类号: H01K3/10 H01R12/04

    摘要: The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole with a conductor, peeling mold-releasing films, compressing the dielectric substrate and forming metal foils. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity.

    摘要翻译: 本发明提供一种制造印刷电路板的方法,其包括制备电介质基板,电介质基板的涂层表面,用导体填充通孔,剥离脱模膜,压缩电介质基板和形成金属箔。 电介质基板在两表面上具有图案化的布线层,并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成,并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此,印刷电路板整体上具有改善的耐湿性,并且还具有优异的连接可靠性和修复电阻。 此外,印刷电路板的电介质基板具有改善的机械强度,例如弯曲刚度。

    Printed circuit board and method of manufacturing the same
    2.
    发明授权
    Printed circuit board and method of manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号:US06753483B2

    公开(公告)日:2004-06-22

    申请号:US09879385

    申请日:2001-06-12

    IPC分类号: H01R1204

    摘要: The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

    摘要翻译: 本发明提供了一种印刷电路板,其包括具有沿厚度方向形成的通孔的电介质基板,并且包含导电填料的导体填充在通孔中。 电介质基板在两表面上具有图案化的布线层,并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成,并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此,印刷电路板整体上具有改善的耐湿性,并且还具有优异的连接可靠性和修复电阻。 此外,印刷电路板的电介质基板具有改善的机械强度,例如弯曲刚度。 本发明还提供一种制造这种印刷电路板的方法。

    Printed circuit board and method for producing the same

    公开(公告)号:US06459046B1

    公开(公告)日:2002-10-01

    申请号:US09919319

    申请日:2001-07-31

    IPC分类号: H05K103

    摘要: A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor. By adjusting the thickness of the resin layers formed on both sides of the resin holder such as a glass cloth, it is possible to ensure high reliability when electrically connecting circuit boards using an electrically conductive paste as the electrical conductor.

    Printed circuit board and method for producing the same
    6.
    发明授权
    Printed circuit board and method for producing the same 有权
    印刷电路板及其制造方法

    公开(公告)号:US06799369B2

    公开(公告)日:2004-10-05

    申请号:US10224031

    申请日:2002-08-19

    IPC分类号: H01K310

    摘要: A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor. By adjusting the thickness of the resin layers formed on both sides of the resin holder such as a glass cloth, it is possible to ensure high reliability when electrically connecting circuit boards using an electrically conductive paste as the electrical conductor.

    摘要翻译: 本发明的印刷电路板由电绝缘基材形成,所述电绝缘基材具有沿着所述电绝缘基材的厚度方向形成并且填充有电导体的通孔; 电绝缘基材包括通过用树脂浸渍保持器形成的芯层和形成在芯层两侧的树脂层; 以及在所述电绝缘基材的两面形成为规定图案并通过所述电导体彼此电连接的布线层。 布线层嵌入至少一个树脂层中。 两侧的树脂层的厚度不同,树脂层的薄层的厚度等于或小于电导体中所含的导电填料的平均粒径。 通过调节玻璃布等树脂保持架的两侧形成的树脂层的厚度,可以确保使用导电性糊料作为导电体的电路基板电连接时的高可靠性。

    MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER CIRCUIT SUBSTRATE
    7.
    发明申请
    MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER CIRCUIT SUBSTRATE 审中-公开
    多层电路基板制造方法及多层电路基板

    公开(公告)号:US20090032285A1

    公开(公告)日:2009-02-05

    申请号:US11814698

    申请日:2005-01-27

    IPC分类号: H05K3/46 H05K1/14 H05K1/00

    摘要: A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.

    摘要翻译: 一种制造多层电路板的方法包括以下步骤:通过在具有接地链路的双面电路板和在其两个表面上图案化的信号布线的至少一个表面层压预定厚度的预浸料来制造层压体 ; 并且对层压体施加热和压力,并且完成在双面电路板和预浸料坯之间的边界处将信号布线放置在预浸料坯内部的层状结构,其中预定厚度的预浸料片材用于完成 使得双面电路板的预浸料坯的厚度小于与双面电路板不相对的一侧上的预浸料坯的表面与布置在预浸料坯内部的信号线之间的距离。

    STORAGE MEDIUM WITH BUILT-IN ANTENNA
    9.
    发明申请
    STORAGE MEDIUM WITH BUILT-IN ANTENNA 失效
    存储天线与内置天线

    公开(公告)号:US20100052996A1

    公开(公告)日:2010-03-04

    申请号:US11993734

    申请日:2006-07-10

    IPC分类号: H01Q7/06 H01Q1/24

    摘要: A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element.

    摘要翻译: 具有内置天线的存储介质包括其上放置有半导体元件的电路板,夹持半导体元件和电路板的第一和第二磁性层以及设置在第一和第二磁性层上的第一和第二天线线圈。 第一和第二天线线圈并联连接在柔性片上。 第一和第二天线线圈分别在第一和第二磁性层的侧面折叠并电连接到半导体元件。