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    STORAGE MEDIUM WITH BUILT-IN ANTENNA
    1.
    发明申请
    STORAGE MEDIUM WITH BUILT-IN ANTENNA 失效
    存储天线与内置天线

    公开(公告)号：US20100052996A1

    公开(公告)日：2010-03-04

    申请号：US11993734

    申请日：2006-07-10

    申请人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi

    发明人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi

    IPC分类号： H01Q7/06 ,  H01Q1/24

    CPC分类号： H05K1/16 ,  G06K19/07732 ,  G06K19/07767 ,  H01Q1/2275 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/147 ,  H05K1/181 ,  H05K2201/056 ,  H05K2201/10674

    摘要： A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element.

    摘要翻译： 具有内置天线的存储介质包括其上放置有半导体元件的电路板，夹持半导体元件和电路板的第一和第二磁性层以及设置在第一和第二磁性层上的第一和第二天线线圈。 第一和第二天线线圈并联连接在柔性片上。 第一和第二天线线圈分别在第一和第二磁性层的侧面折叠并电连接到半导体元件。

    Semiconductor memory module having built-in antenna
    2.
    发明授权
    Semiconductor memory module having built-in antenna 失效
    具有内置天线的半导体存储模块

    公开(公告)号：US07471260B2

    公开(公告)日：2008-12-30

    申请号：US11793301

    申请日：2006-02-02

    申请人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi ,  Hidenobu Nishikawa ,  Masato Hirano

    发明人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi ,  Hidenobu Nishikawa ,  Masato Hirano

    IPC分类号： H01Q1/36

    CPC分类号： H01Q1/2275 ,  H01L23/49855 ,  H01L25/0652 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q7/00

    摘要： A semiconductor memory module formed of a mounted module (12) having a semiconductor memory device (16) and a control semiconductor device (18), a circuit board (14) which contains connection terminal (20) coupled with the control semiconductor device (18) and disposed so that it is exposed from the surface of outer case (42), and an antenna connection terminal electrode (22) disposed in the inside of outer case (42); and an antenna module (24) having a sheet board (26) which includes an antenna (28) disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer (30) of magnetic substance disposed on the other surface, and an antenna terminal electrode (38) disposed on the one or the other surface. The antenna module (24) is overlaid on the mounted module (12), and the antenna connection terminal electrode (22) is connected with the antenna terminal electrode (38).

    摘要翻译： 一种由具有半导体存储器件（16）和控制半导体器件（18）的安装模块（12）形成的半导体存储器模块，包含与控制半导体器件（18）耦合的连接端子（20）的电路板（14） ）并且被设置成从外壳（42）的表面露出，以及设置在外壳（42）内部的天线连接端子电极（22）。 以及具有片材板（26）的天线模块（24），所述片材板（26）包括设置在沿着所述边缘的所述边缘附近的一个表面上的天线（28），设置在另一个表面上的磁性物质层 ，以及设置在一个或另一个表面上的天线端子电极（38）。 天线模块（24）重叠在安装的模块（12）上，天线连接端子电极（22）与天线端子电极（38）连接。

    Semiconductor Memory Module Having Built-In Antenna
    4.
    发明申请
    Semiconductor Memory Module Having Built-In Antenna 失效
    具有内置天线的半导体存储模块

    公开(公告)号：US20080111756A1

    公开(公告)日：2008-05-15

    申请号：US11793301

    申请日：2006-02-02

    申请人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi ,  Hidenobu Nishikawa ,  Masato Hirano

    发明人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi ,  Hidenobu Nishikawa ,  Masato Hirano

    IPC分类号： H01Q7/00 ,  H01Q1/38 ,  H01Q1/00

    CPC分类号： H01Q1/2275 ,  H01L23/49855 ,  H01L25/0652 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q7/00

    摘要： A semiconductor memory module formed of a mounted module (12) having a semiconductor memory device (16) and a control semiconductor device (18), a circuit board (14) which contains connection terminal (20) coupled with the control semiconductor device (18) and disposed so that it is exposed from the surface of outer case (42), and an antenna connection terminal electrode (22) disposed in the inside of outer case (42); and an antenna module (24) having a sheet board (26) which includes an antenna (28) disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer (30) of magnetic substance disposed on the other surface, and an antenna terminal electrode (38) disposed on the one or the other surface. The antenna module (24) is overlaid on the mounted module (12), and the antenna connection terminal electrode (22) is connected with the antenna terminal electrode (38).

    摘要翻译： 一种由具有半导体存储器件（16）和控制半导体器件（18）的安装模块（12）形成的半导体存储器模块，包含与控制半导体器件（18）耦合的连接端子（20）的电路板（14） ）并且被设置成从外壳（42）的表面露出，以及设置在外壳（42）内部的天线连接端子电极（22）。 以及具有片材板（26）的天线模块（24），所述片材板（26）包括设置在沿着所述边缘的所述边缘附近的一个表面上的天线（28），设置在另一个表面上的磁性物质层 ，以及设置在一个或另一个表面上的天线端子电极（38）。 天线模块（24）重叠在安装的模块（12）上，天线连接端子电极（22）与天线端子电极（38）连接。

    Printed circuit board and method for producing the same
    8.
    发明授权
    Printed circuit board and method for producing the same 有权

    公开(公告)号：US06459046B1

    公开(公告)日：2002-10-01

    申请号：US09919319

    申请日：2001-07-31

    申请人： Shozo Ochi ,  Fumio Echigo ,  Yoji Ueda

    发明人： Shozo Ochi ,  Fumio Echigo ,  Yoji Ueda

    IPC分类号： H05K103

    CPC分类号： H05K3/4069 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/12028 ,  Y10T428/12528

    摘要： A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor. By adjusting the thickness of the resin layers formed on both sides of the resin holder such as a glass cloth, it is possible to ensure high reliability when electrically connecting circuit boards using an electrically conductive paste as the electrical conductor.

    Printed circuit board and method of manufacturing the same
    10.
    发明授权
    Printed circuit board and method of manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US06753483B2

    公开(公告)日：2004-06-22

    申请号：US09879385

    申请日：2001-06-12

    申请人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

    发明人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

    IPC分类号： H01R1204

    CPC分类号： H05K3/4069 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

    摘要： The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

    摘要翻译： 本发明提供了一种印刷电路板，其包括具有沿厚度方向形成的通孔的电介质基板，并且包含导电填料的导体填充在通孔中。 电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。 此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。 本发明还提供一种制造这种印刷电路板的方法。